Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
04/2004
04/27/2004US6726535 Method for preventing localized Cu corrosion during CMP
04/27/2004US6726529 Low temperature chemical mechanical polishing of dielectric materials
04/22/2004US20040077293 Method and apparatus for ultrasonic machining
04/22/2004US20040077292 Real-time polishing pad stiffness control using magnetically controllable fluid
04/22/2004DE10247130A1 Method of producing a connecting rod especially for a combustion engine involves a first and second honing operation
04/21/2004EP1409198A1 System and method for ophthalmic lens manufacture
04/21/2004EP0918595B1 Improvements relating to grinding methods
04/21/2004CN1491146A Chemical mechanical machining and surface finishing
04/20/2004US6722954 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer
04/20/2004US6722952 Abrasive article suitable for abrading glass and glass ceramic workpieces
04/15/2004WO2004030867A1 Apparatus and method for forming a spiral wound abrasive article, and the resulting article
04/15/2004US20040072512 Polishing apparatus
04/15/2004US20040072509 For belts/sleeves/tubes for woodworking
04/14/2004EP1407852A2 Process for machining axial blade slots in turbine disks for jet engines
04/14/2004EP1303380A4 Micro-burnishing apparatus using ultrasonic vibration
04/14/2004CN1488469A Light conducting board processing method
04/13/2004US6719615 Versatile wafer refining
04/08/2004WO2004029310A2 Molten braze-coated superabrasive particles and associated methods
04/08/2004WO2004028745A1 Polishing pad for planarization
04/08/2004WO2004028739A1 Method and device for creating internal compression stresses within the surface of workpieces
04/08/2004US20040064944 Process for machining axial blade slots in turbine disks for jet engines
04/07/2004EP1404902A1 High surface quality gan wafer and method of fabricating same
04/07/2004CN1487566A Semiconductor chip processing method including back surface lapping
04/07/2004CN1486821A Magnetic rheologic polishing head in electromagnetic mode
04/07/2004CN1144640C Method for grinding external tooth gear and grinding apparatus
04/06/2004US6715318 Glass substrate for information recording media and manufacturing method thereof
04/01/2004DE10243415A1 Verfahren zur Erzeugung von Druckeigenspannungen in der Oberfläche von Werkstücken A method for generating internal compressive stress in the surface of workpieces
03/2004
03/31/2004EP1200228B1 Improvement in and relating to edge grinding
03/31/2004CN1486487A Processing method and apparatus of hard disk medium surface in such operations as dynamic electronic test
03/31/2004CN1485888A Magma flow control method and system utilizing compound control mode
03/30/2004US6711829 Method for measuring work portion and machining method
03/25/2004US20040058622 Polish cleaning apparatus and method in manufacture of HGA
03/24/2004EP1399294A1 End point detection system for chemical mechanical polishing applications
03/18/2004US20040053564 Grinding water tank unit for eyeglass lens processing and eyeglass lens processing apparatus having the same
03/18/2004US20040051258 Clamping assembly
03/18/2004DE10333810A1 Verfahren zum Bearbeiten eines Halbleiterwafers einschließlich Schleifen der Rückseite A method of processing a semiconductor wafer including grinding the back
03/18/2004DE10240783A1 Verfahren zum Herstellen von optischen Linsen A method for making optical lenses
03/16/2004US6705010 Method and apparatus for reducing the force required to insert a seal in a cavity
03/11/2004WO2004020148A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/11/2004WO2004020144A1 Apparatus for cleaning, deburring and polishing parts in magnetic field
03/11/2004US20040048556 Method of grinding half toroidal CVT disk
03/10/2004CN1481293A Method for smoothing surface of gas turbine blade
03/10/2004CN1480992A Technique for precision finishing two side of plane wafer in large size
03/10/2004CN1480991A Grinding mat capable of showing abradability automatically and its manufacturing method
03/10/2004CN1480296A Processing method for high precision grinding metal piece
03/09/2004US6703318 Method of planarizing a semiconductor die
03/09/2004US6702652 Cracking prevention
03/04/2004WO2004019388A1 Method for fabricating semiconductor wafer
03/04/2004US20040043699 Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
03/04/2004US20040043616 Method for processing a semiconductor wafer including back side grinding
03/04/2004DE10225196A1 Seal seat producing process e.g. for fuel injector involves bringing components into contact on seat surfaces and vibrating one with other in relative motion
03/03/2004EP1393856A1 Grinding water tank unit for eyeglass lens processing and eyeglass lens processing apparatus having the same
03/03/2004EP1393855A1 Method for producing an optical lens
03/03/2004CN1479665A Actived slurry chemical mechanical planarization system and method for implenting the same
03/03/2004CN1140380C Air cushion pressure adjustable piano keyboard type graphic abrasive finishing pad and abrasive finishing method
03/02/2004US6699299 Composition and method for polishing in metal CMP
03/02/2004US6699101 Method for removing a damaged substrate region beneath a coating
02/2004
02/25/2004EP1137511B1 Cutting insert with improved flank surface roughness and method of making the same
02/25/2004EP1117512B1 A grinding method for making round columns
02/19/2004US20040033758 Polishing pad with window
02/19/2004DE4402032B4 Ferromagnetisches Schleifband Ferromagnetic sanding belt
02/18/2004CN1476366A Tool for applying resilient tape to chuck used for grinding or polishing wafers
02/17/2004US6692336 Method for protecting underwater surfaces against pollution due to fouling, and brush and coating agent used therewith
02/12/2004WO2004013656A2 Uniform thin films produced by magnetorheological finishing
02/12/2004US20040029495 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
02/12/2004US20040029493 Uniform thin films produced by magnetorheological finishing
02/12/2004US20040029488 Method of burnishing a burnishable rear pad slider in a disk drive
02/12/2004US20040025444 Mixture of oxidizer and abrasive; activation free radicals; for semiconductors, integrated circuits
02/10/2004US6688953 Barrel polishing apparatus
02/10/2004US6688952 Machine and method for finishing automotive wheels
02/10/2004US6688948 Wafer surface protection method
02/05/2004WO2004011194A1 Method and apparatus for grinding
02/05/2004US20040023590 Method for forming fine barrier, method for fabricating planar display and abrasive for blast
02/05/2004CA2493767A1 Method and apparatus for grinding
02/04/2004CN1473093A Method for forming fine barrier, method for fabricating planar display and abrasive for blast
02/04/2004CN1472065A Grooved roll and producing method thereof
02/03/2004US6685539 Processing tool, method of producing tool, processing method and processing apparatus
02/03/2004US6685536 Method for grinding convex running faces and outside diameters on shaft-like workpieces in one set-up and grinding machine for carrying out the method
01/2004
01/29/2004US20040018804 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
01/29/2004DE10228743A1 Verfahren zum Glätten und Polieren von Oberflächen durch Bearbeitung mit energetischer Strahlung Method for smoothing and polishing of surfaces by machining with energy radiation
01/28/2004EP1384553A2 A polishing machine with driving means to move the grinding tool along a precession path and method to use it
01/28/2004CN1470358A Suspension grinding method and its special apparatus
01/27/2004US6682403 Grinding machine with two grinding wheels
01/22/2004US20040014401 Method for backside die thinning and polishing of packaged integrated circuits
01/22/2004US20040011462 Method and apparatus for applying differential removal rates to a surface of a substrate
01/21/2004CN1469773A High pressure and high temperature production of diamonds
01/21/2004CN1469459A Processing method of nano level saphire substrate and its special polishing liquid
01/21/2004CN1469436A Method for processing silicon wafer by machine
01/21/2004CN1135149C Chilled temp. polishing method for soft acrylic articles
01/20/2004US6679758 Binding material being characterized by a melting temperature between 500 and 1400 degrees c; grinding tools
01/15/2004WO2004004973A1 Method for the hydro-erosive rounding of an edge of a part and use thereof
01/15/2004US20040009861 Fluted roll and method for the manufacture thereof
01/15/2004US20040009740 Method and composition for chemical polishing
01/15/2004US20040006924 For chemical mechanical polishing (CMP) of semiconductors
01/14/2004EP1380410A1 Corrugator roll and method for obtaining same
01/13/2004US6676487 Polishing liquid of silicon dioxide powder; x-ray mask deposited on a semiconductor surface
01/08/2004WO2004003986A1 Method and apparatus for applying differential removal rates to a surface of a substrate
01/08/2004WO2004003239A1 Method for smoothing and polishing surfaces by treating them with energetic radiation
01/08/2004WO2004002685A1 Clamping assembly
01/07/2004CN1133525C Manufacturing method for rare-earth alloy and manufacture of rare-earth magnets thereby
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