Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
11/2000
11/21/2000US6149506 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
11/21/2000US6149505 Cavitational polishing pad conditioner
11/16/2000WO2000068332A1 Magnetic polishing fluids
11/16/2000WO2000067948A1 Method of and device for machining flat parts
11/16/2000WO2000067947A1 Method for grinding convex running surfaces and outside diameters on undulated workpieces in a clamping, and a grinding machine for carrying out the method
11/16/2000DE19916155A1 Suspension zur Behandlung natürlichen Hartgewebes Suspension for the treatment of natural hard tissue
11/15/2000EP1051283A1 Method for sanding surfaces on items
11/15/2000EP1051282A1 High speed grinding wheel
11/14/2000US6146245 Method of and device for machining flat parts
11/14/2000US6146243 Method and apparatus for finishing works magnetically by generating alternating magnetic fields
11/14/2000US6145608 Superhard cutting structure having reduced surface roughness and bit for subterranean drilling so equipped
11/14/2000CA2001970C Orbital and/or reciprocal machining with a viscous plastic medium
11/09/2000WO2000066324A1 Glass grinding segment
11/09/2000WO2000066323A1 Rough-grinding and finish-grinding a crankshaft in a clamping
11/09/2000DE19919893A1 Vor- und Fertigschleifen einer Kurbelwelle in einer Aufspannung Pre- and finish grinding a crankshaft in one set-up
11/08/2000EP1050370A2 Grinding machine with a short stiffness loop between tool and workpiece
11/02/2000WO2000064633A2 Abrasive article suitable for abrading glass and glass ceramic workpieces
11/02/2000WO2000026631A9 Method for tire uniformity correction
11/02/2000EP1049145A1 Semiconductor wafer and production method therefor
11/02/2000EP1048403A2 Improvements in and relating to grinding machines
10/2000
10/26/2000WO2000062974A1 Ferrofluidic finishing
10/26/2000CA2366976A1 Ferrofluidic finishing
10/25/2000EP1046462A2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same.
10/24/2000US6135867 Apparatus and method for glass ball lens polishing
10/24/2000US6135865 CMP apparatus with built-in slurry distribution and removal
10/24/2000US6135864 Solid phase water scrub for defect removal
10/24/2000US6135862 Nitrogen gas supply system for dry-cut working machine
10/18/2000EP1044671A2 Suspension for treatment of hard tissue and of prosthetic materials
10/17/2000US6132295 Apparatus and method for grinding a semiconductor wafer surface
10/10/2000USRE36909 Structure of drive section of power tool
10/10/2000US6129612 Advanced mechanical texture process for high density magnetic recording media
10/10/2000US6129610 Polish pressure modulation in CMP to preferentially polish raised features
10/05/2000DE19908927C1 Fine machining of the running surface at a shaft end for radial sealing rings has temporary bolts screwed into the threaded drillings to give the structure in use for working and installation without further adjustments
10/03/2000US6126522 Method for manufacturing golf ball
09/2000
09/27/2000EP1038977A1 Device for treating surfaces by impingement
09/27/2000EP1038853A2 Ceramic sinter and wear resistant member and electronic member using thereof
09/27/2000EP1038634A2 Method for removing edge areas of a laminated panel
09/27/2000CN1267578A Method for grinding external tooth gear and grinding apparatus
09/26/2000US6123606 Method and apparatus for grinding
09/26/2000US6123603 Magnetic hard disc substrate and process for manufacturing the same
09/19/2000US6121144 Low temperature chemical mechanical polishing of dielectric materials
09/19/2000US6120354 Method of chemical mechanical polishing
09/19/2000US6120349 Polishing system
09/12/2000US6117776 Wafer holder and method of producing a semiconductor wafer
09/12/2000US6117001 Electrolytic in-process dressing method, electrolytic in-process dressing apparatus and grindstone
09/08/2000WO2000051784A1 Method and device for magnetic-abrasive machining of parts
09/06/2000EP1033203A2 Spherical lapping method
09/05/2000US6113467 Polishing machine and polishing method
09/05/2000US6113464 Method for mirror surface grinding and grinding wheel therefore
08/2000
08/29/2000US6109332 Ceramic mold finishing
08/22/2000US6106380 Deterministic magnetorheological finishing
08/22/2000US6106374 Acoustically agitated delivery
08/22/2000US6106364 Process for torque free outer circumference grinding of a cylindrical journal
08/10/2000WO2000032353A3 A polishing machine and method
08/08/2000US6099954 Polishing material and method of polishing a surface
08/08/2000US6099389 Fabrication of an optical component
08/08/2000US6099385 Method for removing edge areas of a laminated panel
08/08/2000US6098514 Ultrasonic vibration cutter
08/03/2000WO2000044528A1 Solid anti-galling agent
08/03/2000DE19955818A1 Traction surface grinding method for half-toroidal continuously variable transmission CVT disk
08/03/2000DE19902422A1 Workpiece surface machining involves applying electric field to surface area to be machined to increase viscosity of grinding medium contg. electrorheological liquid with abrasive additive
08/01/2000US6095901 Polishing method for soft acrylic articles
08/01/2000US6095897 Grinding and polishing machines
07/2000
07/26/2000EP0830234B1 Coater die grinding and finishing method
07/26/2000CN2389037Y Automatic ultrasoic wave die polishing machine
07/25/2000US6093651 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
07/25/2000US6093087 Wafer processing machine and a processing method thereby
07/19/2000EP1020661A2 Method and apparatus for polishing external-tooth gears
07/13/2000WO2000040370A1 Chilled temperature polishing method for soft acrylic articles
07/12/2000EP1018398A2 System for magnetorheological finishing of substrates
07/04/2000US6083839 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
07/04/2000US6083085 Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media
06/2000
06/29/2000WO2000037214A1 Method for manufacture of tubes of a zirconium-based alloy
06/29/2000CA2354584A1 Method for manufacture of tubes of a zirconium-based alloy
06/27/2000US6080047 Procedure for the surface treatment of petrous materials
06/22/2000WO2000036543A1 Grinding wheel system
06/22/2000WO2000035617A1 Method and device for grinding workpieces with centers which comprise form variations
06/22/2000CA2352426A1 Method and device for grinding workpieces with centers which comprise form variations
06/21/2000DE19857359A1 Verfahren und Vorrichtung zum Schleifen von Werkstücken mit Zentren, die Formabweichungen aufweisen Have method and apparatus for grinding of workpieces having centers which form deviations
06/20/2000US6077437 Polishing agent recovery and reuse method and device for the same removes large impurities by a filtration device, concentrates by an ultrafiltration device, and continuously recovers polishing agent; used for semiconductor polishing
06/20/2000US6077149 Method and apparatus for surface-grinding of workpiece
06/20/2000US6077148 Spherical lapping method
06/14/2000EP1007275A1 Cavitational polishing pad conditioner
06/14/2000CN1256508A Method for manufacture of semiconductor device
06/13/2000US6074285 Reciprocating friction drive-type ultra precision machine
06/13/2000US6074281 Fining and polishing machine and method for ophthalmic lenses
06/13/2000US6074278 High speed grinding wheel
06/08/2000WO2000032353A2 A polishing machine and method
06/08/2000DE19958227A1 Production of semiconductor wafers comprises turning the wheel of a grinding machine to remove the resin coating from the wafer exposing the wafer up to its bumps
06/07/2000EP1005956A2 Grinding machine spindle flexibly attached to platform
06/07/2000EP1005955A2 Grinding machine spindle flexibly attached to platform
06/06/2000US6071176 Gauge for and method of calibrating a lens cutting/grinding machine
05/2000
05/31/2000EP1004399A2 Surface grinding method and mirror polishing method
05/25/2000WO2000029169A1 Cutting insert with improved flank surface roughness and method of making the same
05/25/2000CA2346849A1 Cutting insert with improved flank surface roughness and method of making the same
05/18/2000WO2000028583A1 Semiconductor wafer and production method therefor
05/18/2000WO2000027586A1 Plastic polishing process under uniform pressure
05/17/2000EP1000706A2 Grinding machine spindle flexibly attached to platform
05/11/2000WO2000026631A1 Method for tire uniformity correction
05/10/2000EP0999013A1 Polishing grinding wheel and substrate polishing method with this grinding wheel
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