Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
06/2006
06/20/2006US7063595 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
06/20/2006US7063594 Cutting edge honing process
06/20/2006US7063593 Apparatus and process for surface treating interior of workpiece
06/15/2006WO2006063136A2 Methods of maximizing retention of superabrasive particles in a metal matrix
06/15/2006US20060128279 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
06/15/2006US20060128278 Polishing method, polishing device, glass substrate for magnetic recording medium, and magnetic recording medium
06/15/2006US20060128277 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
06/15/2006US20060128276 Carrier for double side polishing
06/15/2006US20060128272 Automated drill bit re-sharpening and verification system
06/15/2006US20060128271 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
06/15/2006CA2590276A1 Methods of maximizing retention of superabrasive particles in a metal matrix
06/14/2006EP1669148A1 Tool-unit for ultrasonic rotational machining
06/14/2006EP1436202A4 Abrasive media containment bag
06/14/2006CN1787895A Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
06/14/2006CN1787196A Method for real-time measuring of milling eliminating rate
06/14/2006CN1787181A Method for processing chip capable of improving semiconductor chip geometric parameter
06/14/2006CN1787179A Method for enhancing using efficiency of CMP equipment
06/14/2006CN1786266A Production technology of ceramic outer shell cover plate of crystal oscillator
06/14/2006CN1785598A Closed Y type spray nozzle suitable for high speed and ultrahigh speed grinding
06/14/2006CN1785597A Cathode device suitable for high speed on line electrolysis grinding
06/13/2006US7060621 Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/13/2006US7059951 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method
06/13/2006US7059946 Compacted polishing pads for improved chemical mechanical polishing longevity
06/13/2006US7059944 Integrated system for processing semiconductor wafers
06/13/2006US7059943 Method and apparatus for recycling slurry
06/13/2006US7059942 Method of backgrinding wafers while leaving backgrinding tape on a chuck
06/13/2006US7059940 Jet singulation
06/13/2006US7059938 Method of and apparatus for working a glass plate
06/13/2006US7059051 Fluted roll and method for the manufacture thereof
06/13/2006US7059005 Polish cleaning apparatus and method in manufacture of HGA
06/08/2006WO2006058518A1 Method and device for hardening the surfaces of components
06/08/2006US20060121837 Dressing method for polishing pad
06/08/2006US20060121836 Method for refinishing a test electrode and refinished electrode produced thereby
06/08/2006US20060121833 Linear motion apparatus and method for manufacturing thereof
06/08/2006US20060121832 Pressure feed grinding of AMLCD substrate edges
06/08/2006US20060121831 Grinding table for liquid crystal display panel and grinder apparatus using the same
06/08/2006US20060121830 Grinding method of crank pin and grinding machine
06/08/2006US20060121827 Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools
06/07/2006EP1666205A1 Free curved surface precision machining tool
06/07/2006EP1666200A1 Workpiece grinding method
06/07/2006EP1664906A1 Ophthalmic lens which is coated with an electrostatic film and method of edging one such lens
06/07/2006EP1664686A2 Method and apparatus for measuring flow rate through and polishing a workpiece orifice
06/06/2006US7056196 Wafer polisher
06/06/2006US7056194 Semiconductor processing methods of removing conductive material
06/06/2006US7056193 Method of forming fine partition walls, method of producing planar display device, and abrasive for jet processing
06/06/2006US7056191 Method for chamfering a plate-like member
06/06/2006CA2306131C Method for sanding surfaces on items
06/01/2006WO2006057720A1 Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
06/01/2006WO2005072338A3 Multi-step pad conditioningh system and method for chemical planarization
06/01/2006US20060116056 Apparatus and methods for polishing a semiconductor wafer
06/01/2006US20060116053 Barrel polishing method and barrel polishing apparatus
06/01/2006US20060115597 Method for preparing monolithic hydrated aluminas and composite materials
05/2006
05/31/2006CN1780716A Dispersion for chemical-mechanical polishing
05/31/2006CN1778518A Treatment of metal reed scratching trail
05/30/2006US7052522 Polishing composition and polishing method using the same
05/30/2006US7052375 Method of making carrier head backing plate having low-friction coating
05/30/2006US7052374 Multipurpose slurry delivery arm for chemical mechanical polishing
05/30/2006US7052373 Systems and slurries for chemical mechanical polishing
05/30/2006US7052372 Chemical-mechanical polisher hardware design
05/30/2006US7052371 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
05/30/2006US7052367 Polishing apparatus
05/30/2006US7052365 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
05/30/2006US7052363 Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing
05/30/2006US7052361 Method for hydro-erosive rounding of an edge of a part and use thereof
05/30/2006US7051426 Method making a cutting disk into of a substrate
05/25/2006US20060111028 Parallel surfae jig
05/25/2006US20060111021 Semiconductor wafer grinder
05/23/2006US7048617 Method and apparatus for smoothing unfinished surfaces
05/23/2006US7048616 Grinding apparatus for grinding an out-of-round trunnion or tire for a rotary kiln
05/23/2006US7048614 Apparatus and method for fabricating liquid crystal display panel
05/23/2006US7048613 Polishing method
05/23/2006US7048612 Method of chemical mechanical polishing
05/23/2006US7048611 Method of cleaning tile grout
05/23/2006US7048610 Conditioning polishing pad for chemical-mechanical polishing
05/18/2006US20060105686 Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same
05/18/2006US20060105682 System and method for monitoring and/or controlling a flow of a media
05/18/2006DE10065380B4 Verfahren zur Charakterisierung und Simulation eines chemisch-mechanischen Polier-Prozesses A method for characterizing and simulation of a chemical mechanical polishing process
05/17/2006EP1656235A1 Method for the production of components
05/17/2006CN1773611A Glass substrate for magnetic record medium and method for making same
05/17/2006CN1772362A Method for changing discoloured natural diamonds
05/17/2006CN1256617C Apparatus and method for rubbing LCD substrate
05/16/2006US7044990 Forming a pattern layer includes a vitrified bond, in a predetermined pattern on the working surface of the support body; sprinkling abrasive grains over the pattern layer before the pattern layer is dried; and firing the pattern layer and the abrasive grains which are bonded to the patten layer
05/16/2006US7044839 Glass substrate for information recording medium and process for manufacturing the same
05/16/2006US7044838 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
05/16/2006US7044837 Magnetic head cleaning method
05/16/2006US7044836 Coated metal oxide particles for CMP
05/16/2006US7044835 Abrasive article and methods for grinding glass
05/16/2006US7044834 Abrasive article
05/16/2006US7044830 Numeric controller
05/11/2006WO2005092010A3 Chemical mechanical polishing retaining ring
05/11/2006US20060099891 Method of chemical mechanical polishing, and a pad provided therefore
05/10/2006CN1771198A Nanoporous ultrafine alpha-alumina powders and sol-gel process of preparing the same
05/10/2006CN1769006A 抛光方法 Polishing method
05/09/2006US7040971 Carrier head with a flexible membrane
05/09/2006US7040970 Apparatus and method for distributing a polishing fluid
05/09/2006US7040967 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
05/09/2006US7040966 Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers
05/09/2006US7040965 Methods for removing doped silicon material from microfeature workpieces
05/09/2006US7040964 Polishing media stabilizer
05/09/2006US7040963 Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
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