Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
10/2005
10/13/2005US20050227587 In-line wafer surface mapping
10/13/2005US20050224012 Nail trimming belt for pet exercise wheel
10/13/2005DE19728428B4 Halbleiterwafer-Poliermaschine Semiconductor wafer polishing machine
10/13/2005DE102004014895A1 Bearbeitungsvorrichtung Processing apparatus
10/12/2005EP1584393A1 Method of dressing a substantially cylindrical grinding worm
10/12/2005EP1583636A1 Method for producing a guidewire
10/12/2005CN1681100A Bubble detection between polishing pad and polishing disk
10/12/2005CN1680510A Ceria slurry for polishing semiconductor thin layer
10/12/2005CN1680509A Polishing composition
10/12/2005CN1680076A Processing method and apparatus for media surface of hard disk in dynamic electronic measurement
10/11/2005US6953391 Methods for reducing slurry usage in a linear chemical mechanical planarization system
10/11/2005US6953387 Method and apparatus for measuring flow rate through and polishing a workpiece orifice
10/11/2005US6953386 Active spark control
10/11/2005US6953382 Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing
10/11/2005US6953381 System and method for ophthalmic lens manufacture
10/06/2005WO2005092010A2 Chemical mechanical polishing retaining ring
10/06/2005US20050221734 Carrier head with a non-stick membrane
10/06/2005US20050221732 Method for dressing a grinding worm
10/06/2005US20050221731 Polishing pad conditioning system
10/06/2005US20050221730 Polishing pad conditioning and polishing liquid dispersal system
10/06/2005US20050221726 Abrasive with an average particle size of 1 to 30 nm and water and having a packing ratio of from 79 to 90% by weight; suitable for precision parts including such as magnetic recording media, photomask substrates, optical disks, lenses, mirrors, and prisms, and semiconductor substrates
10/06/2005US20050221723 Multi-layer polishing pad for low-pressure polishing
10/06/2005US20050221722 Wafer grinding using an adhesive gel material
10/04/2005US6951800 Method of making semiconductor device that has improved structural strength
10/04/2005US6951510 Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
10/04/2005US6951508 Optical fiber polishing device
10/04/2005US6951507 Substrate polishing apparatus
10/04/2005US6951506 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
10/04/2005US6951504 contacting the abrasive article containing superabrasive particles with a workpiece outer surface having a thermal spray hard phase and a bonding phase, relatively moving the abrasive article and the workpiece; polishing
09/2005
09/29/2005WO2005090617A1 Method and device for increasing the endurance limit, in particular the bending strength and torsional strength of crankshafts
09/29/2005US20050215188 CMP pad conditioner having working surface inclined in radially outer portion
09/29/2005US20050215183 Chemical-mechanical planarization composition having PVNO and associated method for use
09/29/2005US20050215182 Wafer carrier with pressurized membrane and retaining ring actuator
09/29/2005US20050215181 Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
09/29/2005US20050215180 Semiconductor device fabrication method
09/28/2005EP1579953A1 Processing apparatus
09/28/2005CN1675745A Method for fabricating semiconductor wafer
09/28/2005CN1674234A Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device
09/28/2005CN1673306A Polishing composition
09/27/2005US6949007 System and method for multi-stage process control in film removal
09/27/2005US6949006 Belt-disc sander having speed adjuster
09/27/2005US6949004 Method for reducing pole and alumina recession on magnetic recording heads
09/27/2005US6948574 Ultrasonic annular core bit
09/22/2005WO2005087434A1 Finishing processes for improving fatigue life of metal components
09/22/2005WO2005050895A3 A method of backgrinding wafers while leaving backgrinding tape on a chuck
09/22/2005US20050208883 Polishing composition
09/22/2005US20050208882 Ceria slurry for polishing semiconductor thin layer
09/22/2005US20050208881 Chemical mechanical polishing retaining ring with integral polymer backing
09/22/2005US20050208745 Methods of forming a conductive contact through a dielectric
09/22/2005DE102004010379A1 Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile A process for the production of wafers with low defect surfaces, the use of such wafers and electronic parts thus obtained
09/21/2005CN1219602C Tool machine with supersonic adaptor
09/20/2005US6946397 Chemical mechanical polishing process with reduced defects in a copper process
09/20/2005US6945857 Polishing pad conditioner and methods of manufacture and recycling
09/20/2005US6945852 Method for finishing automotive wheels and resulting wheels
09/20/2005US6945851 CMP formulations
09/15/2005WO2005084261A2 Tire uniformity machine grinding assembly
09/15/2005US20050202765 Independent edge control for CMP carriers
09/15/2005US20050202763 Multi-function slurry delivery system
09/15/2005US20050202762 Dresser for polishing cloth and method for producing the same
09/15/2005US20050202761 Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
09/15/2005DE19857359B4 Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mit dünnwandigen Bereichen, die zentrische Formabweichungen aufweisen Having Method and apparatus for processing workpieces with thin-walled areas, the central shape deviations
09/14/2005EP1574286A1 Working method and device for the burnishing of gears
09/14/2005CN1667076A Polishing solution and method of polishing nonferrous metal materials
09/14/2005CN1666844A Dresser for polishing cloth and method for producing the same
09/13/2005US6944370 Method of processing a semiconductor wafer
09/13/2005US6942548 Polishing method using an abrading plate
09/09/2005WO2005082573A1 Apparatus and method for deburring and roller-burnishing machine parts
09/08/2005US20050197051 High smoothness grinding process and apparatus for metal material
09/08/2005US20050197046 Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device
09/08/2005US20050194562 Varying weight ratio of thermoplastic polymer to polyvinylpyrrolidone controls removal rate; complexing agent, corrosion inhibitor, oxidizing agent, silica abrasive; prevent dishing of the low-k dielectric layer; does not recognize tuning of the slurry
09/08/2005US20050194357 useful for polishing tantalum barrier material and copper from semiconductor wafer, comprising by weight percent 0.1 to 30 oxidizer, 0.01 to 3 inorganic salt or acid, 0.01 to 4 inhibitor, 0.1 to 30 abrasive, 0 to 15 complexing agent, balance water
09/08/2005US20050193550 Fast production of high aspect ratio magnetic structures on write heads using combination of chemical mechanical polishing (CMP) and reactive ion etching (RIE); dimension control and definition
09/08/2005DE102004008728A1 Increasing long-term fatigue resistance associated with flexure and torsion in large crank shafts by hammering, directs tool exclusively at right angles to surface being treated
09/07/2005EP1571324A2 Optimized low emission two-stroke internal combustion diesel engine
09/07/2005EP1570951A2 Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units
09/07/2005CN1666321A Method and apparatus for applying differential removal rates to a surface of a substrate
09/07/2005CN1665643A Clamping assembly
09/07/2005CN1664993A Wafer grinding device and method
09/07/2005CN1664992A Polishing pad for electrochemical mechanical polishing
09/07/2005CN1218368C Method for mfg. semiconductor with improved structure intensity
09/07/2005CN1217767C Activated slurry CMP system and methods for implementing the same
09/06/2005US6939785 Process for manufacturing a semiconductor chip
09/06/2005US6939209 Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits
09/06/2005US6939202 Substrate retainer wear detection method and apparatus
09/06/2005US6939199 Method and apparatus for cutting semiconductor wafers
09/01/2005US20050191942 CMP apparatus and process sequence method
09/01/2005US20050191582 System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding
08/2005
08/31/2005EP1568074A1 Carrier head for chemical mechanical polishing apparatus
08/31/2005EP1567306A1 Transparent microporous materials for cmp
08/31/2005EP1550152A4 Method and apparatus for applying differential removal rates to a surface of a substrate
08/31/2005CN1661780A CMP apparatus and polishing method
08/31/2005CN1216723C Magnetic rheologic polishing head in electromagnetic mode
08/31/2005CN1216720C Processing method for high precision grinding metal piece
08/30/2005US6936540 Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings
08/30/2005US6935924 Method for deciding a bevel curve, method for determining a locus of a bevel, method for processing a lens and apparatus for processing a lens
08/25/2005US20050186891 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
08/25/2005US20050186889 Wheel polishing device
08/25/2005US20050186887 Processing method and apparatus
08/25/2005US20050185338 perpendicular pole tip and method of fabrication
08/25/2005US20050185332 Perpendicular pole structure and method of fabricating the same
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