Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
11/2001
11/08/2001CA2407300A1 Method of modifying the surface of a semiconductor wafer
11/08/2001CA2405766A1 Method of cleaning glass
10/2001
10/31/2001EP1148975A1 Method for manufacture of tubes of a zirconium-based alloy
10/31/2001CN1319463A Online roll abrading method and device
10/31/2001CN1073910C Deterministic magnetorhydrological finishing
10/30/2001US6309285 Magnetic wiper
10/25/2001WO2001080226A1 Polish cleaning apparatus and method in manufacture of hga
10/23/2001US6306018 Grinding methods and apparatus
10/23/2001US6306015 Method for grinding rigid materials
10/23/2001US6306011 System for controlling the size and surface geometry of an orifice
10/18/2001US20010030171 Cleaning uneven surfaces
10/17/2001EP1145296A1 Semiconductor wafer manufacturing method
10/17/2001EP1144157A2 Method to improve the surface topography of roller bearing components
10/17/2001EP1144155A2 Ultrasonic transducer slurry dispenser
10/16/2001US6302768 Method for polishing surface of vapor-phase synthesized thin diamond film
10/16/2001US6301943 Method for finishing cold-rolled stainless steel
10/11/2001US20010029149 Magnetic wiper
10/10/2001EP1141154A1 Polishing composition and method
10/10/2001EP1140426A1 Chilled temperature polishing method for soft acrylic articles
10/09/2001US6299515 CMP apparatus with built-in slurry distribution and removal
10/04/2001EP1138437A2 Method of deburring ultrasonic devices
10/04/2001EP1137511A1 Cutting insert with improved flank surface roughness and method of making the same
10/04/2001EP1137505A1 Method and device for grinding workpieces with centers which comprise form variations
10/03/2001CN1315897A Improvements in rolling elements bearings
10/02/2001US6297159 Method and apparatus for chemical polishing using field responsive materials
09/2001
09/27/2001WO2001071730A1 Systems and methods to reduce grinding marks and metallic contamination
09/27/2001WO2001070457A1 Grind polish cluster and double side polishing of substrates
09/27/2001WO2001017724A3 Ultrasonic transducer slurry dispenser
09/27/2001US20010024933 Composition and method for polishing in metal CMP
09/27/2001US20010024928 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
09/27/2001EP1144155A3 Ultrasonic transducer slurry dispenser
09/20/2001US20010023082 Grind and single wafer etch process to remove metallic contamination in silicon wafers
09/19/2001CN1071171C Honing technology and equipment for cylinder sleeve of engine
09/18/2001US6291350 Method of polishing semiconductor wafer
09/18/2001US6290808 Chemical mechanical polishing machine with ultrasonic vibration and method
09/13/2001WO2001066308A1 Method for making an ophthalmic lens surface, installation therefor and resulting ophthalmic lens
09/13/2001WO2001066303A1 Method for article dimensional micro-polishing, device for carrying out said micro-polishing and workholder for a worked article
09/13/2001US20010020808 Torsional vibrating apparatus for ultrasonic machining
09/13/2001DE10022541A1 Steel component surface treatment to give a stainless steel type finish involves abrasion then coating with plastic
09/12/2001CN1312754A Method for grinding
09/11/2001US6287192 Slurry supply system for chemical mechanical polishing process having sonic wave generator
09/04/2001US6284668 Plasma polishing method
09/04/2001US6284091 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
08/2001
08/30/2001DE10108575A1 Torsional vibration device for ultrasonic machining has axially symmetrical manner ultrasonic torsional converter including forward body with length equal to half resonant frequency
08/29/2001CN1310074A Cup shape grinding wheel parts, and method and apparatus for processing workpiece end face therewith
08/28/2001US6280305 Vibration surface finishing apparatus
08/28/2001US6280298 Test probe cleaning
08/23/2001WO2001060553A1 Method of producing glasses lenses, and polishing tool
08/23/2001DE10004981A1 Individual fashioning of acrylic plastic panels into three dimensional useful objects, e.g. lamp shade, comprises structuring a panel into a three dimensional form, the heating and deforming into the final product
08/22/2001EP1125102A1 Method for tyre uniformity correction
08/21/2001US6276842 Optical component, method for polishing the end faces of optical component, and apparatus for polishing the same
08/16/2001US20010014570 Process for producing a semiconductor wafer with polished edge
08/16/2001US20010013503 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
08/15/2001CN1069567C Isobaric plasticity grinding process
08/14/2001US6273795 Method and apparatus of dressing a grinding wheel
08/14/2001US6273794 Apparatus and method for grinding a semiconductor wafer surface
08/08/2001CN1307386A Electric connector terminal making process and die
08/07/2001US6270688 Chemical polishing of barium strontium titanate
08/02/2001US20010011001 Metal part having external surface with particular profile, polishing method for its production and device for implementing the method
08/02/2001DE10103348A1 Online-Walzenschleifverfahren und Online-Walzenschleifvorrichtung Online roll grinding process and on-line roll grinding device
08/02/2001DE10103121A1 Verfahren zum Schleifen von wenigstens einer Fläche an einem in der Zerspantechnik eingesetzten Schneidmesser Method for grinding at least one surface on a cutting blade used in machining
07/2001
07/31/2001US6267651 Magnetic wiper
07/31/2001US6267647 Grinding machines and polishing machines
07/31/2001US6267646 Polishing machine
07/31/2001US6267645 Level flying burnishing head
07/26/2001WO2001053038A1 System and method for ophthalmic lens manufacture
07/26/2001US20010009842 Online roll grinding method and online roll grinding apparatus
07/26/2001DE10004578C1 Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying
07/26/2001DE10001654A1 Verfahren zur Herstellung einer Arbeitsplatte mit angefasten Kanten A process for producing a worktop with bevelled edges
07/25/2001EP1117512A1 A method for grinding
07/19/2001WO2001051252A1 Method and device for releasing metallic workpieces from clamped chips or the like
07/19/2001US20010008801 A small amount of single-side lapping is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping stock removal
07/19/2001DE10001041C1 Verfahren und Vorrichtung zum Befreien metallischer Werkstücke von festgeklemmten Gleitschleifkörpern oder dergleichen Method and apparatus for freeing metallic workpieces of clamped vibratory grinding bodies or the like
07/18/2001EP1116531A2 Method of making workplates with bevelled edges
07/18/2001CN1303758A Process of grinding, electron component and variable capacitor
07/17/2001US6261159 Apparatus and method for the restoration of optical storage media
07/12/2001WO2000064633A3 Abrasive article suitable for abrading glass and glass ceramic workpieces
07/05/2001WO2001048802A1 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer
07/05/2001WO2001047667A1 Method and apparatus for controlling abrasive flow machining
07/05/2001WO2001047664A1 Wafer polishing method and wafer polishing device
07/05/2001DE10002450A1 Polish for post-treatment of lacquered surfaces in the automobile industry comprises preferably 5-10 wt.% polish and a 1-1:3, preferably 1:2 mixture of thinner and spray dissolver
07/03/2001US6254795 Texture measuring method of a hard disk plate
07/03/2001US6254464 Hand scaler polishing unit and hand scaler polishing apparatus
06/2001
06/28/2001WO2001046006A2 Method for protecting underwater surfaces against pollution due to fouling, and brush and coating agent used therewith
06/28/2001DE19960825A1 Method and polishing floor uses segments with fine, adhered grinding granules, floor being ground with pressure and virtually constant speed
06/26/2001US6250992 Mirror grinding method and glass lens
06/20/2001EP1108494A2 Ultrasonic vibration cutting tool and production method thereof
06/20/2001CN1299729A Grinding method and grinding apparatus
06/14/2001WO2001002133A3 Improvement in and relating to edge grinding
06/14/2001WO2000066324A8 Glass grinding segment
06/14/2001US20010003699 Wet type buffing method, deposition plating method work buffing method, work buffing apparatus barrel buffing apparatus, work surface treatingmethod, work supporting unit for barrel buffing apparatus and buffing medium
06/14/2001US20010003696 Wet type buffing method, deposition plating method, work buffing method, work buffing apparatus, barrel buffing apparatus, work surface treating method, work supporting unit for barrel buffing apparatus, and buffing medium
06/13/2001CN1298781A Ultrasonic vibration cutting tools and mfg. method therefor
06/09/2001CA2327563A1 Ultrasonic vibration cutting tool and production method thereof
06/06/2001CN1066659C Method for precision machining of gear-wheels and internal toothed tool
06/05/2001US6241589 Quick change bit holder
06/05/2001US6241588 Cavitational polishing pad conditioner
06/05/2001US6241587 System for dislodging by-product agglomerations from a polishing pad of a chemical mechanical polishing machine
05/2001
05/30/2001EP1103344A2 Method for machining surfaces, especially running faces of combustion-engine cylinders
05/30/2001EP1102821A1 Composition and method for polishing in metal cmp
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