Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
04/2003
04/17/2003DE10212266C1 Production of microtiter plates comprises forming microwells in chemically resistant glass wafers by ultrasonic lapping using mold, larger plate then being cut into individual microtiter plates
04/16/2003CN1411038A Polishing method and apparatus
04/15/2003US6547842 Polishing material, grinding particle body for abrasion-grinding, method for producing a polishing material, and method for polishing or grinding, and polishing apparatus
04/10/2003US20030068964 Polishing apparatus
04/09/2003CA2407178A1 Method of applying a surface finish on a metal substrate and method of preparing work rolls for applying the surface finish
04/02/2003EP1298654A2 Method for fabricating a disk mounting for a motor hub of a hard disk drive, the motor hub thus obtained and a motor including this motor hub
04/02/2003CN1406716A Multi-position micro-hole machining method and apparatus
03/2003
03/27/2003WO2003024664A2 Edge finishing process for glass or ceramic disks used in disk drive data storage devices
03/27/2003US20030060145 Multi-step polishing system and process of using same
03/27/2003US20030060139 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
03/27/2003US20030060022 Method for cutting semiconductor wafers
03/27/2003US20030060020 Method and apparatus for finishing substrates for wafer to wafer bonding
03/25/2003US6537143 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus
03/25/2003US6536109 Method for extending the life of attachments that attach blades to a rotor
03/20/2003US20030054736 Edge finishing process for glass or ceramic disks used in disk drive data storage devices
03/20/2003US20030054732 Stacks; simplifying machining
03/20/2003US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/19/2003EP1293291A2 Eyeglass lens end face machining method
03/18/2003US6533644 Method of texturing and agent therefor
03/12/2003CN1402310A Cheminomechanical grinding method
03/12/2003CN1402309A Proces for polishing indium phosphide single crystal wafer
03/06/2003US20030045219 Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus
03/06/2003US20030045215 Method for working magnetic disk mount portion of motor hub of the hard disk drive apparatus, thus obtained motor hub, and motor including the same
03/06/2003US20030045209 Multistage fine hole machining method and device
03/06/2003US20030045097 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light
03/04/2003US6527628 Method for producing frost glass product
02/2003
02/27/2003WO2002062528A3 Chemical mechanical machining and surface finishing
02/27/2003WO2001028739A8 Device for polishing outer peripheral edge of semiconductor wafer
02/27/2003US20030040259 For narrow recesses spacings; solidification of fluid containing abrasive particles
02/25/2003US6524169 Method for manufacture of tubes of a zirconium-based alloy
02/20/2003US20030036339 Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
02/20/2003US20030036338 Ductile grinding processing for the diamond or diamond film
02/20/2003US20030034574 Method for cutting optical lens and/or molding die therefor
02/19/2003EP1283761A1 Method for grinding metallic workpieces containing, in particular, nickel
02/18/2003US6520846 Sanding and polishing systems
02/18/2003US6520836 Method of forming a trailing edge cutback for a turbine bucket
02/13/2003WO2003011526A1 Method for forming fine barrier, method for fabricating planar display and abrasive for blast
02/13/2003US20030032372 Substrate polishing apparatus
02/13/2003US20030029841 Method and apparatus for polishing metal and dielectric substrates
02/13/2003US20030029275 Ultrasonic vibration cutting tool and production method thereof
02/12/2003EP1283089A2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
02/06/2003WO2003009966A1 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
02/06/2003US20030027501 Method of grinding rear side of semiconductor wafer
02/06/2003DE10119337C1 Production of tribological surfaces on a workpiece used in production of cylinder faces comprises finely processing a surface of workpiece, removing surface layer, finely grinding surface and obtaining hard material phases
02/05/2003EP1281197A1 Method of modifying the surface of a semiconductor wafer
01/2003
01/30/2003WO2003009349A2 Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials
01/30/2003US20030022801 Applying composition comprising at least one reducing agent for reducing ions of transition metal to a lower valence state, at least one pH adjusting agent, at least one metal corrosion inhibitor and water
01/30/2003US20030022606 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
01/30/2003US20030022603 Method for global die thinning and polishing of flip-chip packaged integrated circuits
01/30/2003US20030022597 Surface treatment of oxidizing materials
01/30/2003US20030022497 Method of chemical mechanical polishing with high throughput and low dishing
01/30/2003US20030019338 Grinding process and control device for a knife shaft
01/29/2003EP1062072B1 Method for producing a high-quality surface, wide-wheel grinding device and use of same
01/23/2003WO2002029878A3 Chemical mechanical polishing of dielectric materials
01/23/2003US20030017790 Grinding method and numerically controlled grinding machine
01/23/2003US20030017789 Working method for curved surface of a work and an apparatus thereof
01/22/2003EP1276592A2 Method of polishing and cleaning glass
01/22/2003CN1392822A Ultrasonic cross shot peening of vanes on rotor
01/21/2003US6508093 Method and apparatus for ultrasonic peening of annular recesses for the attachment of blades to a rotor
01/16/2003US20030011742 Rapid application optical lens coatings and methods
01/15/2003EP1051282B1 High speed grinding wheel
01/15/2003CN1099127C Method of modifying exposed surface of semiconductor wafer
01/14/2003US6506102 System for magnetorheological finishing of substrates
01/14/2003US6505935 Optical lens coating and method
01/14/2003US6505489 Method and apparatus for ultrasonic peening of axial recesses for the attachment of blades to a rotor
01/09/2003WO2003002301A1 End point detection system for chemical mechanical polishing applications
01/09/2003US20030008598 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
01/08/2003EP1273389A1 Grinding process for a knife shaft
01/07/2003US6503414 Fluid comprising such as polytetrofluoroethylene protective coated carbonyl iron magnetic particles, cerium oxide abrasive particles, stabilizer and water or glycerin which may be automatically and accurately controlled
01/07/2003US6503129 Activated slurry CMP system and methods for implementing the same
01/03/2003WO2003000460A1 Method of making light transmitting optical fluoride crystals
01/02/2003US20030001456 Device with ultrasound adapter
01/02/2003US20030000917 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
01/02/2003US20030000915 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
01/02/2003EP1271484A2 Pulsed laser surface treatments for magnetic recording media
01/01/2003CN1097848C Chemically mechanical grinding method for producing integrated circuit and its apparatus
12/2002
12/26/2002US20020197936 Method of burnishing a burnishable rear pad slider in a disk drive
12/26/2002US20020197437 Glass substrate for magnetic recording media and manufacturing method thereof
12/25/2002CN1096915C Workpiece inspection and handling
12/24/2002US6497798 Applying a conductive material in a predetermined pattern to surface, polishing, measuring one of resistance and electric current across the conductive material to determine degree of polishing
12/24/2002US6497164 Ultrasonic vibration cutting tool and production method thereof
12/19/2002US20020193053 Recycling process for cutting tools for machining printed circuit boards
12/19/2002DE10147646C1 Machining method for semiconductor disc edge calculates displacement rate for semiconductor disc by comparing overall material volume to be removed with volume removed per unit of time
12/18/2002EP1177067B1 Method for grinding convex running surfaces and outside diameters on undulated workpieces in a clamping, and a grinding machine for carrying out the method
12/18/2002CN1385833A Glass substrate for magnetic record mediuma nd method for making same
12/18/2002CN1385396A Method for making aluminium oxide ceramic products
12/12/2002US20020185203 Method for force correction
12/12/2002DE10128161A1 Processing circuit board involves using continuous circulating grinding strip, pressing strip onto coating to be removed, removing coating to defined extent, cleaning board with water, drying
12/11/2002EP0858381B1 Deterministic magnetorheological finishing
12/11/2002CN1096108C Appts. for making silicon chip
12/11/2002CN1095726C 改进的磨削和抛光机床 Improved grinding and polishing machine
12/11/2002CN1095718C Method for linking between metallic sheets
12/10/2002US6491836 Semiconductor wafer and production method therefor
12/10/2002US6490899 Method and apparatus for peening tops of cooled blades
12/05/2002US20020182980 Method for protecting underwater surfaces against pollution due to fouling, and brush and coating agent used therewith
12/05/2002US20020179244 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer
12/04/2002CN1095421C Method for grinding
12/03/2002US6489243 Method for polishing semiconductor device
11/2002
11/28/2002US20020177393 Grinding machine with supplemental motion
11/28/2002US20020177389 Method and apparatus for creating a groove in a collector ring of an electrical device
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