Patents for B24B 1 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes (7,565)
03/2002
03/19/2002US6358117 Processing method for a wafer
03/14/2002DE10135919A1 Complex pickling and polishing process comprises pickling metal parts, especially copper-containing colored metals, polishing in a centrifugal vibratory grinding device, and coarsely polishing the image relief before further processing
03/13/2002EP0865342B1 Improvements in and relating to grinding machines
03/12/2002US6355184 Method of eliminating agglomerate particles in a polishing slurry
03/12/2002US6354923 Apparatus for planarizing microelectronic substrates and conditioning planarizing media
03/07/2002US20020027398 Method for manufacturing thin plate, piezoelectric plate, and piezoelectric vibrator
03/07/2002DE10131246A1 Method for producing a semiconducter wafer with asymmetric edges involves fixing wafer onto rotating table and offsetting rotating machining tool with respect to centerline of wafer
03/06/2002CN1338728A Manufacture of glass substrate as magnetic recording media
03/06/2002CN1080166C Method of and apparatus for polishing wafer
02/2002
02/28/2002WO2002017381A2 Method for preventing damage to wafers in a sequential multiple steps polishing process
02/28/2002US20020025764 Polishing apparatus
02/28/2002US20020025763 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
02/28/2002US20020025760 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
02/28/2002US20020025759 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
02/28/2002US20020023350 Method of working hub ring of wheel bearing assembly
02/27/2002EP1181132A1 Rough-grinding and finish-grinding a crankshaft in a clamping
02/27/2002CN2478726Y Low-frequency impact grinding hard brittle matterial shaping machine
02/26/2002US6350691 Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media
02/21/2002WO2002013958A2 High pressure and high temperature production of diamonds
02/21/2002US20020022437 Working method for curved surface of a work and an apparatus thereof
02/20/2002EP1180414A1 Grinding machine
02/20/2002CN1079313C Method for grinding and repairing seat of stop valve connected by small path flange
02/19/2002US6347980 Method for grinding traction surface of half-toroidal-type continuously variable transmission disk
02/19/2002US6347977 Method and system for chemical mechanical polishing
02/14/2002WO2001036158A3 Method and machine for ultrasonic shot blasting of workpieces on a wheel
02/14/2002US20020019201 Apparatus for grinding rigid materials
02/14/2002US20020019200 Mirror grinding method and glass lens
02/14/2002US20020019199 Abrasive article suitable for abrading glass and glass ceramic workpieces
02/13/2002EP1178868A1 Ferrofluidic finishing
02/13/2002CN1335799A A polishing machine and method
02/07/2002US20020016072 Method of manufacturing semiconductor wafer
02/07/2002US20020014100 Device for ultrasonic peening of metals
02/06/2002EP1178525A1 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer
02/06/2002EP1177067A1 Method for grinding convex running surfaces and outside diameters on undulated workpieces in a clamping, and a grinding machine for carrying out the method
02/06/2002CN1078835C Buffing method and buffing apparatus
02/05/2002US6343978 Method and apparatus for polishing workpiece
02/05/2002US6343495 Apparatus for surface treatment by impact
01/2002
01/31/2002WO2002008820A1 Optical lens coating
01/31/2002WO2001046006A3 Method for protecting underwater surfaces against pollution due to fouling, and brush and coating agent used therewith
01/31/2002US20020013123 Method of grinding half toroidal CVT disk
01/31/2002US20020011030 Composite polymer blast media
01/31/2002US20020010993 Mold for forming resinous domed article and method of producing same
01/31/2002CA2416674A1 Optical lens coating
01/30/2002EP1175280A1 Method for making an ophthalmic lens surface, installation therefor and resulting ophthalmic lens
01/30/2002EP0853528A4 Laser surface treatments for magnetic recording media
01/30/2002CN1078518C Method of producing semiconductor wafers
01/24/2002WO2002006007A1 Micro-burnishing apparatus using ultrasonic vibration
01/24/2002US20020008847 Optical lens coating and method
01/24/2002CA2384002A1 Micro-burnishing apparatus using ultrasonic vibration
01/23/2002EP1173307A2 Abrasive article suitable for abrading glass and glass ceramic workpieces
01/23/2002CN1078121C Method for processing plate-type glass edge, thermal reinforced sheet glass and fireproof apparatus
01/17/2002US20020006768 Polishing method using an abrading plate
01/09/2002EP0921904B1 Apparatus and method for polishing semiconductor devices
01/09/2002EP0907461B1 Grinding machine spindle flexibly attached to platform
01/09/2002CN1329972A Chamfering method of rare earth alloy and separating method and device for ball-milling medium
01/08/2002US6337271 Polishing simulation
01/08/2002US6336844 Method and machine for the ultrasonic peening of parts on a wheel
01/02/2002EP1167187A1 Surface quality enhancement of aerospace skin sheet
01/02/2002EP1166967A2 Quick change grinder bit holder
01/02/2002CN2468661Y Ultrasonic grinding machine for working holes or slotting on hard or brittle materials
01/02/2002CN1329528A Method and device for grinding workpieces with centers which comprise form variations
01/02/2002CN1077003C Lapping apparatus
01/01/2002US6334808 Method for processing peripheral portion of thin plate and apparatus therefor
12/2001
12/27/2001WO2001098024A1 Abrasive article, apparatus and process for finishing glass or glass-ceramic recording disks
12/27/2001US20010055941 Method of chemical mechanical polishing
12/27/2001US20010055938 Method for the production of glass substrates for magnetic recording mediums
12/25/2001US6332829 Polishing method and device
12/25/2001US6332826 Polishing apparatus
12/21/2001CA2343857A1 Quick change grinder bit holder
12/20/2001WO2001096068A1 Device and method for measuring amount of grinding in magnetic head producing process
12/20/2001WO2001096063A1 Magnetic head grinding device and method
12/19/2001CN1076247C Method and apparatus for grinding brittle materials
12/18/2001US6331135 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
12/13/2001US20010051494 Method of cleaning glass
12/13/2001US20010051490 System and method for ophthalmic lens manufacture
12/12/2001EP0915747B1 Metal part having external surface with particular profile, polishing method for its production and device for implementing the method
12/11/2001US6328630 Eyeglass lens end face machining method
12/06/2001DE10025352A1 Werkzeuggerät mit Ultraschalladapter Tool machine with ultrasound adapter
12/05/2001EP1159108A1 System and method for controlling the size and surface geometry of an orifice
12/05/2001EP1159107A1 Method and apparatus for controlling abrasive flow machining
12/05/2001CN1324713A Tool machine with supersonic adaptor
11/2001
11/30/2001CA2348834A1 Device for ultrasonic peening of metals
11/29/2001DE10025173A1 Verfahren zum Schleifen von insbesondere Nickel enthaltenden metallischen Werkstücken Method for grinding of particular nickel-containing metal workpieces
11/28/2001EP1157752A2 Tool with ultrasound adaptor
11/28/2001CN1324286A Chilled temp. polishing method for soft acrylic articles
11/27/2001US6322426 Method for mirror process of external surface of long sized metal
11/25/2001CA2348296A1 Method of grinding optical fiber connector
11/22/2001US20010044265 Method and apparatus for supplying chemical-mechanical polishing slurries
11/22/2001US20010044263 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
11/21/2001EP1154877A2 A polishing machine and method
11/20/2001US6320269 Method for preparing a semiconductor wafer to receive a protective tape
11/20/2001US6319097 Grinding methods and apparatus
11/20/2001US6319094 Method and apparatus for controlling abrasive flow machining
11/20/2001US6317955 Method of producing a resinous dome forming mold
11/15/2001US20010041510 Grinding method, electronic component, and variable capacitor
11/15/2001US20010041502 Work polishing method
11/13/2001US6315644 Apparatus and process for supplying abrasives for use in the manufacture of semiconductors
11/08/2001WO2001084613A1 Method of modifying the surface of a semiconductor wafer
11/08/2001WO2001083163A2 Method of polishing and cleaning glass
11/08/2001US20010039170 Low temperature chemical mechanical polishing of dielectric materials
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