| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 10/20/2005 | WO2005097396A1 Joining method and device therefor |
| 10/20/2005 | WO2005097389A1 Heat exchanger tube, heat exchanger, and manufacturing method thereof |
| 10/20/2005 | US20050230817 Chip bonding heater with differential heat transfer |
| 10/20/2005 | US20050230455 Magnetic source and ferromagnetic device for ultrasonic welding |
| 10/20/2005 | US20050230454 Copper-based brazing alloy and brazing process |
| 10/20/2005 | US20050230360 Method and apparatus for assessing the quality of spot welds |
| 10/20/2005 | US20050230358 Method and apparatus for fabricating dry cell batteries |
| 10/19/2005 | CN1684789A Selective gas knife for wave soldering |
| 10/19/2005 | CN1684573A Mounting substrate and mounting method of electronic part |
| 10/18/2005 | US6955982 Flip chip C4 extension structure and process |
| 10/18/2005 | US6955286 Use of silver-copper-palladium brazing alloys |
| 10/13/2005 | WO2005096459A1 Coaxial cable soldering method and equipment |
| 10/13/2005 | WO2005096367A1 Heater, reflow apparatus, and solder bump forming method and apparatus |
| 10/13/2005 | US20050224932 Electrically conductive wire |
| 10/13/2005 | US20050224560 Mounting substrate and mounting method of electronic part |
| 10/13/2005 | US20050223553 Method for providing an electrical connection |
| 10/12/2005 | EP1584405A2 Die Plate |
| 10/12/2005 | EP1584398A1 Two tier brazing process for joining copper tubes to manifolds |
| 10/12/2005 | CN1681618A Solder hierarchy for lead free solder joint |
| 10/12/2005 | CN1680063A Two tier brazing process for joining copper tubes to manifolds |
| 10/12/2005 | CN1222929C SBB machine and method for HGA mass production |
| 10/11/2005 | US6953145 Soldering method for mounting electric components |
| 10/06/2005 | WO2005093115A1 Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus |
| 10/06/2005 | WO2005092562A1 Solder foil for soldering parts, particularly plates of heat exchangers |
| 10/06/2005 | WO2005092552A2 Portable induction heating tool for soldering pipes having a u-shaped head portion comprising an induction coil |
| 10/06/2005 | US20050221102 Die plate |
| 10/06/2005 | US20050218525 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 10/06/2005 | US20050218197 Solder heating system |
| 10/06/2005 | US20050218196 Two tier brazing for joining copper tubes to manifolds |
| 10/06/2005 | US20050218190 Configuring apparatus and processing method of thermal conductive plate |
| 10/06/2005 | DE10334391B4 Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik A process for the production of compounds in microelectronics |
| 10/06/2005 | DE102004013688A1 Lotfolien zum Löten von Bauteilen, insbesondere Platten von Wärmeübertragern Solder foils for soldering components, in particular plates of heat exchangers |
| 10/05/2005 | EP1582287A1 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 10/05/2005 | EP1582281A1 Solder handling system |
| 10/05/2005 | CN2730535Y High-cycle welding machine |
| 10/05/2005 | CN2730534Y Water cooling radiator |
| 10/05/2005 | CN1678165A Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 10/05/2005 | CN1676296A Die plate |
| 10/05/2005 | CN1676265A Bimetal splicing integrating process |
| 10/05/2005 | CN1676260A Solder handling system |
| 10/05/2005 | CN1676259A Welding method and circuit board using same |
| 10/05/2005 | CN1222202C Local welding method for printed substrate and apparatus thereof |
| 10/05/2005 | CN1222027C Pressure welding method and pressure welding device |
| 09/29/2005 | WO2005091354A1 Solder composition and method of bump formation therewith |
| 09/29/2005 | US20050214979 Semiconductor package and method for manufacturing the same |
| 09/29/2005 | US20050212140 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 09/29/2005 | US20050211751 Heat treatment; for joints between stainless steel components; impellers |
| 09/29/2005 | US20050211747 Metal transfer in arc welding |
| 09/29/2005 | US20050211746 Bonding apparatus |
| 09/29/2005 | DE10343652B4 Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit A method for forming a solder connection between a substrate and a contact element of a fuel cell unit and the fuel cell unit |
| 09/28/2005 | EP1579942A1 Method of manufacturing a heat exchanger |
| 09/28/2005 | EP1309420B1 Soldering method for mounting electric components |
| 09/28/2005 | CN1674991A Process and apparatus for producing honeycomb bodies and honeycomb body produced by the process |
| 09/28/2005 | CN1674221A Semiconductor package and method for manufacturing the same |
| 09/28/2005 | CN1220570C Jointed metallic parts and jointing method for the same parts |
| 09/27/2005 | US6949300 Product and method of brazing using kinetic sprayed coatings |
| 09/27/2005 | US6948557 Inner fin for heat exchanger flat tubes and evaporator |
| 09/27/2005 | CA2261258C A flux formulation |
| 09/22/2005 | WO2005087422A1 Process and device for soldering with a vacuum in the vapour phase |
| 09/22/2005 | US20050205647 Supplying shielding gas |
| 09/22/2005 | US20050205643 Desoldering sheath |
| 09/22/2005 | US20050205642 PCB manufacturing system |
| 09/22/2005 | US20050205641 Ultrasonic tool and ultrasonic bonder |
| 09/22/2005 | DE19847913B4 Vorrichtung und Verfahren zur optischen Inspektion insbesondere verdeckter Lötverbindungen Apparatus and method for optically inspecting particular hidden solder joints |
| 09/22/2005 | DE19838532B4 Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken A method and apparatus for placing and remelting formed solder material |
| 09/21/2005 | EP1577046A2 Method and device for fixing a functional member to a surface |
| 09/21/2005 | CN1672005A Convection furnace thermal profile enhancement |
| 09/21/2005 | CN1671502A Improved forge welding process and product obtained by such process |
| 09/21/2005 | CN1671272A 加热装置 Heating device |
| 09/21/2005 | CN1669715A Soldering tin forming device, method and continuous plating device |
| 09/21/2005 | CN1669714A Stainless steel composite steel pipe welding method |
| 09/21/2005 | CN1669713A Method for butting wires with small diameters |
| 09/21/2005 | CN1669712A Method for joining micro members |
| 09/21/2005 | CN1669687A Process for producing brazing hot rolled metal composite plate adopting composite cog |
| 09/21/2005 | CN1219624C Joined metal member and method of joining said member |
| 09/20/2005 | US6945447 Thermal solder writing eutectic bonding process and apparatus |
| 09/15/2005 | US20050199680 Rotating disk storage device and integrated wire head suspension assembly |
| 09/15/2005 | US20050199679 Sn-ag based lead-free solder |
| 09/15/2005 | US20050199615 Induction coil design for portable induction heating tool |
| 09/14/2005 | EP0827437B2 Nickel-chronium-based brazing alloys |
| 09/14/2005 | CN1669373A Jetting device and method at a jetting device |
| 09/14/2005 | CN1668804A Metal strand comprising interrupted filament |
| 09/14/2005 | CN1668409A Method and apparatus for vapour phase soldering |
| 09/14/2005 | CN1666839A Chip and carrier self-contrapositioning soft soldering method under gas protection |
| 09/13/2005 | US6942791 Apparatus and method for recycling of dross in a soldering apparatus |
| 09/13/2005 | US6942137 Die removal method and apparatus |
| 09/09/2005 | WO2005082570A1 Cooling apparatus comprising metal tubes connected through soldered lap joints |
| 09/08/2005 | US20050195527 Mounting method of magnetic head component, magnetic head device and manufacturing method of magnetic head device |
| 09/08/2005 | US20050194424 Apparatus and method for sonic welding and materials forming |
| 09/08/2005 | US20050194423 Ultrasonic bonding apparatus and method |
| 09/08/2005 | US20050194360 Method for resistance welding/brazing a tube to a member |
| 09/08/2005 | DE202005009576U1 Test device for soldering processes in soldering oven, comprises plate-shaped base which has holding fixtures for oxygen-sensitive sensors at various positions, also having a memory for measured data of oxygen concentration |
| 09/08/2005 | DE102004014749B3 Heating device for surface mount electronic components for making and/or breaking solder or adhesive connections has independently controllable radiating segments associated with at least one defined sub-pattern |
| 09/08/2005 | DE102004005944A1 Electrical connection element for electrical component for driving combustion engine injection valve has connecting pin cross-section at connection surface with smaller curvature than envelope circle enclosing cross-section |
| 09/08/2005 | DE10117088B4 Verfahren und Vorrichtung zur Herstellung von metallischen Wabenkörpern mit Strahlungsheizern Method and device for producing metallic honeycomb bodies with radiant heaters |
| 09/08/2005 | DE10032975B4 Verfahren zum Hartlöten von Aluminiumteilen A method of brazing of aluminum parts |
| 09/07/2005 | EP1151339B1 Method for constructing an optoelectronic assembly |
| 09/07/2005 | CN1665632A Reflow oven gas management system and method |
| 09/06/2005 | US6940168 Enhanced pad design for substrate |
| 09/06/2005 | US6940053 Chip bonding heater with differential heat transfer |