Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
06/2001
06/14/2001WO2001043269A2 Method and apparatus for making an electrical device
06/13/2001EP1106952A2 Heat exchanger, refrigeration system, air conditioner, and method and apparatus for fabricating heat exchanger
06/13/2001EP1106947A1 Heating device
06/13/2001EP1106294A2 Soldering machine
06/13/2001DE10054394A1 Widerstandsfähige Dickschichtleiter Durable thick film conductor
06/07/2001WO2001039922A1 Soldering flux
06/05/2001US6241141 Reflow soldering self-aligning fixture
06/05/2001US6240972 Multi-wound metal tube
05/2001
05/31/2001WO2001038040A1 Aluminium product with excellent brazing characteristics
05/31/2001WO2001038032A1 Method and device for flux-free soldering with reactive gas-enriched molten metals
05/31/2001DE19955659A1 Flux medium-free solder device with reactive gas enriched metal melting for electronic components, has solder container for molten solder material, and gas delivery device for introducing reducing reactive gas
05/30/2001EP1102655A1 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
05/30/2001CN1066494C Process for producing metal-bonded-ceramic material
05/30/2001CN1066373C Method for dry fluxing of metallic surface before soldering or tinning
05/29/2001US6237831 Solder collecting capsule and solder extracting desoldering tool using same
05/25/2001WO2001037624A1 Apparatus and method for connecting printed circuit boards through soldered lap joints
05/24/2001US20010001508 Enhanced pad design for substrate
05/24/2001US20010001468 Apparatus for the temperature regulation of electronic components
05/24/2001US20010001464 Apparatus and method for bonding conductors using induction heating
05/23/2001EP1101559A2 MAG soldering method and use of a protective gas
05/23/2001EP1101393A1 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor
05/23/2001EP1100644A1 Method for brazing by solder reflow electronic components and brazing device therefor
05/23/2001DE19953654A1 Verfahren und Vorrichtung zur Herstellung einer Lotverbindung Method and apparatus for producing a solder joint
05/23/2001DE10026067A1 Düsen-Lotzufuhrgerät und Lötverfahren Nozzle Lotzufuhrgerät and soldering
05/22/2001US6235208 Mixing with separation agent; removal floating solder oxide on melt
05/22/2001US6234380 Apparatus and method for inerting a wave soldering installation
05/22/2001US6234377 Brazing composition for aluminum material, aluminum material for brazing, and method of brazing aluminum material
05/22/2001US6234243 Heat exchanger assembly with magnesium barrier
05/17/2001WO2001034339A1 Hermetic sealing of target/backing plate assemblies using electron beam melted indium or tin
05/17/2001WO2001034335A1 Compact reflow and cleaning apparatus
05/17/2001WO2001034334A1 Method and device for producing a soldered joint
05/17/2001WO2001007856A3 Method for manufacturing a double-walled heat exchanging tube with leak detection
05/17/2001US20010001184 Use of a cleaning process, a cleaning process, a connection process and a workpiece pair
05/17/2001CA2390587A1 Compact reflow and cleaning apparatus
05/16/2001CN1065849C Method of surface bonding meterials together by use of metal matrix composite
05/15/2001US6231088 Heat exchanger header box connector and method of fixing same
05/15/2001US6230962 Process for cooling soldered objects
05/10/2001WO2001032584A1 Joining method for ceramics and metal and joined body of ceramics and metal joined by the method
05/10/2001WO2001032351A1 Composition for preventing creeping of a flux for soldering and use thereof
05/10/2001WO2001032344A1 Apparatus for monitoring a solder wave
05/10/2001DE10054100A1 Soldering machine has solder spraying openings in several rows in relation to the direction in which the substrate is transported
05/09/2001EP1097020A1 Solder ball placement apparatus
05/09/2001EP1097019A1 Method for controlling heat transfer on a work piece during condensation soldering
05/09/2001CN2429290Y Electromagnet pump style single-double spike generator for liquid metal brazing
05/09/2001CN1294541A Fluxing agent
05/09/2001CN1065463C Method of wave-solding assembled units and appts. of applicating this method
05/08/2001US6229124 Inductive self-soldering printed circuit board
05/08/2001US6227724 Method for constructing an optoelectronic assembly
05/08/2001US6227436 Method of fabricating an electronic circuit device and apparatus for performing the method
05/08/2001US6227434 Reworking of a ball grid array module
05/03/2001WO2001030531A1 Fluxing agent for dry application
05/03/2001WO2001030528A1 Process for manufacturing of brazed multi-channeled structures
05/03/2001WO2001030527A1 Chain/ring making brazing furnace
05/03/2001DE19952043A1 Process for metal-protective gas soldering of metallic workpieces uses solder material and an electric arc with melting or non-melting electrodes in the presence of a protective gas having an inert component and an active component
05/01/2001US6225206 Flip chip C4 extension structure and process
05/01/2001US6223976 Process for the assembly or refacing of titanium aluminide articles by diffusion brazing
05/01/2001US6223975 Method and apparatus for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like
05/01/2001US6223973 Apparatus and method for connecting printed circuit boards through soldered lap joints
05/01/2001US6223972 Method and apparatus for forming metal foil and solder assembled objects
05/01/2001US6223969 Method and machine for wave soldering or tinning
05/01/2001US6223968 Solder bonding/debonding nozzle insert
05/01/2001CA2239963C Soldering method and apparatus
04/2001
04/26/2001WO2001028726A1 Solder coating material and production method therefor
04/25/2001EP1094291A2 Plate heat exchanger
04/25/2001EP1093882A1 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method
04/25/2001EP1093880A1 Method and apparatus for selective heating of components
04/25/2001EP1093879A2 Tip cap hole brazimg and oxidation resistant alloy therefor
04/24/2001US6222150 Joined metal member and a method and an apparatus for fabricating the same
04/24/2001US6221511 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method
04/24/2001US6221507 High temperature laminated structural panels and method of producing the same
04/24/2001US6221197 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent
04/24/2001US6221129 Subjecting flux material comprising potassium salt of complex aluminum fluoride selected from the group consisting of reversibly dehydrated k2alf5 and k2alf5.h2o to heat treatment to form irreversibly dehydrated product
04/24/2001US6220503 Rework and underfill nozzle for electronic components
04/24/2001US6220501 Metallic substrates are coated with an undercoat alloy of tin and zinc and contacted with each other through a mixture containing zinc and tin and flux, heating substrate to melt the solder, solidififying to join metallic member
04/24/2001US6220500 Welding method for fluorine-passivated member for welding, fluorine-passivation method after being weld, and welded parts
04/24/2001US6220497 Method for soldering microstructured sheet metal
04/19/2001WO2001028304A1 Reflowing furnace
04/19/2001WO2001027547A1 Method and device for tempering components, e.g. semi-conductor circuits, circuit boards and the like
04/18/2001EP1092338A1 Assembly of an electronic component with spring packaging
04/18/2001EP1091800A1 Method for producing a compact catalytic reactor
04/17/2001US6218030 Soldered product
04/17/2001US6216939 Method for making a hermetically sealed package comprising at least one optical fiber feedthrough
04/17/2001US6216938 Machine and process for reworking circuit boards
04/17/2001US6216937 Process and apparatus to remove closely spaced chips on a multi-chip module
04/12/2001WO2001024962A1 Good hermetic seals and method for making them
04/12/2001WO2000071764A3 Cobalt-base composition and method for diffusion braze repair of superalloy articles
04/12/2001US20010000208 Apparatus and method for non-destructive, low stress removal of soldered electronic components
04/12/2001DE19948606A1 Verfahren und Vorrichtung zum Temperieren von Bauteilen, zB Halbleiterschaltkreisen und dergl. Method and apparatus for controlling the temperature of components such as semiconductor circuits and the like.
04/12/2001DE19945131A1 Elektronisches Bauelement und Beschichtungs-Mittel Electronic component and coating agent
04/11/2001EP1091020A1 A method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles
04/11/2001EP1090706A1 Apparatus and method for bonding conductors
04/10/2001US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry
04/10/2001US6214218 Soldering apparatus and agent for separating solder and solder oxides
04/10/2001US6213383 A nickel titanium alloy part constituting a frame for spectacles is inserted in then caulked to a bore formed in a joint piece made of a resistance-weldable or resistance-brazeable titanium material
04/08/2001CA2322270A1 Apparatus and method for bonding conductors
04/05/2001DE10048212A1 Aluminum heat exchanger with soldered connecting area has core area comprising several pairs of first and second plates laminated and soldered with one another, each first and second plate being formed by core component
04/05/2001DE10045656A1 Doubled heat exchanger has first core for effecting heat exchange between first fluid and air and comprising several first small tubes through which first fluid flows
04/04/2001EP1089047A2 Tube for heat exchanger
04/04/2001CN1289891A Non-circular metal honeycombs and manufacture thereof
04/03/2001US6209774 Method of spray brazing automotive assemblies