Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2015
02/26/2015WO2015025777A1 Desmearing method and desmearing apparatus
02/26/2015WO2015024990A1 Conductive pastes or inks comprising nanometric chemical frits
02/26/2015WO2015024541A1 Method for producing metal-ceramic substrates, and metal-ceramic substrate
02/26/2015US20150057516 Fully wireless continuously wearable sensor for measurement of eye fluid
02/26/2015US20150057393 Insulating resin composition for printed circuit board and products manufactured by using the same
02/26/2015US20150056434 Curable resin composition, film, laminated film, prepreg, laminate, cured article, and composite article
02/26/2015US20150056385 Copper wiring structure forming method
02/26/2015US20150056383 High Resolution Printing
02/26/2015US20150055313 Combined wiring board and method for manufacturing combined wiring board
02/26/2015US20150055312 Interposer substrate and method of manufacturing the same
02/26/2015US20150055311 Electronic component with coil, method for manufacturing the same and power supply module
02/26/2015US20150054356 Solid state relay
02/26/2015US20150053950 Method for manufacturing transparent electrode, transparent electrode, and organic electronic device
02/26/2015US20150053858 Bolometric Detector With A Compensation Bolometer Having An Enhanced Thermalization
02/26/2015US20150053664 Direct writing bus bars for screen printed resin-based conductive inks
02/26/2015US20150053662 Heating elements for aircraft heated floor panels
02/26/2015US20150053643 Hot melt compositions with improved etch resistance
02/26/2015US20150053466 Printed circuit board and method for manufacturing same
02/26/2015US20150053465 Thin flexible circuits
02/26/2015US20150053464 Synthetic method of suppressing metal nano-particle from having oxidized film and method of manufacturing conductive metal thin film via solution-processed
02/26/2015US20150053463 Rigid flex board module and the manufacturing method thereof
02/26/2015US20150053459 Patterning of electrically conductive films
02/26/2015US20150053457 Printed circuit board and method of manufacturing the same
02/26/2015US20150053456 Printed circuit board and manufacturing method thereof
02/26/2015US20150052747 Manufacturing method of touch substrate
02/26/2015US20150052745 Component mounting method
02/26/2015DE102014010775A1 Harzzusammensetzung zur Lötpunktbildung, Lötpunkt-Bildungsverfahren und Bauelement mit Lötpunkten Resin composition for Lötpunktbildung, solder-forming method and device with solder bumps
02/26/2015DE102013216472A1 Elektrische Kontaktanordnung für einen Elektromotor und Verfahren zur Herstellung The electrical contact assembly for an electric motor and methods of making
02/26/2015DE102013013842A1 Verfahren zum Herstellen von Metall-Keramik-Substraten sowie Metall-Keramik-Substrat A method for producing metal-ceramic substrates, and metal-ceramic substrate
02/25/2015EP2840874A1 Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board
02/25/2015EP2840873A1 Robot system
02/25/2015EP2840872A1 Electronic device and method of manufacturing electronic device
02/25/2015EP2838730A2 Material deposition system and method for depositing materials on a substrate
02/24/2015US8965712 Life predicting method for solder joint, life predicting apparatus for solder joint and electronic device
02/24/2015US8964410 Transformer with externally-mounted rectifying circuit board
02/24/2015US8964403 Wiring board having a reinforcing member with capacitors incorporated therein
02/24/2015US8964402 Electronic device, interposer and method of manufacturing electronic device
02/24/2015US8963675 Method for fabricating a carrier with a three dimensional inductor and structure thereof
02/24/2015US8963672 Wiring board
02/24/2015US8963135 Integrated circuits and systems and methods for producing the same
02/24/2015US8963020 Process for making stubless printed circuit boards
02/24/2015US8963019 Manufacturing method of circuit board
02/24/2015US8963017 Multilayer board
02/24/2015US8963016 Printed wiring board and method for manufacturing same
02/24/2015US8963012 Flexible circuit board
02/24/2015US8962999 Main housing element of a multi-part housing and method for assembling a housing
02/24/2015US8962712 Photosensitive resin composition, dry film thereof, and printed wiring board using them
02/24/2015US8962388 Method and apparatus for supporting a computer chip on a printed circuit board assembly
02/24/2015US8962085 Wetting pretreatment for enhanced damascene metal filling
02/24/2015US8961835 Conductive metal ink composition and method for forming a conductive pattern
02/24/2015US8961729 Method for manufacturing touch panel
02/24/2015US8961725 Component placement on flexible and/or stretchable substrates
02/24/2015US8961678 Organic solderability preservative and method
02/24/2015US8961231 Retention mechanisms for electrical connectors
02/24/2015US8960526 Flux for soldering and soldering process
02/24/2015US8959762 Method of manufacturing an electronic module
02/24/2015US8959761 Method of manufacturing polymer electrode and polymer actuator employing the polymer electrode
02/24/2015US8959760 Printed wiring board and method for manufacturing same
02/24/2015US8959759 Method for assembling computer modules small in thickness
02/24/2015US8959758 Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device
02/24/2015US8959757 Method of manufacturing an electronic module
02/24/2015US8959756 Method of manufacturing a printed circuit board having an embedded electronic component
02/19/2015WO2015023637A1 Conductor pad for flexible circuits and flexible circuit incorporating the same
02/19/2015WO2015023370A1 Submicron silver particle ink compositions, process and applications
02/19/2015WO2015023295A1 Adhesion promotion in printed circuit boards
02/19/2015WO2015022885A1 Alkali-developable photocurable thermosetting resin composition and printed wiring board using same
02/19/2015WO2015022875A1 Printed circuit board inspection device
02/19/2015WO2015022748A1 Ceramic circuit board manufacturing method, and ceramic circuit board
02/19/2015WO2015021775A1 Back drilling method and system for pcb
02/19/2015US20150050504 Core substrate and method of manufacturing the same
02/19/2015US20150050473 Resin composition, printed circuit board using the composition, and method of manufacturing the same
02/19/2015US20150050430 Annealing process for integrated gas sensors
02/19/2015US20150050418 Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board
02/19/2015US20150049970 Sensor for wear measurement, method for making same, and method for operating same
02/19/2015US20150049498 Glass based multichip package
02/19/2015US20150049450 Electronic device and method of manufacturing electronic device
02/19/2015US20150049447 Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same
02/19/2015US20150049446 Embedded electronic component and method of manufacturing electronic component embedded substrate
02/19/2015US20150049445 Method for manufacturing electronic component embedding substrate and electronic component embedding substrate
02/19/2015US20150049444 Conductor pad for flexible circuits and flexible circuit incorporating the same
02/19/2015US20150049441 Circuit board with corner hollows
02/19/2015US20150049409 Display panel and method of manufacturing the same
02/19/2015US20150048148 Electromagnetic Field Assisted Self-Assembly With Formation Of Electrical Contacts
02/19/2015US20150048147 Laser light source device and method for manufacturing laser light source device
02/19/2015US20150047977 Automatic coding device, biosensor with same and manufacturing method therefor
02/19/2015US20150047897 Method and apparatus for use in providing wire strain relief with environmentally protected irrigation devices
02/19/2015US20150047892 Pcb backdrilling method and system
02/19/2015US20150047891 Integrated Circuit Features with Fine Line Space and Methods for Forming the Same
02/19/2015US20150047885 Patterned conductive film, method of fabricating the same, and application thereof
02/19/2015US20150047884 Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
02/19/2015US20150047882 Graphitic Substrates with Ceramic Dielectric Layers
02/19/2015US20150047188 Methods of segmented through hole formation using dual diameter through hole edge trimming
02/19/2015US20150047187 Method and Apparatus for Manufacturing Electronic Devices
02/19/2015US20150047185 Electrode joining method, production method of electrode joined structure, and production system of electrode joined structure
02/19/2015DE112013002665T5 Polymerdickfilm-Vorrichtung Polymer thick film device
02/19/2015DE102013013464A1 Elektronisches Bauteil Electronic component
02/18/2015EP2838328A1 Ball mounting method and substrate-working machine
02/18/2015EP2838123A1 Welding device for connecting solar cells
02/18/2015EP2837458A1 System for laser beam soldering having a soldering wire feeder system and a coated wire feeder system
02/17/2015US8958214 Motherboard assembly for interconnecting and distributing signals and power
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