| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/17/2015 | US8958213 Mounting structure of chip component |
| 02/17/2015 | US8958209 Electronic power module, and method for manufacturing said module |
| 02/17/2015 | US8957830 PCB antenna layout |
| 02/17/2015 | US8957324 Interconnect for high-frequency printed circuit |
| 02/17/2015 | US8957323 Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same |
| 02/17/2015 | US8957322 Conductive films having low-visibility patterns and methods of producing the same |
| 02/17/2015 | US8957321 Printed circuit board, mount structure thereof, and methods of producing these |
| 02/17/2015 | US8957320 Printed wiring board |
| 02/17/2015 | US8957319 Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same |
| 02/17/2015 | US8957315 Stabilization agents for silver nanowire based transparent conductive films |
| 02/17/2015 | US8956969 Hole formation method, multilayer wiring, semiconductor device, display element, image display device, and system containing via hole formed by the hole formation method |
| 02/17/2015 | US8956922 Coating method for an optoelectronic chip-on-board module |
| 02/17/2015 | US8956916 Multi-chip module with stacked face-down connected dies |
| 02/17/2015 | US8956732 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 02/17/2015 | US8956702 Resin composition for insulating layer for multi-layered printed board |
| 02/17/2015 | US8955218 Method for fabricating package substrate |
| 02/17/2015 | US8955216 Method of making a compliant printed circuit peripheral lead semiconductor package |
| 02/17/2015 | US8955215 High performance surface mount electrical interconnect |
| 02/17/2015 | US8955214 Mounting of a conductor on a tubular cover |
| 02/12/2015 | WO2015021202A1 Forming a conductive image using high speed electroless platin |
| 02/12/2015 | WO2015020814A1 Photonic activation of reactants for sub-micron feature formation using depleted beams |
| 02/12/2015 | WO2015019933A1 Mold release film |
| 02/12/2015 | WO2015019667A1 Conductive bonding agent and soldered joint |
| 02/12/2015 | WO2015019666A1 Electrically conductive adhesive agent, joined body, and joint |
| 02/12/2015 | WO2015019602A1 Circuit substrate and semiconductor device |
| 02/12/2015 | WO2015019519A1 Dc-dc converter module |
| 02/12/2015 | WO2015019423A1 Electronic circuit connecting structure |
| 02/12/2015 | WO2015019417A1 Screen printing machine |
| 02/12/2015 | WO2015019266A1 Compound to form electrical tracks into |
| 02/12/2015 | US20150045980 Power Monitoring System and a Reduced Impedance Method for the Power Monitoring System |
| 02/12/2015 | US20150044492 Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil |
| 02/12/2015 | US20150044425 Method for processing resin product and resin product |
| 02/12/2015 | US20150044388 Plating method and product |
| 02/12/2015 | US20150044359 Method of manufacturing a thin support package structure |
| 02/12/2015 | US20150043189 Circuit module and method of producing the same |
| 02/12/2015 | US20150043188 Method For Manufacturing A Printed Circuit Board, Printed Circuit Board And Rear View Device |
| 02/12/2015 | US20150043187 Foldable display apparatus and method of manufacturing the same |
| 02/12/2015 | US20150043184 Circuit substrate and electronic device |
| 02/12/2015 | US20150043172 Circuit module and method of producing circuit module |
| 02/12/2015 | US20150043170 Circuit module and method of producing the same |
| 02/12/2015 | US20150043125 Multilayer ceramic electronic part, board having the same mounted thereon, and manufacturing method thereof |
| 02/12/2015 | US20150041555 Device, system, and method for tracking the configuration or operational history of a nozzle in a fluid jetting system |
| 02/12/2015 | US20150041525 Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig |
| 02/12/2015 | US20150041428 Methods of manufacturing printed circuit boards with stacked micro vias |
| 02/12/2015 | US20150041208 Micro mechanical anchor for 3d architecture |
| 02/12/2015 | US20150041206 Laminate for printed circuit board, printed circuit board using the same, and method of manufacturing the same |
| 02/12/2015 | US20150041200 Soldering method and corresponding soldering device |
| 02/12/2015 | US20150041192 Printed circuit board and method of manufacturing the same |
| 02/12/2015 | US20150041191 Printed circuit board and preparation method thereof |
| 02/12/2015 | US20150041190 High voltage polymer dielectric capacitor isolation device |
| 02/12/2015 | US20150041188 Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate |
| 02/12/2015 | US20150041181 Process for the preparation of printed wiring board, laminate, laminate film and non-curable resin composition used for the printed wiring board, and printed wiring board prepared by the process |
| 02/12/2015 | US20150041180 Printed circuit board and method of manufacturing the same |
| 02/12/2015 | US20150041053 Method of Manufacturing Wiring Substrate |
| 02/12/2015 | US20150040392 Printed circuit board and method for manufacturing same |
| 02/12/2015 | US20150040391 Systems and methods for making and using electrical stimulation systems with improved rf compatibility |
| 02/12/2015 | US20150040390 Method of manufacturing laser diode unit utilizing submount bar |
| 02/12/2015 | US20150040389 Method for manufacturing wiring board with built-in electronic component |
| 02/12/2015 | US20150040388 Application of Dielectric Layer and Circuit Traces on Heat Sink |
| 02/12/2015 | US20150040379 Wired circuit board and producing method thereof |
| 02/12/2015 | DE10392850B4 Verfahren und Vorrichtung zur Durchführung von Operationen auf der Oberfläche eines Elektroniksubstrats sowie Vorrichtung zum Abstützen eines Elektroniksubstrats Method and apparatus for performing operations on the surface of an electronic substrate, as well as apparatus for supporting an electronic substrate |
| 02/12/2015 | DE102013215592A1 Leistungselektronische Schaltung mit planarer elektrischer Kontaktierung Power electronic circuit with planar electrical contact |
| 02/12/2015 | DE102013215588A1 Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren Printed circuit board assembly, control device for a cooling fan module and method |
| 02/12/2015 | DE102013108535A1 Verfahren zum Herstellen einer Platine, Platine und Rückblickvorrichtung A method of manufacturing a circuit board, circuit board and rear-view device |
| 02/11/2015 | EP2836056A1 Manufacturing method for heat-dissipating substrate |
| 02/11/2015 | EP2835956A1 Mobile electronic device and methods of manufacture thereof |
| 02/11/2015 | EP2835204A1 Soldering device and method, and manufactured substrate and electronic component |
| 02/11/2015 | EP2834579A1 Reflow oven and methods of treating surfaces of the reflow oven |
| 02/11/2015 | CN204157218U 一种smt贴片飞达备料车 One kind of preparation smt chip feeder car |
| 02/11/2015 | CN204157173U 一种通用过炉治具 A general governance of the furnace |
| 02/11/2015 | CN204157172U 一种用于led贴片机的自动进出灯板装置 An automatic placement machine led out of the light board means for |
| 02/11/2015 | CN204157171U 一种用于led贴片机的自动喂料装置 An automatic feeding device for led Mounter |
| 02/11/2015 | CN204157170U 一种led封装设备的贴装头 One kind of led packaging equipment placement head |
| 02/11/2015 | CN204157169U 一种全自动蚀刻工艺流水线 A fully automated assembly line etching process |
| 02/11/2015 | CN204157168U 全自动在线式烤炉 Automatic on-line oven |
| 02/11/2015 | CN204157167U 真空刻蚀线传送装置 Vacuum Conveyor Etching |
| 02/11/2015 | CN204157166U 一种拼装电路板分板装置 One kind of assembled circuit board sub-board device |
| 02/11/2015 | CN204157165U 软性印刷线路板压膜机 Flexible printed circuit board lamination machine |
| 02/11/2015 | CN204148684U 用于在工件的焊接期间提供惰性气体的设备 For providing an inert gas during welding workpiece equipment |
| 02/11/2015 | CN204148681U 一种新型浸焊机 A new Baptist welder |
| 02/11/2015 | CN204148679U 一种pcb板焊接机构 One kind pcb board welding mechanism |
| 02/11/2015 | CN104350421A 感光性组合物及具有其固化层的印刷电路板 The photosensitive composition and a printed circuit board having a cured layer |
| 02/11/2015 | CN104349614A 多层印刷线路板的制造方法 The method of manufacturing a multilayer printed wiring board |
| 02/11/2015 | CN104349613A 印刷电路板及其制作方法 Printed circuit board and its manufacturing method |
| 02/11/2015 | CN104349612A 多层电路板的制作方法和该方法制备的电路板 The method of making a multilayer circuit board and a circuit board to the preparation of |
| 02/11/2015 | CN104349611A 模组化电感装置的制造方法 The method of manufacturing modular inductive means |
| 02/11/2015 | CN104349610A 印制电路板子板及印制电路板的制造方法和印制电路板 Printed circuit board and board manufacturing method of the printed circuit board and the printed circuit board |
| 02/11/2015 | CN104349609A 印刷线路板及其制作方法 Printed circuit board and manufacturing method thereof |
| 02/11/2015 | CN104349608A 一种印制电路板背钻的处理方法及印制电路板 A printed circuit board processing method backdrilled and printed circuit board |
| 02/11/2015 | CN104349607A 线路板阻焊塞孔的加工方法 PCB plug hole solder processing methods |
| 02/11/2015 | CN104349606A 焊膏印刷装置和焊膏印刷方法 Solder paste printing solder paste printing apparatus and method |
| 02/11/2015 | CN104349605A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof |
| 02/11/2015 | CN104349604A 一种印刷线路板用固定插板 A printed wiring board fixed flapper |
| 02/11/2015 | CN104349603A 一种贴片机贴片头的贴片方法及装置 SMD placement machine posted a method and apparatus for titles |
| 02/11/2015 | CN104349602A 薄膜形成方法及薄膜形成装置 A thin film forming method and film forming apparatus |
| 02/11/2015 | CN104349601A 布线基板的制造方法 The method of manufacturing a wiring board |
| 02/11/2015 | CN104349600A 一种fpc自动贴板机 One kind of paste board fpc automatic machine |
| 02/11/2015 | CN104349599A 部件安装基板的制造方法 Component mounting substrate manufacturing method |
| 02/11/2015 | CN104349598A 一种阶梯电路板作方法、阶梯电路板 One kind of ladder circuit board practices, ladder board |
| 02/11/2015 | CN104349595A 一种抗磁场干扰两块pcb开口罗氏线圈设计方法与实现 An anti-magnetic interference Rogowski coil opening two pcb design methodology and implementation |