| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/11/2015 | CN104349594A 一种抗磁场干扰多块pcb开口罗氏线圈设计方法与实现 An anti-magnetic interference multiple openings pcb Rogowski coil design methods and implementation |
| 02/11/2015 | CN104349592A 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method |
| 02/11/2015 | CN104349591A 用于制造印刷电路板的方法、印刷电路板和后视装置 A method for manufacturing a printed circuit board, the printed circuit board and a rearview device |
| 02/11/2015 | CN104349589A 印刷电路板以及印刷电路板及其盘中孔的制作方法 A printed circuit board and a method of manufacturing a printed circuit board and disk hole |
| 02/11/2015 | CN104349588A 电路板及其制作方法 Board and its production method |
| 02/11/2015 | CN104349587A 一种印制电路板及其盘中孔的制作方法、以及印制电路板 One of a printed circuit board and method of making the disc hole, and the printed circuit board |
| 02/11/2015 | CN104349586A 一种陶瓷基锰覆线pcb及其制备方法 A ceramic-based coating line pcb manganese and its preparation method |
| 02/11/2015 | CN104349585A 电路板及其制作方法 Board and its production method |
| 02/11/2015 | CN104349581A 布线电路基板和其制造方法 Wired circuit board and manufacturing method thereof |
| 02/11/2015 | CN104349580A 多层配线基板及其制造方法与半导体制品 Multilayer wiring board and its manufacturing method and a semiconductor article |
| 02/11/2015 | CN104349577A 双面压接背板及其钻孔方法 Sided crimp back its drilling method |
| 02/11/2015 | CN104349575A 柔性电路板及其制作方法 Flexible circuit board and its manufacturing method |
| 02/11/2015 | CN104349574A 电路板及其制作方法 Board and its production method |
| 02/11/2015 | CN104349571A 柔性电路板及其制作方法 Flexible circuit board and its manufacturing method |
| 02/11/2015 | CN104349570A 软硬结合电路板及制作方法 Rigid-flex circuit boards and production methods |
| 02/11/2015 | CN104347541A 电路模块以及电路模块的制造方法 The method of manufacturing a circuit module and circuit module |
| 02/11/2015 | CN104342744A 夹具及具备该夹具的保持器 Jig and provided with the jig holder |
| 02/11/2015 | CN103069340B 光反应性树脂组合物 Photoreactive resin composition |
| 02/11/2015 | CN102917543B 高低落差板防钻偏方法 Gap between the level of partial plate anti-drilling method |
| 02/11/2015 | CN102883542B 基板表层线路图形制作方法 Substrate surface line graphics production method |
| 02/11/2015 | CN102883541B 等离子体去夹膜方法 The plasma membrane to clamp method |
| 02/11/2015 | CN102811558B 一种厚底铜盲埋孔板的制作方法 A method of making a copper bottomed blind buried orifice |
| 02/11/2015 | CN102686046B 一种降低波峰焊受热引起led灯珠死灯率的方法 One way heat wave caused the death lamp led lamp beads reduced rate |
| 02/11/2015 | CN102548240B Led贴片机双臂多头贴片系统 Led SMD placement machine long arm system |
| 02/11/2015 | CN102460656B 太阳能电池的制造方法 The method of manufacturing a solar cell |
| 02/11/2015 | CN102265708B 高数据率连接器系统 High data rate connector system |
| 02/10/2015 | US8952540 In situ-built pin-grid arrays for coreless substrates, and methods of making same |
| 02/10/2015 | US8952511 Integrated circuit package having bottom-side stiffener |
| 02/10/2015 | US8952474 Method of fabricating backside-illuminated image sensor |
| 02/10/2015 | US8952288 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other |
| 02/10/2015 | US8952271 Circuit board, semiconductor device, and method of manufacturing semiconductor device |
| 02/10/2015 | US8952270 Multilayer wiring board having lands with tapered side surfaces |
| 02/10/2015 | US8952269 Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor |
| 02/10/2015 | US8952267 Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same |
| 02/10/2015 | US8952262 Component-incorporated wiring substrate and method of manufacturing the same |
| 02/10/2015 | US8952260 Circuit boards defining regions for controlling a dielectric constant of a dielectric material |
| 02/10/2015 | US8952259 Method for producing a ceramic component, ceramic component and component assembly |
| 02/10/2015 | US8951612 Method for processing a surface |
| 02/10/2015 | US8951427 Hot melt composition and a method and system for manufacturing electronic and/or optical components using such a hot melt composition |
| 02/10/2015 | US8951379 Tape attaching device and tape attaching method |
| 02/10/2015 | US8950925 Light emitting apparatus and light unit having the same |
| 02/10/2015 | US8950892 Methods for combining light emitting devices in a white light emitting apparatus that mimics incandescent dimming characteristics and solid state lighting apparatus for general illumination that mimic incandescent dimming characteristics |
| 02/10/2015 | US8950321 Screen printing device and screen printing method |
| 02/10/2015 | US8950068 Systems and methods for encapsulating electronics in a mountable device |
| 02/10/2015 | US8950067 Method for manufacturing electronic component device with a Ni—Bi alloy sealing frame |
| 02/10/2015 | US8950066 Method for manufacturing light emitting diode module |
| 02/10/2015 | US8950065 Weld gun part clamp device and method |
| 02/10/2015 | US8950064 Component mounting device and component mounting method |
| 02/10/2015 | US8950063 Methods of manufacturing printed circuit boards with stacked micro vias |
| 02/05/2015 | WO2015017171A1 Method of forming conductive trace |
| 02/05/2015 | WO2015016401A1 Flexible printed circuit board and manufacturing method therefor |
| 02/05/2015 | WO2015016362A1 Photosensitive-resin composition |
| 02/05/2015 | WO2015016360A1 Photosensitive-resin composition |
| 02/05/2015 | WO2015016289A1 Wiring base plate and electronic device |
| 02/05/2015 | WO2015016173A1 Wiring substrate, wiring substrate with lead, and electronic device |
| 02/05/2015 | WO2015016169A1 Method for producing conductive adhesive film, conductive adhesive film, and method for producing connection body |
| 02/05/2015 | WO2015016168A1 Method for producing conductive adhesive film, conductive adhesive film, and method for producing connection body |
| 02/05/2015 | WO2015016167A1 Method for manufacturing electroconductive adhesive film, electroconductive adhesive film, and method for manufacturing connection body |
| 02/05/2015 | WO2015016165A1 Substrate for electronic material |
| 02/05/2015 | WO2015015975A1 Multilayer substrate and method for manufacturing multilayer substrate |
| 02/05/2015 | WO2015015959A1 High-frequency signal transmission line and electronic device |
| 02/05/2015 | WO2015015918A1 Electroconductive-film-forming composition and method for producing electroconductive film |
| 02/05/2015 | WO2015015837A1 Nozzle device |
| 02/05/2015 | WO2015015830A1 Soldering apparatus and soldering method |
| 02/05/2015 | WO2015015746A1 Wiring substrate and method for producing same |
| 02/05/2015 | WO2015015484A1 A system and method for producing a conductive path on a substrate |
| 02/05/2015 | WO2015014697A1 Electronic module having circuit boards and a plastic sealing ring that can be molded on by injection molding, in particular for a motor vehicle transmission control unit, and method for producing said electronic module |
| 02/05/2015 | WO2015014408A1 Component carrier assemblage for optoelectronic semiconductor components |
| 02/05/2015 | WO2015014051A1 Manufacturing method for back drilling hole in pcb and pcb |
| 02/05/2015 | WO2015014048A1 Rigid-flex printed circuit board and manufacturing method therefor |
| 02/05/2015 | US20150037611 Wiring board, mounting structure using same, and method of manufacturing wiring board |
| 02/05/2015 | US20150037603 Articles including metal structures having maximized bond adhesion and bond reliability, and methods of forming the same |
| 02/05/2015 | US20150037544 Reflective photomask blank, reflective photomask, and integrated circuit device manufactured by using reflective photomask |
| 02/05/2015 | US20150036309 Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer |
| 02/05/2015 | US20150036307 Circuit board |
| 02/05/2015 | US20150036305 Electronic component built-in multi-layer wiring board and method of manufacturing the same |
| 02/05/2015 | US20150036302 Long-term packaging for the protection of implant electronics |
| 02/05/2015 | US20150036278 Composite socket probing platform for a mobile memory interface |
| 02/05/2015 | US20150035720 Thermoplastic composition |
| 02/05/2015 | US20150034700 Reflow treating unit & substrate treating apparatus |
| 02/05/2015 | US20150034590 Method for producing printed-wiring board |
| 02/05/2015 | US20150034589 System and method for forming patterned copper lines through electroless copper plating |
| 02/05/2015 | US20150034378 Printed wiring board |
| 02/05/2015 | US20150034377 Glass core substrate and method for manufacturing the same |
| 02/05/2015 | US20150034375 Circuit board assembly with pads and connection lines having same resistance value as the pads and impedance matching method |
| 02/05/2015 | US20150034374 Printed wiring board and method for manufacturing printed wiring board |
| 02/05/2015 | US20150034373 Wiring structure and manufacturing method thereof |
| 02/05/2015 | US20150034370 White color coating layer-formed touch screen panel and white color coating layer vacuum coating method of touch screen panel |
| 02/05/2015 | US20150034369 Resin composition for printed wiring boards |
| 02/05/2015 | US20150034365 Method for manufacturing wiring board and wiring board |
| 02/05/2015 | US20150034363 Slot design for flexible and expandable system architecture |
| 02/05/2015 | US20150033557 System and method for producing a conductive path on a substrate |
| 02/05/2015 | US20150033556 Flexible film carrier to increase interconnect density of modules and methods thereof |
| 02/05/2015 | US20150033555 Component mounting method and component mounting device |
| 02/05/2015 | US20150033554 Organic module emi shielding structures and methods |
| 02/05/2015 | US20150033552 System and Method for Manufacturing a Swallowable Sensor Device |
| 02/05/2015 | DE112013001716T5 Doppelseitige Leiterplatte und Verfahren zum Herstellen derselben Double-sided printed circuit board and method of manufacturing the same |
| 02/05/2015 | DE102013215368A1 Elektronische Einheit mit Leiterplatte Electronic unit with PCB |
| 02/05/2015 | DE102013215066A1 Verfahren zur herstellung einer stoffschlüssigen verbindung und eines leistungshalbleitermoduls A process for preparing a cohesive connection and a power semiconductor module |
| 02/04/2015 | EP2833705A1 Electroconductive pattern, electric circuit, electromagnetic wave shield, and method for manufacturing electroconductive pattern |