Patents for H05K 1 - Printed circuits (98,583)
10/2013
10/23/2013CN103370994A A method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly
10/23/2013CN103370993A A connection pin for mounting in a component carrier, a method for producing an electronic assembly comprising a motherboard with stackable modules comprising a component carrier, and such an electronic assembly
10/23/2013CN103370763A Conductor fuse
10/23/2013CN103370388A Circuit connection material, connection method using same, and connection structure
10/23/2013CN103370371A Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board
10/23/2013CN103369875A 电路板及其制作方法 Circuit board and its manufacturing method
10/23/2013CN103369874A Method for manufacturing wiring substrate and wiring substrate
10/23/2013CN103369871A Multi-layer printed circuit board and manufacturing method thereof
10/23/2013CN103369869A Method of manufacturing multilayer printed circuit board and multilayer printed circuit board manufactured via the same
10/23/2013CN103369868A Manufacturing method of PCB (Printed Circuit Board) and PCB
10/23/2013CN103369867A Printed Circuit Board (PCB) and preparation method thereof
10/23/2013CN103369866A Method for manufacturing printed circuit board containing blind holes and manufactured printed circuit board
10/23/2013CN103369862A Continuous circuit boards and manufacturing method for continuous circuit boards
10/23/2013CN103369861A Continuous circuit boards and manufacturing method for continuous circuit boards
10/23/2013CN103369856A Method for manufacturing PCB coil clamp head and PCB coil clamp head
10/23/2013CN103369851A Printed circuit board and manufacturing method thereof
10/23/2013CN103369833A System provided with a solder joint
10/23/2013CN103369832A Circuit board
10/23/2013CN103369831A Electrical connector and connecting unit thereof
10/23/2013CN103369830A Light source module and circuit board circuit device
10/23/2013CN103369829A 数字保护继电器 Digital Protection Relays
10/23/2013CN103369828A Circuit board system
10/23/2013CN103369827A 印制电路板 Printed circuit board
10/23/2013CN103369826A A bonding pad layout structure of a circuit board used for soldering signal filtering modules
10/23/2013CN103369825A High-frequency transmission line, antenna, and electronic circuit board
10/23/2013CN103369824A High heat conducting PCB (Printed circuit board) metal base and preparation method thereof
10/23/2013CN103369823A 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and
10/23/2013CN103369822A Anti-reverse-plugging flexible printed circuit board and wiring method for same
10/23/2013CN103369821A PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof
10/23/2013CN103369820A PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof
10/23/2013CN103369819A High-potential circuit board and anti-corona protection cover for electronic devices of high-potential circuit board
10/23/2013CN103369818A Fool-proof point structure of carbon ink slab
10/23/2013CN103369817A 印刷电路板 A printed circuit board
10/23/2013CN103369816A Wiring board and method for manufacturing the same
10/23/2013CN103369815A Wiring board and electronic apparatus
10/23/2013CN103369814A Electronic apparatus and fixing device thereof
10/23/2013CN103369813A Structure of printed circuit board
10/23/2013CN103369812A 印刷电路板 A printed circuit board
10/23/2013CN103369811A Wiring board and method for manufacturing the same
10/23/2013CN103367684A Rechargeable battery pack
10/23/2013CN103367343A Light-emitting module
10/23/2013CN103367302A Substrate device
10/23/2013CN103367299A Device and method for power interconnection of semiconductor module
10/23/2013CN103367274A Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
10/23/2013CN103367265A Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
10/23/2013CN103367169A Ultrathin buried die module and method of manufacturing thereof
10/23/2013CN103366934A Transformer structure
10/23/2013CN103366923A Location short pin magnetic ring insertion piece
10/23/2013CN103366858A Silver paste for LED (Light-Emitting Diode) lamp aluminum oxide base and application thereof
10/23/2013CN103365082A Flame-retardant curable resin composition, dry membrane, flame-retardant covering membrane, and printed circuit board
10/23/2013CN103364981A 液晶显示装置 The liquid crystal display device
10/23/2013CN103364893A Opto-electric hybrid board
10/23/2013CN103363885A Method measuring interlayer offset of printed circuit board (PCB) and in-process PCB
10/23/2013CN103361509A Rolled copper foil, copper-clad laminated board, flexible printed wiring board and manufacturing method thereof
10/23/2013CN103360763A Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and a method of manufacture thereof
10/23/2013CN103360621A Packing in metal-clad foil plate with low thermal expansion coefficient and preparation method of packing
10/23/2013CN103358631A Dielectric layer for embedded capacitance material, embedded capacitance material, preparation method and use of embedded capacitance material
10/23/2013CN102483972B Conducting layer, and transducer and flexible wiring board using same
10/23/2013CN102124549B Semiconductor device
10/23/2013CN102105018B Multilayer circuit board
10/23/2013CN101209605B Surface processing copper foil
10/22/2013US8564970 Display substrate having arched signal transmission line
10/22/2013US8564968 Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall
10/22/2013US8564967 Device and method for reducing impedance
10/22/2013US8564965 Compact ejectable component assemblies in electronic devices
10/22/2013US8564702 Solid-state imaging apparatus and camera using the same
10/22/2013US8564588 Interface apparatus and method thereof
10/22/2013US8563873 Substrate with metal film and method for manufacturing the same
10/22/2013US8563872 Wiring board, wiring board manufacturing method, and via paste
10/22/2013US8563871 Composite electronic parts
10/22/2013US8563870 Transparent conductive film
10/22/2013US8563869 Circuit board and semiconductor module using this, production method for circuit board
10/22/2013US8563868 Electronic device for a flexible display device and method the same
10/22/2013US8563420 Multilayer printed wiring board
10/22/2013US8562873 Flame retarder composition
10/22/2013US8562798 Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron
10/22/2013US8562149 Flexibly connectable digital micromirror device module and projecting apparatus employing same
10/22/2013CA2605209C Metal base circuit board, light-emitting diode and led light source unit
10/20/2013CA2813551A1 Printed heating element
10/17/2013WO2013154931A1 Led lamp
10/17/2013WO2013154203A1 Circuit connection material, connection structure, and fabrication method for same
10/17/2013WO2013154141A1 Poly(amic acid) solution composition, and polyimide
10/17/2013WO2013153869A1 Multilayer wiring board, manufacturing method therefor and probe card
10/17/2013WO2013153832A1 Metal material for electronic component
10/17/2013WO2013153771A1 Copper-based circuit board
10/17/2013WO2013153745A1 Electrode bonding method, manufacturing method for electrode assembly, and manufacturing system for electrode assembly
10/17/2013WO2013153717A1 Electronic apparatus and method for manufacturing same
10/17/2013WO2013023926A3 Electronic device comprising a capacitor in a holder for a circuit board and method for production thereof
10/17/2013US20130271942 Device for improving antenna receiving sensitivity in portable terminal
10/17/2013US20130271938 Formation of dram capacitor among metal interconnect
10/17/2013US20130271937 Electronic component and electronic apparatus
10/17/2013US20130271930 Method Of Preparing A Flexible Substrate Assembly And Flexible Substrate Assembly Therefrom
10/17/2013US20130271929 Thermal expansion compensators for controlling microelectronic package warpage
10/17/2013US20130271927 Mainboard having a reverse current blocking arrangement
10/17/2013US20130271924 System in package assembly
10/17/2013US20130271909 Multi-pair differential lines printed circuit board common mode filter
10/17/2013US20130271907 Offset interposers for large-bottom packages and large-die package-on-package structures
10/17/2013US20130271240 Through-hole via inductor in a high-frequency device
10/17/2013US20130271177 Printed circuit board, method of producing a printed circuit board and testing device for testing a printed circuit board
10/17/2013US20130270218 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
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