Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2013
11/06/2013CN101990357B Signal transmission device
11/06/2013CN101909401B Printed circuit board structure
11/06/2013CN101764009B Electrode junction structure and manufacturing method thereof
11/06/2013CN101408649B Method of making circuitized substrate with internal optical pathway using photolithography
11/05/2013US8577290 Near field communication adapters
11/05/2013US8577191 Low-cost transceiver approach
11/05/2013US8576578 Robust power plane configuration in printed circuit boards
11/05/2013US8576574 Electromagnetic interference shielding on semiconductor devices
11/05/2013US8576572 Electronic device
11/05/2013US8576162 Manufacturing processes of backplane for segment displays
11/05/2013US8575498 Electrical circuitry
11/05/2013US8575496 Multilayer printed wiring board and method of manufacturing the same
11/05/2013US8575495 Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
11/05/2013US8575494 Printed circuit board with multi-layer ceramic capacitor array
11/05/2013US8575493 Integrated circuit device having extended under ball metallization
11/05/2013US8575492 Hole in pad thermal management
11/04/2013DE202013103239U1 Kombinatorische Schaltplatine Combinatorial circuit board
11/01/2013CA2813933A1 Apparatus and method for arc fault detection
10/2013
10/31/2013WO2013162844A1 Wireless connectors
10/31/2013WO2013162568A2 Steering column control module
10/31/2013WO2013161996A2 Transparent conductive ink, and method for producing transparent conductive pattern
10/31/2013WO2013161966A1 Electroconductive composition
10/31/2013WO2013161905A1 Resin composition, metal foil with resin layer, metal clad laminated board, and printed wiring board
10/31/2013WO2013161507A1 Two-layered flexible wiring substrate, flexible wiring board, and methods for producing same
10/31/2013WO2013161142A1 Structure for fixing substrate
10/31/2013WO2013161133A1 Ceramic substrate composite and method for producing ceramic substrate composite
10/31/2013WO2013160994A1 Plated structure of through-hole
10/31/2013WO2013160246A1 Electronic module and illuminating device comprising the electronic module
10/31/2013WO2013159307A1 Semiconductor device including electromagnetic absorption and shielding
10/31/2013WO2013159198A1 A smart package and monitoring system with indicator and method of making same
10/31/2013US20130288475 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates
10/31/2013US20130286801 Flex circuit having a multiple layered structure and interconnect
10/31/2013US20130286706 Memory Modules and Devices Supporting Configurable Data Widths
10/31/2013US20130286622 Semiconductor device and method of manufacturing thereof
10/31/2013US20130286621 Pb-FREE SOLDER-CONNECTED STRUCTURE
10/31/2013US20130286620 Package with Integrated Pre-Match Circuit and Harmonic Suppression
10/31/2013US20130286619 Interconnection element with posts formed by plating
10/31/2013US20130286618 Circuit device
10/31/2013US20130286616 Circuit device
10/31/2013US20130286615 Printed circuit board and method of manufacturing printed circuit board
10/31/2013US20130286613 LCD Module, LCD Device, and Backplane
10/31/2013US20130286612 Mounting structure for circuit component and method for mounting circuit component
10/31/2013US20130286611 Electronic card having an external connector
10/31/2013US20130286610 Base substrate, electronic device, and method of manufacturing base substrate
10/31/2013US20130286609 Systems and methods for shielding circuitry from interference with conformal coating
10/31/2013US20130286607 Circuit board, electric device, and method of manufacturing circuit board
10/31/2013US20130286598 Electrical apparatus and method for producing electrical apparatus
10/31/2013US20130286594 Circuit device and method for manufacturing same
10/31/2013US20130286589 Electronic device with heat sink structure
10/31/2013US20130286460 Porous electrode sheet, method for producing the same, and display device
10/31/2013US20130285008 Nanowires, method of fabrication the same and uses thereof
10/31/2013US20130284692 Resin coated copper foil, method for manufacturing same and multi-layer circuit board
10/31/2013US20130284508 Printed circuit board
10/31/2013US20130284507 Electronic component
10/31/2013US20130284506 Wiring board with built-in electronic component and method for manufacturing the same
10/31/2013US20130284505 Adhesive member for manufacturing printed circuit board, printed circuit board, and method of manufacturing the same
10/31/2013US20130284504 Printed circuit board with anti-static protection structure
10/31/2013US20130284503 Electronic element
10/31/2013US20130284502 Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
10/31/2013US20130284501 Coefficient of thermal expansion compensating compliant component
10/31/2013US20130284500 Laminate circuit board structure
10/31/2013US20130284499 Wiring substrate and method of manufacturing the same
10/31/2013US20130284498 Printed circuit board and method of manufacturing the same
10/31/2013US20130284497 Transparent conductive element, input device, and display device
10/31/2013US20130284373 Plasma resistant ceramic coated conductive article
10/31/2013US20130284244 Transparent conductive film, electronic device, and method for manufacturing electronic device
10/31/2013DE102013204565A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
10/31/2013DE102012206973A1 Method for producing conductor tracks in copper layer of substrate e.g. direct copper bonded (DCB) substrate used for mounting LED in LED module, involves forming copper layer with specific region having reduced thickness
10/30/2013EP2658357A1 Multilayer wiring substrate, production method for multilayer wiring substrate, and via paste
10/30/2013EP2658355A2 Circuit board, electric device, and method of manufacturing circuit board
10/30/2013EP2658354A1 Golden finger and plate edge interconnection device
10/30/2013EP2658353A1 Printed wiring board, semiconductor package, and printed circuit board with semiconductor package
10/30/2013EP2658113A2 Motor control multilayer circuit board
10/30/2013EP2657296A1 Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same
10/30/2013EP2657295A1 Halogen-free high-tg resin composition and prepreg and laminate fabricated by using the same
10/30/2013EP2656704A1 Integrated plated circuit heat sink and method of manufacture
10/30/2013EP2656700A1 Circuit for a light emitting component and method of manufacturing the same
10/30/2013EP2656699A1 Method of manufacturing a surface mounted device and corresponding surface mounted device
10/30/2013EP2656698A2 Printed circuit board with an insulated metal substrate
10/30/2013EP2656367A1 Conductor fuse
10/30/2013EP2655526A2 Pickering emulsion for producing electrically conductive coatings and process for producing a pickering emulsion
10/30/2013CN203261572U Mounting disc of PCB board
10/30/2013CN203261571U Centralized-welding/molding high-power LED copper substrate
10/30/2013CN203261570U Ceramic laser metallization and metal layer structure
10/30/2013CN203261569U PCB DIP packaging board with soldering bridge prevention
10/30/2013CN203261568U 电路板接点结构 Circuit board contact structure
10/30/2013CN203260768U Circuit board for series-parallel connection of combined battery set
10/30/2013CN203259744U Liquid crystal module flexible printed circuit (FPC) positioning structure and liquid crystal module
10/30/2013CN203258474U LED light bar
10/30/2013CN103380662A Circuit board and method for manufacturing circuit board
10/30/2013CN103380544A Board connecting terminal and holding structure of circuit board
10/30/2013CN103379995A Metal-clad laminate plate and printed wiring plate
10/30/2013CN103379751A Manufacturing method of combined printed-circuit board, printed-circuit board and manufacturing method thereof
10/30/2013CN103379750A Multilayer circuit board and manufacturing method thereof
10/30/2013CN103379749A Multilayer circuit board and manufacturing method thereof
10/30/2013CN103379748A High-frequency mixed-compression board and manufacturing method thereof
10/30/2013CN103379737A 印刷电路板 A printed circuit board
10/30/2013CN103379736A System-in-package assembly, printed circuit board assembly and manufacturing method thereof
10/30/2013CN103379735A Semiconductor device and method of manufacturing the same
10/30/2013CN103379734A Wiring board with built-in electronic component and method for manufacturing the same
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