Patents for H05K 1 - Printed circuits (98,583)
10/2013
10/17/2013US20130269996 Structure of via hole of electrical circuit board
10/17/2013US20130269995 Printed circuit board
10/17/2013US20130269994 Printed circuit board with strengthened pad
10/17/2013US20130269993 Capacitor, capacitor case, and substrate provided with circuit
10/17/2013US20130269992 Insulating structure and production method of same
10/17/2013US20130269991 Touch panel
10/17/2013US20130269989 Prepreg and printed circuit board comprising the same and manufacturing method printed circuit board
10/17/2013US20130269988 Peripheral circuit of touch panel and manufacturing method thereof
10/17/2013US20130269987 Electrical component
10/17/2013US20130269985 Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
10/17/2013US20130269984 Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
10/17/2013US20130269983 Circuit board assembly with pads and connection lines having same resistance value as the pads and impedance matching method
10/16/2013EP2651200A2 Digital protective relay
10/16/2013EP2651199A2 Printed circuit board
10/16/2013EP2651198A2 Plasticized ceramic thermal dissapation module
10/16/2013EP2650611A2 LIGHT DIFFUSER FOR A wireless HEADSET
10/16/2013EP2649868A1 Printed circuit board arrangement having a microswitch clamped between a printed circuit board and a printed circuit board carrier
10/16/2013EP2649867A1 Composite diode, electronic device, and methods of making the same
10/16/2013EP2649866A1 Hybrid materials for printing (semi-) conductive elements
10/16/2013EP2649865A1 Printed circuit board assembly and a method for manufacturing the printed circuit board assembly
10/16/2013EP2649864A1 Printed circuit board
10/16/2013EP2055161B1 Lightweight audio system for automotive applications and method
10/16/2013CN203243649U Wire harness fixing clamp
10/16/2013CN203243607U Circuit board structure for LED (light-emitting diode) display screen
10/16/2013CN203243606U Porting structure of printed circuit board
10/16/2013CN203243605U Flexible circuit board with pressing-bit finger design
10/16/2013CN203243604U OLED pads
10/16/2013CN203243603U Modified epoxy resin multilayer high-speed backplane
10/16/2013CN203243602U Anti-flaming printed circuit board
10/16/2013CN203243601U 可挠式传输线及传输装置 The flexible transmission line, and transmission means
10/16/2013CN203243600U Hole-metallization polytetrafluoroethylene multilayer circuit board
10/16/2013CN203243599U High-temperature-resistant polyimide multilayer circuit board
10/16/2013CN203243598U Flexible circuit board
10/16/2013CN203243597U Flexible circuit board stamping structure
10/16/2013CN203243596U 印刷电路板把手 A printed circuit board handle
10/16/2013CN203243595U 一种pcb结构 One kind pcb structure
10/16/2013CN203243594U A terminal, a side key apparatus, and a dustproof structure of a flexible printed circuit FPC
10/16/2013CN203243593U 可挠式传输线及传输装置 The flexible transmission line, and transmission means
10/16/2013CN203243592U 可挠式传输线及传输装置 The flexible transmission line, and transmission means
10/16/2013CN203242735U Hole-metallization PTFE circuit board with embedded micro-strip antenna
10/16/2013CN203242618U Heavy-current lead structure of solid-state relay control circuit
10/16/2013CN203242256U Cylindrical LED screen
10/16/2013CN203242246U Flat display panel allowing alignment correction
10/16/2013CN103354702A Manufacturing method for microwave circuit board and circuit board manufactured by using the same
10/16/2013CN103354699A Multi-ceramic-layer printed circuit board
10/16/2013CN103354698A A patterned ceramic layer printed circuit substrate for optical and electronic devices
10/16/2013CN103354697A Patterned composite ceramic layer printed circuit substrate for optical and electronic device
10/16/2013CN103351838A Adhesive composition, connection structure, method for producing connection structure, and use of adhesive composition
10/16/2013CN103350543A Capacitor embedding material, preparing method and purpose thereof
10/16/2013CN103350542A Capacitor embedding material, preparing method and purpose thereof
10/16/2013CN102281710B Bonding pad structure
10/16/2013CN102233699B Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil
10/16/2013CN102227957B Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object
10/16/2013CN102097334B Manufacture method for wiring board and stitch arrangement device
10/16/2013CN102005434B Printed wiring board and method for manufacturing the same
10/16/2013CN101926065B Plug connector part, plug connection, device and method for production of device
10/16/2013CN101842408B Resin composition for forming insulating layer of printed wiring board
10/16/2013CN101689410B Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
10/16/2013CN101686600B Flexible printing wiring board, method for manufacturing the same, and flexible printing wiring board for hard disc device
10/15/2013US8559190 Memory systems and method for coupling memory chips
10/15/2013US8559189 Riser card for power supply
10/15/2013US8559186 Inductor with patterned ground plane
10/15/2013US8559185 Integrated circuit package system with stackable devices and a method of manufacture thereof
10/15/2013US8559184 Electronic component built-in substrate and method of manufacturing the same
10/15/2013US8559181 Thin multi-chip flex module
10/15/2013US8559170 Motherboard assembly and central processing unit expansion card
10/15/2013US8558636 Package embedded equalizer
10/15/2013US8558120 Multilayer board for suppressing unwanted electromagnetic waves and noise
10/15/2013US8558119 Circuit module
10/15/2013US8558118 Circuit connection material, circuit member connecting structure and method of connecting circuit member
10/15/2013US8558117 Electroconductive inks made with metallic nanoparticles
10/15/2013US8558116 Multilayer rigid flexible printed circuit board and method for manufacturing the same
10/15/2013US8557392 Flexible copper clad laminate
10/15/2013US8557385 Electrically conductive, thermosetting elastomeric material and uses therefor
10/10/2013WO2013151315A1 Printed circuit board and a method for fabricating the same
10/10/2013WO2013151065A1 Inductor and method for manufacturing same
10/10/2013WO2013150940A1 Glass substrate with through electrode and method for producing glass substrate with through electrode
10/10/2013WO2013150816A1 Flexible printed circuit board and flexible printed circuit board fabrication method
10/10/2013WO2013150779A1 Sintered oxide compact and circuit board using same
10/10/2013WO2013150753A1 Epoxy resin composition, prepreg, laminate, and printed wiring board
10/10/2013WO2013149386A1 Epoxy resin composition, and prepreg and laminated board coated with copper foil made from same
10/10/2013WO2013106056A3 Circuit element coupling devices and methods for flexible and other circuits
10/10/2013US20130266812 Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made Therefrom
10/10/2013US20130266779 Curable resin composition
10/10/2013US20130265800 Mobile terminal
10/10/2013US20130265735 Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, led module, and method for forming circuit for printed wiring board
10/10/2013US20130265734 Interchip communication using embedded dielectric and metal waveguides
10/10/2013US20130265733 Interchip communication using an embedded dielectric waveguide
10/10/2013US20130265732 Interchip communication using a dielectric waveguide
10/10/2013US20130265731 Circuit board system
10/10/2013US20130265729 Electronic components assembly
10/10/2013US20130265727 Many-up wiring substrate, wiring board, and electronic device
10/10/2013US20130265726 Printed circuit board
10/10/2013US20130265076 Adapter board and dc power supply test system using same
10/10/2013US20130264723 Metal base substrate and manufacturing method thereof
10/10/2013US20130264572 Transparent thin film having conductive and nonconductive portions, method of patterning the portions, thin-film transistor array substrate including the thin film and method of manufacturing the same
10/10/2013US20130264109 Electronic device, electronic apparatus, and method of manufacturing electronic device
10/10/2013US20130264107 Circuit board and wire assembly
10/10/2013US20130264105 Solder-mounted board, production method therefor, and semiconductor device
10/10/2013US20130264104 Conductive metal ink composition, and method for forming a conductive pattern
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