Patents for H05K 1 - Printed circuits (98,583)
09/2013
09/04/2013EP2633744A1 Flexible printed circuits
09/04/2013EP2633743A1 An electronics card, an electronic device including such a card, and a method of protecting an electronics card
09/04/2013EP2633618A2 Drive
09/04/2013EP2633557A1 Electronic device in plastic
09/04/2013EP2632851A1 Dielectric layer for an electrical component, electrical component comprising a dielectric layer and method for producing an electrical component comprising a dielectric layer
09/04/2013CN203181416U Jumper wire for printed circuit board and printed circuit board thereof
09/04/2013CN203181415U PCB board with heat dissipation air channel
09/04/2013CN203181414U Circuit board used for resistor of microwave device
09/04/2013CN203181413U Blind hole structure of printed circuit board, printed circuit board, and electronic product
09/04/2013CN203181412U PCB board
09/04/2013CN203181411U FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating
09/04/2013CN203181410U Multilayer flexible printed board
09/04/2013CN203181409U Circuit board with symmetrical and laminated structure
09/04/2013CN203181408U Backing pad for exhausting gas in via holes of PCB
09/04/2013CN203181407U A spliced PCB board capable of being fractured
09/04/2013CN203181406U Printed circuit board of wall switch
09/04/2013CN203181405U Flexible printed circuit manufactured by continuous die cutting
09/04/2013CN203181404U PCB panel easy for surface mounting LED paster identification and processing debugging
09/04/2013CN203181403U PCB multilayer board with blind via
09/04/2013CN203180232U Circuit board and connector
09/04/2013CN203180230U 电路板及连接器 Circuit boards and connectors
09/04/2013CN203178973U Conductive wafer and touch screen
09/04/2013CN103283313A Metal base circuit board, and method for producing metal base circuit board
09/04/2013CN103282814A Optical module
09/04/2013CN103282546A Laminate and method for producing laminate
09/04/2013CN103282412A Electrical insulating paper
09/04/2013CN103282180A Method for producing three-ayer co-extruded polyimide film
09/04/2013CN103281866A Printed circuit board (PCB), design method for circuit diagram of PCB and electronic device
09/04/2013CN103281862A Unit circuit board assembly structure
09/04/2013CN103281861A Installing method of FLASH bonding pad for preventing high-speed transmission line from being segmented in crossing way
09/04/2013CN103281860A Heat dissipation conducting circuit board and manufacturing method thereof
09/04/2013CN103281859A Rigid-flex combined circuit board and manufacturing method therefore
09/04/2013CN103281858A Printed circuit board and manufacturing method thereof, and flip-chip packaging member and manufacturing method thereof
09/04/2013CN103281857A Dual-fuse softflexible thin film circuit
09/04/2013CN103281856A Metal carrier plate combined structure capable of being cyclically utilized
09/04/2013CN102487579B Preparation method of metamaterial and the same
09/04/2013CN102165011B Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
09/04/2013CN102056403B Printed wiring board
09/04/2013CN102006713B Circuit board with static protection structure
09/04/2013CN101750423B Circuit board inspection apparatus
09/04/2013CN101572991B Printed circuit board and method for its production
09/04/2013CN101416350B Article provided with feed circuit board
09/04/2013CN101341181B A curable epoxy resin composition and laminates made therefrom
09/03/2013US8526194 Anti-ultraviolet memory device and fabrication method thereof
09/03/2013US8526190 Mobile terminal apparatus, method of disposing flexible board, method of correcting closing manipulation, and method of preventing damage to flexible board
09/03/2013US8525630 Laminated inductor
09/03/2013US8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same
09/03/2013US8525043 Printed substrate through which very strong currents can pass and corresponding production method
09/03/2013US8525042 Printed circuit board and printed circuit board unit
09/03/2013US8525041 Multilayer wiring board and method for manufacturing the same
09/03/2013US8525040 Circuit board and its wire bonding structure
09/03/2013US8525039 Photosensitive glass paste and multilayer wiring chip component
09/03/2013US8525038 Flex-rigid wiring board and method of manufacturing the same
09/03/2013US8525037 Suspension board with circuit and producing method thereof
09/03/2013US8525036 Wireless telemetry electronic circuit board for high temperature environments
09/03/2013US8525035 Double-side-conducting flexible-circuit flat cable with cluster section
09/03/2013US8525034 Cable guide and method of cable termination
09/03/2013US8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/03/2013US8523578 Electronic equipment with docking means for receiving an extractable element
09/03/2013US8523391 Flat light source apparatus with separable unit boards
09/03/2013US8523163 Insert for carrier board of test handler
08/2013
08/29/2013WO2013126573A1 Module on board form factor for expansion boards
08/29/2013WO2013125949A1 Panel with electric devices
08/29/2013WO2013045364A3 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/29/2013US20130224653 Crosslinked polyimide, composition comprising the same and method for producing the same
08/29/2013US20130224513 Laminate circuit board with a multi-layer circuit structure
08/29/2013US20130223038 Module substrate and method for manufacturing module substrate
08/29/2013US20130223035 Motherboard
08/29/2013US20130223034 High performance electrical circuit structure
08/29/2013US20130223033 Printed wiring board, inductor component, and method for manufacturing inductor component
08/29/2013US20130223032 Chip-integrated through-plating of multi-layer substrates
08/29/2013US20130223031 Sensor comprising a multi-layered ceramic substrate and method for its production
08/29/2013US20130223030 Process for making stubless printed circuit boards
08/29/2013US20130223027 Electronic device and printed circuit board connection method
08/29/2013US20130223024 Control unit and method for designing a circuit board of a control unit
08/29/2013US20130223021 Method For Locating A Printed Circuit Board Within An Enclosure
08/29/2013US20130223018 High-density sim card package and production method thereof
08/29/2013US20130223010 Semiconductor package, cooling mechanism and method for manufacturing semiconductor package
08/29/2013US20130222796 Printed circuit board
08/29/2013US20130222750 Display substrate, display panel having the same, method of manufacturing the same and method of manufacturing the display panel
08/29/2013US20130221518 Printed wiring board
08/29/2013US20130221485 Wiring boards and semiconductor modules including the same
08/29/2013US20130221075 Method of Reducing Solder Wicking on a Substrate
08/29/2013US20130220696 Chip-type ceramic electronic component and producing method thereof
08/29/2013US20130220691 Multilayer wiring substrate and method of manufacturing the same
08/29/2013US20130220690 Printed circuit board for mobile platforms
08/29/2013US20130220688 Mounting structure and mounting method
08/29/2013US20130220686 Multilayered printed wiring board and method for manufacturing the same
08/29/2013US20130220685 Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
08/29/2013US20130220684 Ink
08/29/2013US20130220683 Printed circuit board and method for manufacturing printed circuit board
08/29/2013US20130220682 Method of Reducing Electromigration of Silver and Article Made Thereby
08/29/2013US20130220681 Resin composition for forming receiving layer, and receiving substrate; printed matter, conductive pattern, and electric circuit produced by using the resin composition
08/29/2013US20130220680 Pattern substrate, method of producing the same, information input apparatus, and display apparatus
08/29/2013US20130220677 Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same
08/29/2013US20130220675 Method of manufacturing a printed circuit board
08/29/2013US20130220674 Adhesive Composition, Varnish, Adhesive Film and Wiring Film
08/29/2013US20130220673 Heavy-wire bond arrangement and method for producing same
08/29/2013US20130220672 Single Layer Touch-Control Sensor Structure With Reduced Coupling To Proximate Ground Structures
08/29/2013US20130220662 Electronic apparatus and printed wiring board
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