Patents for H05K 1 - Printed circuits (98,583)
09/2013
09/18/2013CN203206581U PCB (printed circuit board)
09/18/2013CN203206580U Broken-circuit-prevention wiring structure of flexible printed circuit board and flexible printed circuit board
09/18/2013CN203206579U Device for improving impedance continuity of signal line
09/18/2013CN203206578U Printed circuit board and semi-finished product used for producing same
09/18/2013CN203205230U Planar transformer in switching power supply
09/18/2013CN203205229U Large-current planar transformer manufactured on printed circuit board
09/18/2013CN203198324U Copper-clad plate and printed circuit board thereof
09/18/2013CN103314652A Wiring substrate and production method therefor
09/18/2013CN103314650A Z-directed delay line components for printed circuit boards
09/18/2013CN103314649A Method of transferring and electrically joining high density multilevel thin film to circuitized and flexible organic substrate and associated devices
09/18/2013CN103314648A Z-directed capacitor components for printed circuit boards
09/18/2013CN103313524A Capacitor configuration method, electronic equipment and printed circuit board
09/18/2013CN103313520A Curved-surface metal graphic manufacturing method and curved-surface metal graphic substrate
09/18/2013CN103313516A Conductive pattern film base material and manufacturing method thereof
09/18/2013CN103313515A Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot
09/18/2013CN103313512A Microwave assembly high-density substrate design method based on composite dielectric materials
09/18/2013CN103313511A Electrically controlled variable inductor
09/18/2013CN103313510A Circuit board and manufacturing method of circuit board
09/18/2013CN103313509A Metal-based conducting circuit board and manufacturing method thereof
09/18/2013CN103313508A Electronic component board and production method of the same
09/18/2013CN103313507A Printed circuit board and chip system
09/18/2013CN103313506A Printed circuit board with ground protection
09/18/2013CN103313505A Conductor track structure on non-conductive bearing material and manufacturing method of conductor track structure
09/18/2013CN103313504A Film-free flexible printed circuit board and production method thereof
09/18/2013CN103310990A Solid electrolytic capacitor and circuit board having the same
09/18/2013CN103310946A Common mode filter and fabrication method thereof
09/18/2013CN103308995A Opto-electric hybrid board and method of manufacturing same
09/18/2013CN103304998A Composition for preparing thermosetting resin, cured product of the composition, prepreg having the cured product, metal clad laminate and printed circuit board having the prepreg
09/18/2013CN102504532B Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same
09/18/2013CN102360852B Heavy-current planar transformer
09/18/2013CN102311613B Black halogen-free flame-retardant epoxy resin composition and adhesive film prepared from same
09/18/2013CN102053650B Back panel system and wiring method of back panel signal wire
09/18/2013CN102036462B Printed circuit board and protection method thereof
09/18/2013CN101875825B Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same
09/18/2013CN101772262B Welding structure of circuit board as well as method thereof
09/18/2013CN101742811B Printed circuit board and method of manufacturing the same
09/17/2013US8537568 Electronic device with electromagnetic shielding function
09/17/2013US8537559 Compliant insert for electronics assemblies
09/17/2013US8537556 Holding apparatus
09/17/2013US8537527 Mounting board and display device
09/17/2013US8536714 Interposer, its manufacturing method, and semiconductor device
09/17/2013US8536696 Conductive pin attached to package substrate
09/17/2013US8536695 Chip-last embedded interconnect structures
09/17/2013US8536464 Multilayer substrate
09/17/2013US8536463 Printed-circuit board and manufacturing method thereof
09/17/2013US8536462 Flex circuit package and method
09/17/2013US8536460 Composite double-sided copper foil substrates and flexible printed circuit board structures using the same
09/17/2013US8536459 Coreless layer buildup structure with LGA
09/17/2013US8536458 Fine pitch copper pillar package and method
09/17/2013US8536457 Multilayer wiring board and method for manufacturing the same
09/17/2013US8536456 Printed circuit board
09/17/2013US8535809 Electrical insulating resin composition, and laminate for circuit board
09/17/2013US8535065 Connector assembly for interconnecting electrical connectors having different orientations
09/17/2013US8534628 Mounting apparatus for motherboard
09/17/2013US8533945 Wiring structure and method of forming the same
09/12/2013WO2013133560A1 Printed circuit board and method of manufacturing the same
09/12/2013WO2013133316A1 Porous resin sheet and method for manufacturing same
09/12/2013WO2013133240A1 Printable adhesive and method for manufacturing joined body using same
09/12/2013WO2013133168A1 Polyamic acid and polyimide
09/12/2013WO2013132930A1 Three-dimensional laminated wiring substrate
09/12/2013WO2013132815A1 Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components
09/12/2013WO2013132680A1 Carrier-attached metal foil
09/12/2013WO2013132401A1 Segmented electroluminescent device with distributed load elements
09/12/2013WO2013131719A1 A mems micro-mirror assembly
09/12/2013WO2013131463A1 Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method
09/12/2013US20130236738 Laminate and method for producing laminate
09/12/2013US20130235545 Multilayer wiring board
09/12/2013US20130235544 Integrated circuit stack
09/12/2013US20130235543 Wiring board and semiconductor device
09/12/2013US20130235542 3-d integrated package
09/12/2013US20130235535 Composite substrate, module, and composite-substrate production method
09/12/2013US20130235531 Electronic component board and production method of the same
09/12/2013US20130235517 Electronic device assemblies including conductive vias having two or more conductive elements
09/12/2013US20130233609 Interposer with extruded feed-through vias
09/12/2013US20130233608 Physical Unclonable Interconnect Function Array
09/12/2013US20130233607 Wiring substrate and method for manufacturing wiring substrate
09/12/2013US20130233606 Electronic component
09/12/2013US20130233605 Solid electrolytic capacitor and circuit board having the same
09/12/2013US20130233603 Method for mounting a component in or on a circuit board, and circuit board
09/12/2013US20130233602 Surface treatment structure of circuit pattern
09/12/2013US20130233601 Surface metal wiring structure for an ic substrate
09/12/2013US20130233600 Integrated plated circuit heat sink and method of manufacture
09/12/2013US20130233599 Substrate for power module
09/12/2013US20130233598 Flexible film carrier to increase interconnect density of modules and methods thereof
09/12/2013DE102012203474A1 Kartenleser mit einem eine Leiterbahnstruktur aufweisenden Kunststoffspritzteil Card reader with a wiring pattern having a plastic injection molding
09/11/2013EP2637485A1 Card reader with a conductor path structure with a plastic injection moulded component
09/11/2013EP2637484A1 Multi-part wired substrate, wired substrate, and electronic device
09/11/2013EP2637216A1 Conductive paste for formation of a solar cell element electrode, solar cell element, and manufacturing method for said solar cell element
09/11/2013EP2637215A1 Conductive paste for formation of a solar cell element electrode, solar cell element, and manufacturing method for said solar cell element
09/11/2013EP2637175A1 Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film
09/11/2013EP2636287A1 Chip-integrated through-plating of multilayer substrates
09/11/2013EP2636100A1 Flexible device for electrically connecting an electric component and a printed circuit board together, system, and method for mounting a system
09/11/2013EP2421342B1 Method of manufacturing an electronic component
09/11/2013EP2421341B1 Electronic component and method of manufacturing the same
09/11/2013CN203194022U Electronic component fixing structure
09/11/2013CN203194021U Surface mounting element changeable in connection spacing after being welded
09/11/2013CN203194020U Circuit board with overcurrent protecting device
09/11/2013CN203194019U Fixing mechanism and relevant electronic device
09/11/2013CN203194018U Multiple-order hole of printed circuit board
09/11/2013CN203194017U Metal ceramic composite substrate
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