| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 11/19/2013 | US8586874 Conductive sheet, method for using conductive sheet, and capacitive touch panel |
| 11/19/2013 | US8586873 Test point design for a high speed bus |
| 11/19/2013 | US8586872 Metal core substrate |
| 11/19/2013 | US8586871 Interconnect schemes, and materials and methods for producing the same |
| 11/19/2013 | US8586870 Microelectronic component support with reinforced structure |
| 11/19/2013 | US8585842 Method for manufacturing multilayer ceramic substrate and composite sheet |
| 11/19/2013 | US8585432 Connector and optical transmission apparatus |
| 11/19/2013 | US8584924 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate |
| 11/19/2013 | CA2526081C Fabrication process for a non-contact ticket and ticket obtained from such a process |
| 11/18/2013 | DE202013008406U1 Leiterplattenstromschiene PCB power rail |
| 11/14/2013 | WO2013169774A2 Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
| 11/14/2013 | WO2013169222A1 Printed circuit board comprising a via |
| 11/14/2013 | WO2013169018A1 Hot wire connecting structure for ceramic heater |
| 11/14/2013 | WO2013168773A1 Laminate of conductive film, touch panel, wiring board, electronic appliance, transparent double-faced pressure-sensitive adhesive sheet, and transparent pressure-sensitive adhesive sheet |
| 11/14/2013 | WO2013168761A1 Multilayer wiring board |
| 11/14/2013 | WO2013168646A1 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board |
| 11/14/2013 | WO2013168357A1 Surface-mounting substrate |
| 11/14/2013 | WO2013168263A1 Printed circuit board for electronic devices |
| 11/14/2013 | WO2013167568A1 Mounting support for solid-state light radiation sources and light source therefor |
| 11/14/2013 | WO2013167355A1 System for transmitting data signals in an optical transmission medium |
| 11/14/2013 | WO2013167123A1 Method for producing metal-ceramic substrates, and metal-ceramic substrate produced according to said method |
| 11/14/2013 | WO2013129689A3 An optical module with enhanced heat dissipating function |
| 11/14/2013 | WO2013088263A3 Heatsink interposer |
| 11/14/2013 | US20130301231 Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line |
| 11/14/2013 | US20130301229 Control device, and motor unit including control device |
| 11/14/2013 | US20130301228 Packaging structure |
| 11/14/2013 | US20130301227 Circuit module and method of manufacturing same |
| 11/14/2013 | US20130301226 Electronic device with detachable communication module |
| 11/14/2013 | US20130301207 276-pin buffered memory card with enhanced memory system interconnect |
| 11/14/2013 | US20130299978 Wiring boards and semiconductor packages including the same |
| 11/14/2013 | US20130299859 Substrate for optical semiconductor apparatus, method for manufacturing the same, optical semiconductor apparatus and method for manufacturing the same |
| 11/14/2013 | US20130299227 New printed circuit board and method for manufacturing same |
| 11/14/2013 | US20130299226 Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers |
| 11/14/2013 | US20130299225 Via Structure for Multi-Gigahertz Signaling |
| 11/14/2013 | US20130299224 Ceramic electronic component and electronic device |
| 11/14/2013 | US20130299223 Printed circuit board and method for manufacturing the same |
| 11/14/2013 | US20130299222 Electrode member and touch window including the same |
| 11/14/2013 | US20130299221 Space transformer for probe card and method of manufacturing the same |
| 11/14/2013 | US20130299220 Touch panel and method for manufacturing electrode member |
| 11/14/2013 | US20130299219 Multilayer circuit board and method for manufacturing the same |
| 11/14/2013 | US20130299218 Multilayer printed wiring board |
| 11/14/2013 | US20130299217 Electrical and thermal conductive thin film with double layer structure provided as a one-dimensional nanomaterial network with graphene/graphene oxide coating |
| 11/14/2013 | US20130299216 Transparent electrode sheet, method for manufacturing transparent electrode sheet, and capacitive touch panel using such transparent electrode sheet |
| 11/14/2013 | US20130299215 Electronic component, electronic-component-embedded substrate, and method for producing electronic component |
| 11/14/2013 | US20130299214 Patterned Substrates With Darkened Conductor Traces |
| 11/14/2013 | DE102012207833A1 Method for forming coil in circuit board for e.g. highly efficient bus system, involves forming helical conductor at inner wall of hole for formation of coil in circuit board, where helical conductors are wound around longitudinal axis |
| 11/14/2013 | DE102012207599A1 Steuergerät, insbesondere für ein Kraftfahrzeug Control unit, in particular for a motor vehicle |
| 11/13/2013 | EP2662902A1 Solar cell module and fabrication method of the same |
| 11/13/2013 | EP2662425A2 Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made Therefrom |
| 11/13/2013 | EP2661791A2 Electronic device with pcbs interconnected by a flex circuit with controlled impedance |
| 11/13/2013 | EP2661457A1 Electrical insulating paper |
| 11/13/2013 | CN203289741U Mounting structure of circuit board conductive pole |
| 11/13/2013 | CN203289740U Circuit board |
| 11/13/2013 | CN203289739U PCB and electronic product with PCB |
| 11/13/2013 | CN203289738U Connection structure of printed circuit boards in infrared touch screen frame |
| 11/13/2013 | CN203289737U Overlap type flexible thin-film circuit |
| 11/13/2013 | CN203289736U PCB structure |
| 11/13/2013 | CN203289735U Fool-proofing structure used for shielding cover and circuit board |
| 11/13/2013 | CN203289734U Double-insurance flexible thin-film circuit |
| 11/13/2013 | CN203289733U Dustproof and waterproof circuit board |
| 11/13/2013 | CN203289732U Circuit board having heat radiating function |
| 11/13/2013 | CN203288787U Connector and printed circuit board |
| 11/13/2013 | CN203287650U Backplane and liquid crystal module |
| 11/13/2013 | CN203282859U Circuit substrate, storage chip and imaging box |
| 11/13/2013 | CN103392384A Printed circuit board with an insulated metal substrate |
| 11/13/2013 | CN103392024A Two-layered copper-clad laminate material, and method for producing same |
| 11/13/2013 | CN103391965A Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| 11/13/2013 | CN103391691A 电路板及其制造方法 The circuit board and its manufacturing method |
| 11/13/2013 | CN103391681A 印刷线路板及其制造方法 A printed wiring board and its manufacturing method |
| 11/13/2013 | CN103391680A PCB bonding pad assembly and PCB |
| 11/13/2013 | CN103391679A Rigid-flexible printed circuit board and method for manufacturing the same |
| 11/13/2013 | CN103390498A An electronic component, an electronic component-embedded substrate, and a method for producing the electronic component |
| 11/13/2013 | CN102884872B Multilayer wiring board and method for manufacturing multilayer wiring board |
| 11/13/2013 | CN102458042B Circuit substrate manufacturing process, circuit substrate and semiconductor manufacturing process |
| 11/13/2013 | CN102369791B Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same |
| 11/13/2013 | CN102361913B Novel polyamic acid, polyimide, photosensitive resin composition comprising same, and dry film produced from the composition |
| 11/13/2013 | CN102361533B Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof |
| 11/13/2013 | CN102217429B Method and apparatus for reacting thin films on low-temperature substrates at high speeds |
| 11/13/2013 | CN102215630B Flexible printed board and method of manufacturing same |
| 11/13/2013 | CN102131338B Electronic apparatus |
| 11/13/2013 | CN101866108B Photosetting and thermosetting solder resist composition, and printed wiring board using the same |
| 11/13/2013 | CN101529531B Aqueous formulation containing silver, and use thereof for production of electrically conductive or reflective coatings |
| 11/12/2013 | USRE44586 Via structure for improving signal integrity |
| 11/12/2013 | US8582333 Integration of switched capacitor networks for power delivery |
| 11/12/2013 | US8582314 Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure |
| 11/12/2013 | US8582312 Electronic circuit board and power line communication apparatus using it |
| 11/12/2013 | US8582308 Method of making an electronic circuit device |
| 11/12/2013 | US8582307 Wireless communication apparatus |
| 11/12/2013 | US8581407 Electronic system modules and method of fabrication |
| 11/12/2013 | US8581395 Hybrid integrated circuit device and electronic device |
| 11/12/2013 | US8581114 Packaged structure having magnetic component and method thereof |
| 11/12/2013 | US8581113 Low cost high frequency device package and methods |
| 11/12/2013 | US8581112 Coupler apparatus |
| 11/12/2013 | US8581111 Mounting structure |
| 11/12/2013 | US8581110 Printed circuit board and method of manufacturing the same |
| 11/12/2013 | US8581109 Method for manufacturing a circuit board structure |
| 11/12/2013 | US8581108 Method for providing near-hermetically coated integrated circuit assemblies |
| 11/12/2013 | US8581107 Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same |
| 11/12/2013 | US8581106 Submount |
| 11/12/2013 | US8581105 Electrical device with teeth joining layers and method for making the same |