Patents for H05K 1 - Printed circuits (98,583)
12/2013
12/24/2013DE102008020268B4 Anordnung mit mehreren elektrischen Leitern Arrangement with a plurality of electrical conductors
12/24/2013CA2537875C Photocontrol devices having flexible mounted photosensors and methods of calibrating the same
12/19/2013WO2013187420A1 Surface-treated copper foil and laminated sheet, printed wiring board, and electronic device using same, as well as method for producing printed wiring board
12/19/2013WO2013187303A1 Resin composition, prepreg, metal foil-clad laminate and printed wiring board
12/19/2013WO2013187186A1 Electronic component and method for manufacturing same
12/19/2013WO2013187184A1 Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product
12/19/2013WO2013187183A1 Conductive paste, and laminated ceramic electronic component and method for producing same
12/19/2013WO2013186982A1 Film wiring board and light emitting apparatus
12/19/2013WO2013186978A1 Light-emitting device
12/19/2013WO2013186653A1 Lead frame light emitting arrangement
12/19/2013WO2013186364A1 Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board
12/19/2013WO2013186241A1 Method of producing an electronic circuit with protection of the conductive layer
12/19/2013WO2013186035A1 Optoelectronic semiconductor chip
12/19/2013WO2013185807A1 Packaging of active and passive microwave circuits using a grid of planar conducting elements on a grid of vertically arranged substrates
12/19/2013WO2013185584A1 Electrical apparatus
12/19/2013WO2013185427A1 Printed circuit board structure of backlight module, backlight module and liquid crystal display thereof
12/19/2013WO2013185342A1 Pcb for liquid crystal display device and liquid crystal display device
12/19/2013WO2013161996A3 Transparent conductive ink, and method for producing transparent conductive pattern
12/19/2013US20130337269 Resin composition, and prepreg as well as laminate using the same
12/19/2013US20130337241 Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product
12/19/2013US20130337229 Roughed cured material and laminated
12/19/2013US20130337188 Resin composition and method for producing circuit board
12/19/2013US20130335940 Electronic circuit substrate, display device, and wiring substrate
12/19/2013US20130335938 High-frequency module
12/19/2013US20130335937 Integrated circuit packaging for implantable medical devices
12/19/2013US20130335936 Interposer substrate, electronic device package, and electronic component
12/19/2013US20130335933 Circuit board and electronic device
12/19/2013US20130335930 Electronic apparatus
12/19/2013US20130335929 Electronic device and method with flexible display
12/19/2013US20130335928 Carrier and method for fabricating coreless packaging substrate
12/19/2013US20130335927 Planar transformer assemblies for implantable cardioverter defibrillators
12/19/2013US20130334694 Packaging substrate, semiconductor package and fabrication method thereof
12/19/2013US20130334292 Printed Circuit Boards
12/19/2013US20130333935 High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment
12/19/2013US20130333934 Multilayer electronic structure with stepped holes
12/19/2013US20130333933 Delta Arrangement of Hexagonal-Close-Packed Signal Pairs
12/19/2013US20130333932 Printed circuit board and methods of manufacturing the same
12/19/2013US20130333931 Novel insulating film and printed wiring board provided with insulating film
12/19/2013US20130333930 Wiring board and method of manufacturing the same
12/19/2013US20130333929 Terminal Structure for Glass Plate with Conductive Section and Glass Plate Article Utilizing Same
12/19/2013US20130333928 Implementing feed-through and domain isolation using ferrite and containment barriers
12/19/2013US20130333927 Printed circuit board and method of manufacturing the same
12/19/2013US20130333926 Circuit substrate and method of manufacturing same
12/19/2013US20130333925 Flexible-Rigid Circuit Board Composite and Method for Producing a Flexible-Rigid Circuit Board Composite
12/19/2013US20130333924 Multilayer electronic support structure with integral metal core
12/19/2013US20130333923 MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION
12/19/2013US20130333922 Spacerless input device
12/19/2013US20130333921 Oversized interposer
12/19/2013DE112005000438B4 Eine Zwischenverbindungsstruktur und ein Verfahren zum Verbinden von vergrabenen Signalleitungen mit elektrischen Vorrichtungen An interconnect structure and a method of connecting signal lines with the buried electrical devices
12/19/2013DE102013106113A1 Halbleitermodule und Verfahren zu ihrer Herstellung Semiconductor modules and methods for their preparation
12/19/2013DE102008016133B4 Leiterplatte und Verfahren zum Herstellen einer Leiterplatte Printed circuit board and method of manufacturing a printed circuit board
12/18/2013EP2675022A1 Communications connector with flexible printed circuit board
12/18/2013EP2674508A1 Two-layered copper-clad laminate material, and method for producing same
12/18/2013EP2672847A1 Inhaler component
12/18/2013EP2424338B1 Multilayer printed wiring boards with holes requiring copper wrap plate
12/18/2013EP2355889B1 Cochlear implant systems including magnetic flux redirection means
12/18/2013EP1721497B1 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
12/18/2013CN203352951U 电路板系统 Board system
12/18/2013CN203352950U PCB assembly and air conditioner outdoor machine with same
12/18/2013CN203352949U Printed circuit board capable of loading LED light sources
12/18/2013CN203352948U Printed circuit board flexible pad with vertical supporting structure
12/18/2013CN203352947U Printed circuit board flexible pad structure
12/18/2013CN203352946U Novel printed circuit board pad
12/18/2013CN203352945U Flexible-rigid combined board
12/18/2013CN203352944U PCB with stamp holes
12/18/2013CN203352943U Circuit board and electronic module
12/18/2013CN203352942U Circuit board cover
12/18/2013CN203352941U Radiating circuit board
12/18/2013CN203352940U Novel circuit board
12/18/2013CN203352939U Multi-surface circuit board
12/18/2013CN203352938U Circuit board with protective cover
12/18/2013CN203352937U Flexible circuit board
12/18/2013CN203352936U Large jointed board having component force holes
12/18/2013CN203352935U Switching power supply printed circuit board with low electromagnetic interference
12/18/2013CN203351746U Bluetooth antenna based on PCB
12/18/2013CN203351584U Camera module group packaging structure
12/18/2013CN203351575U Laminated body, laminated board, multilayer laminated board and printed wiring board
12/18/2013CN203351448U A circuit board assembly of a vehicle built-in switch
12/18/2013CN203350862U Small USB blaster programmer
12/18/2013CN1377937B Liquid crystal polyester resin composition
12/18/2013CN103460822A Multilayer substrate with integrated chip component and method for manufacturing same
12/18/2013CN103460820A Wiring board and method for manufacturing same
12/18/2013CN103460819A Wiring substrate
12/18/2013CN103460816A Electronic assembly
12/18/2013CN103460815A Mounting structure and method for manufacturing same
12/18/2013CN103460814A Electronic module and method for the production thereof
12/18/2013CN103460813A Substrate for mounting a plurality of light emitting elements
12/18/2013CN103460436A Low temperature contact structure for flexible solid state device
12/18/2013CN103459679A Rolled copper or copper-alloy foil provided with roughened surface
12/18/2013CN103458654A Multilayer circuit board framework for maintaining operating temperature of electronic component by way of heating and radiating
12/18/2013CN103458629A Multi-layer circuit board and manufacturing method thereof
12/18/2013CN103458628A Multi-layer circuit board and manufacturing method thereof
12/18/2013CN103458627A Double-surface pressing connecting through hole structure of printed-circuit board and machining method thereof
12/18/2013CN103458615A PCB for novel integrated manufacturing of electronic component structure
12/18/2013CN103458614A Wired circuit board and producing method thereof
12/18/2013CN103458613A Circuit board and image forming apparatus
12/18/2013CN103458612A FPC (flexible printed circuit) welding disc
12/18/2013CN103458611A Stacked semiconductor package, printed wiring board and printed circuit board
12/18/2013CN103458610A Substrate of printed circuit board and printed circuit board
12/18/2013CN103458609A Printed circuit board assembly and solder validation method
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