Patents for H05K 1 - Printed circuits (98,583)
09/2013
09/25/2013CN103327755A Method of manufacturing stepped plate and stepped plate
09/25/2013CN103327750A Method for manufacturing inductor-buried type printed circuit board and circuit board manufactured through method
09/25/2013CN103327748A 电路板及其制作方法 Circuit board and its manufacturing method
09/25/2013CN103327741A 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof
09/25/2013CN103327740A Structure composed of piezo actuator and flexible circuit board
09/25/2013CN103327739A PCS plate suitable for shape processing needless of inner positioning
09/25/2013CN103327738A Softness-hardness combined circuit board and manufacturing method thereof
09/25/2013CN103327737A Chip assembly structure and chip assembly method
09/25/2013CN103327736A High heat conducting and insulating metal matrix printed circuit board
09/25/2013CN103327735A High heat conducting and insulating metal matrix printed circuit board
09/25/2013CN103327734A Integrated type high-thermal-conductivity circuit board and manufacturing method thereof
09/25/2013CN103327733A Electrostatic protection method of printed circuit board, printed circuit board and electronic product
09/25/2013CN103327732A High heat conduction substrate and manufacturing method thereof
09/25/2013CN103327731A Structure for strengthening surface contract strength of electronic circuit
09/25/2013CN103327730A Electronic equipment with photosensitive function, flexible printed circuit board and socket
09/25/2013CN103327729A Flexible circuit board connected structure of electronic device
09/25/2013CN103327728A Printed circuit board
09/25/2013CN103327727A Circuit board packaging structure and method for detecting circuit board unpacking
09/25/2013CN103327726A Electronic device and printed circuit board layout structure thereof
09/25/2013CN103326148A Plug-in type component, circuit board and preparation method for circuit board
09/25/2013CN103324029A Photosensitive resin composition and cured product thereof, and printed circuit board
09/25/2013CN103319853A Resin composition for insulation film, and insulation film and circuit board containing same
09/25/2013CN102666658B Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board
09/25/2013CN102363891B Double photoelectrolysis copper foil replacing rolled copper foil and used for production of flexible copper clad laminate, and production process of double photoelectrolysis copper foil
09/25/2013CN102281708B Circuit board on basis of interdigital capacitance and electromagnetism band gap structure
09/25/2013CN102260402B Epoxy resin composition, and prepreg and printed circuit board manufactured therefrom
09/25/2013CN102137541B Flex-rigid wiring board and method for manufacturing same
09/25/2013CN102007823B Circuit board for electrical connector and electrical connector
09/25/2013CN101971414B Connection device and optical device
09/25/2013CN101925270B Wireless device and method for manufacturing the same
09/24/2013US8542497 Display device
09/24/2013US8542494 Circuit board having holes to increase resonant frequency of via stubs
09/24/2013US8541695 Wiring board and method for manufacturing the same
09/24/2013US8541694 Multilayer wiring board
09/24/2013US8541693 Wiring board and method for manufacturing the same
09/24/2013US8541692 Printed wiring board
09/24/2013US8541691 Heat resistant substrate incorporated circuit wiring board
09/24/2013US8541690 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
09/24/2013US8541689 Method for removing a part of a planar material layer and multilayer structure
09/24/2013US8541688 Circuit connection material, circuit member connecting structure and method of connecting circuit member
09/24/2013US8541687 Coreless layer buildup structure
09/24/2013US8541686 Wiring member and method for producing the same
09/24/2013US8541685 Flexible harness and electrical connector cable using same
09/24/2013US8541096 Printed circuit board and method of manufacturing the same
09/24/2013US8540903 Electrically conductive paste, and electrical and electronic device comprising the same
09/24/2013CA2571345C System and method for mounting an image capture device on a flexible substrate
09/19/2013WO2013137993A1 Sensor device with stepped pads for connectivity
09/19/2013WO2013137732A1 Submount, assembly including submount, method of assembling and assembling device
09/19/2013WO2013137401A1 Electronic component mounting substrate fabrication method and electronic component mounting substrate
09/19/2013WO2013137257A1 Resin composition, prepreg, and metal foil-clad laminate
09/19/2013WO2013137044A1 Method for manufacturing substrate with built-in inductor, substrate with built-in inductor, and power supply module using same
09/19/2013WO2013136979A1 Circuit connection material and method for producing mounted product using same
09/19/2013WO2013136896A1 Semiconductor device and method for manufacturing same
09/19/2013WO2013136729A1 Manufacturing method for laminated board and printed wiring board
09/19/2013WO2013136722A1 Metal-clad laminate plate, printed wiring board, semiconductor package, and semiconductor device
09/19/2013WO2013136575A1 Printed wiring board and circuit board
09/19/2013WO2013135791A1 Method, device, and system for a power circuit
09/19/2013US20130244121 Novel applications for alliform carbon
09/19/2013US20130242520 Insulating substrate, metal-clad laminate, printed wiring board and semiconductor device
09/19/2013US20130242519 Printed circuit board
09/19/2013US20130242517 Component assembly
09/19/2013US20130242516 Method of Manufacturing Component-Embedded Substrate, and Component-Embedded Substrate Manufactured Using the Method
09/19/2013US20130242513 Electronic device
09/19/2013US20130242512 Display device package and packaging process thereof
09/19/2013US20130242511 Wiring board, display panel, and electronic apparatus
09/19/2013US20130242510 Photoimaging Method and Apparatus
09/19/2013US20130242507 Heat-dissipating assemblies and methods of assembling heat-dissipating assemblies
09/19/2013US20130242498 Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
09/19/2013US20130241939 High capacitance density metal-insulator-metal capacitors
09/19/2013US20130241873 Flexible printed circuit for connecting touch screen and liquid crystal display device using the same
09/19/2013US20130241689 Transparent conductive film and touch panel
09/19/2013US20130241589 Wiring base plate and method for manufacturing the same
09/19/2013US20130240366 Plated terminations
09/19/2013US20130240260 Method for making an interactive information device and product produced thereby
09/19/2013US20130240259 Method of manufacturing wiring board, wiring board, and via structure
09/19/2013US20130240258 Printed wiring board
09/19/2013US20130240257 Copper foil for printed wiring board
09/19/2013US20130240256 Method for Reducing Creep Corrosion
09/19/2013US20130240255 Test piece and manufacturing method thereof
09/19/2013US20130240254 Printed circuit board and method for manufacturing printed circuit board
09/19/2013US20130240253 Printed circuit board with grounding protection
09/19/2013US20130240252 3d-shaped component with a circuit trace pattern and method for making the same
09/19/2013US20130240251 Silk electronic components
09/19/2013US20130240250 Circuit apparatus having a rounded differential pair trace
09/19/2013DE102012204133A1 Verfahren, Vorrichtung und System für eine Leistungsschaltung Method, apparatus and system for a power circuit
09/19/2013DE102012204012A1 Method for producing solder connection between semiconductor component and carrier element of power electronics module for e.g. hybrid car, involves arranging polyimide spacer element between semiconductor component and carrier element
09/18/2013EP2640172A1 Method for forming circuit on flexible laminate substrate
09/18/2013EP2640171A2 Circuit board with a regular LED assembly
09/18/2013EP2640170A1 Wireless Headset Comprising a Housing and an Earbud Electrically Coupled to the Housing by a Flexible Circuit Board
09/18/2013EP2640169A2 Multilayered wiring substrate and electronic apparatus
09/18/2013EP2640168A1 Submount, assembly including submount, method of assembling and assembling device
09/18/2013EP2639884A1 Contact and contact joint structure
09/18/2013EP2639262A1 Thermoplastic composition
09/18/2013EP2638789A2 Display screen
09/18/2013CN203206587U Jumper connecting structure applied to PCB
09/18/2013CN203206586U A semi-finished product used for producing a printed circuit board
09/18/2013CN203206585U PCB plate
09/18/2013CN203206584U Semi-finished product for printed circuit board production
09/18/2013CN203206583U PCB and electronic equipment
09/18/2013CN203206582U 印制电路板 Printed circuit board
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