Patents for H05K 1 - Printed circuits (98,583)
04/2010
04/29/2010US20100101841 Printed circuit board
04/29/2010US20100101840 Application of a self-assembled monolayer as an oxide inhibitor
04/29/2010US20100101839 Display apparatus
04/29/2010US20100101838 Multilayer printed wiring board
04/29/2010US20100101837 Printed circuit board
04/29/2010US20100101836 Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate
04/29/2010DE202008017736U1 Printed Circuit Board, und Mainboard eines Terminal-Produktes Printed Circuit Board, and mainboard of a terminal product
04/29/2010DE102008058490B3 Schaltungsplatte und Verfahren zur Herstellung einer Schaltungsplatte Circuit board and method of manufacturing a circuit board
04/29/2010DE102008055683A1 Conductor arrangement for e.g. producing long flexible printed circuit boards as replacement for cable harnesses, has intermediate element arranged between board sections and including rounded bending edge that lies at inner side of bend
04/29/2010DE102008036736B4 Elektrisches Installationsschaltgerät mit einer elektronischen Baugruppe Electrical service switching device with an electronic module,
04/28/2010EP2180769A1 Flexible printed circuit board for large capacity signal transmission medium
04/28/2010EP2180595A1 High output power amplifier, wireless transmitter, wireless transmitting and receiving device, and high output power amplifier mounting method
04/28/2010EP2180026A1 Adhesive composition, film-like adhesive, and connection structure for circuit member
04/28/2010EP2179634A1 High-speed router with backplane using multi-diameter drilled thru-holes and vias
04/28/2010EP2179632A1 Substrate comprising a highly conductive layer
04/28/2010EP2179631A2 Carrier foil
04/28/2010EP1965614B1 Circuit board connecting structure, circuit board connecting section, and electronic apparatus
04/28/2010EP1133796B2 A method for producing a two-dimensional support for semiconductor chips
04/28/2010CN201444723U Corrosion resistant device of alternating current servo controller
04/28/2010CN201444722U Circuit board structure
04/28/2010CN1980522B Optical identifying point manufacture method for printed circuit board
04/28/2010CN1960607B Method for pressfitting flexible circuit boards and vacuum, quick pressing device
04/28/2010CN1886707B Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same
04/28/2010CN1753782B Flexible metal foil-polyimide laminate
04/28/2010CN1697164B Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
04/28/2010CN1684573B Mounting substrate
04/28/2010CN1620225B Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
04/28/2010CN1619731B Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
04/28/2010CN1608835B 柔性金属箔层合体 Flexible metal foil laminate
04/28/2010CN1594965B 发光二极管承载器 Light-emitting diode carrier
04/28/2010CN101699942A Multi-bin shielding mode with compact structure
04/28/2010CN101699938A Circuit board processing method and circuit board
04/28/2010CN101699549A Coiled-type LED display screen
04/28/2010CN101699351A Solder resist composition and printing circuit board formed thereby
04/28/2010CN101699142A Stiffened light source module and backlight module
04/27/2010US7706524 Signal line routing to reduce crosstalk effects
04/27/2010US7706149 Micro-electro-mechanical-system package and method for manufacturing the same
04/27/2010US7706046 Rearview mirror element having a circuit mounted to the rear surface of the element
04/27/2010US7705812 Liquid crystal display device having a drive IC mounted on a flexible board directly connected to a liquid crystal panel
04/27/2010US7705697 Waveguide coupler
04/27/2010US7705452 Carrier assembly for an integrated circuit
04/27/2010US7705420 Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
04/27/2010US7705248 EMI shielded module
04/27/2010US7705247 Built-up printed circuit board with stack type via-holes
04/27/2010US7705246 Compact differential signal via structure
04/27/2010US7705245 Electronic device substrate and its fabrication method, and electronic device and its fabrication method
04/27/2010US7704799 Method of manufacturing wiring substrate
04/27/2010US7704414 Image-forming method employing a composition
04/27/2010US7704078 Systems for wireless antenna connection
04/27/2010US7703910 Print roll unit incorporating pinch rollers
04/27/2010US7703692 Memory card
04/27/2010US7703199 Method to accommodate increase in volume expansion during solder reflow
04/22/2010WO2010045639A1 Method and apparatus for reacting thin films on low-temperature substrates at high speeds
04/22/2010WO2010044670A2 Method and device for a controllable coil and/or capacitor and/or circuit
04/22/2010WO2010044374A1 Heat dissipation structure
04/22/2010WO2010044315A1 Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate
04/22/2010WO2010044044A1 Sheet-shaped flexible electronic device
04/22/2010WO2010044018A1 A textile for electrically addressing an electronic component in an electronic textile, method for manufacturing the textile, and electronic textile comprising the textile
04/22/2010WO2010043540A1 Method for producing a ductile substrate provided with electrical elements
04/22/2010WO2010043285A1 Electrical circuit configuration having overlapping capacitances
04/22/2010WO2010043203A1 Flexible printed circuit board
04/22/2010WO2010042965A1 Marker for marking or coding an object and method for producing such a marker and use
04/22/2010WO2010002156A3 Printed circuit board for led light capable of being easily changed into polyhedral and polygonal shapes
04/22/2010US20100098937 Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
04/22/2010US20100097776 Assembling Stacked Substrates That Can Form 3-D Structures
04/22/2010US20100097772 Circuit board connecting structure and display device comprising the same
04/22/2010US20100097771 Circuit board assembly
04/22/2010US20100097770 Printed circuit board and manufacturing method thereof
04/22/2010US20100096744 Printed wiring board and method for manufacturing the same
04/22/2010US20100096178 Non-shirinkage ceramic substrate and manufacturing method thereof
04/22/2010US20100096177 Coreless substrate having filled via pad and method of manufacturing the same
04/22/2010US20100096176 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
04/22/2010US20100096175 Adhesive film, connecting method, and joined structure
04/22/2010US20100096174 Filter circuit element and electronic circuit device
04/22/2010US20100096173 Epoxy resin composition, prepreg, and laminate and printed wiring board
04/22/2010US20100096172 Wiring structure and method for fabricating the same
04/22/2010US20100096171 Printed circuit board having round solder bump and method of manufacturing the same
04/22/2010US20100096170 Circuit board and layout method thereof
04/22/2010US20100096169 Polyamide Resin as Well as Epoxy Resin Composition Using the Same and Use Thereof
04/22/2010US20100096168 Electric contact and method for producing the same and connector using the electric contacts
04/22/2010US20100096167 Flexible printed circuit board for large capacity signal transmission medium
04/22/2010US20100096166 Flexible Circuit Assemblies without Solder and Methods for their Manufacture
04/22/2010US20100096165 Golden finger for flexible printed circuitboard
04/22/2010US20100096164 Film and flexible metal-clad laminate
04/22/2010US20100096163 Wiring board and method of manufacturing the same
04/22/2010US20100095519 Apparatus for manufacturing wireless communication device
04/22/2010DE102008052467A1 Conductor plate for electronic circuits, has sensor for monitoring resistance values of insulation materials and emitting signals depending on resistance values of insulation materials, where insulation materials are provided in series
04/22/2010DE102008052244A1 Flexible Leiterplatte Flexible PCB
04/22/2010DE102008051920A1 Elektrische Schaltungsanordnung mit überlappenden Kapazitäten Electrical circuit arrangement with overlapping capacity
04/22/2010DE102008042845A1 Elektrische Leitungsanordnung Electrical conduit assembly
04/22/2010CA2740786A1 Method and apparatus for reacting thin films on low-temperature substrates at high speeds
04/22/2010CA2679156A1 Security material having a web-like interlaced fabric
04/21/2010EP2178353A1 Circuit module, and electronic device using the module
04/21/2010EP2178352A2 Method and apparatus for accurately applying structures to a substrate
04/21/2010EP2178154A1 Electric cable arrangement
04/21/2010EP2178116A1 Ic mounting substrate and method for manufacturing the same
04/21/2010EP2177822A1 Backlight unit
04/21/2010EP2177490A1 Ceramic substrate, process for producing the same, and dielectric-porcelain composition
04/21/2010EP1819963B1 Light emitting module, lighting device, and display device
04/21/2010EP1137333B1 Multilayer build-up wiring board