Patents for H05K 1 - Printed circuits (98,583) |
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01/21/2015 | CN204118318U 一种电连接器组件 An electrical connector assembly |
01/21/2015 | CN104303609A 电路板、导电膜形成方法和粘合性改进剂 Circuit board, the conductive film forming method and an adhesion improving agent |
01/21/2015 | CN104303607A 印刷基板的连接结构、电子装置和伺服马达 Printed circuit board connection structure, electronic means and the servo motor |
01/21/2015 | CN104303606A 印刷电路板设备和其制造方法 A printed circuit board device and manufacturing method thereof |
01/21/2015 | CN104303605A 金属基印刷电路板 Metal base printed circuit board |
01/21/2015 | CN104303604A 基座、包括基座的组合件、组装方法和组装设备 Base assembly includes a base, assembly methods and assembly equipment |
01/21/2015 | CN104303238A 透明导电性墨以及透明导电图案形成方法 Transparent conductive ink and a transparent conductive pattern forming method |
01/21/2015 | CN104302555A 一种智能包装和有指示器的监测制系统及其制造方法 An intelligent packaging and an indicator monitoring-system and manufacturing method thereof |
01/21/2015 | CN104302125A 一种高密度互连印刷电路板对位系统与对位方法 A high-density interconnect printed circuit board alignment system and method for position |
01/21/2015 | CN104302122A 防止印刷电路板中焊环脱落的方法及印刷电路板 Printed circuit board to prevent solder ring shedding method and a printed circuit board |
01/21/2015 | CN104302121A 前驱基板、软性印刷电路板的制造方法及前驱基板 Precursor substrate, method of manufacturing the flexible printed circuit board and the substrate precursor |
01/21/2015 | CN104302106A 基于厚铜电路板的磁环定位结构 Based on the positioning ring structure thick copper circuit board |
01/21/2015 | CN104302105A 通用电路板 General board |
01/21/2015 | CN104302104A 组合电路板 Combining circuit board |
01/21/2015 | CN104302103A 线路布局结构、线路板及电子总成 Circuit layout structure, circuit boards and electronic assemblies |
01/21/2015 | CN104302102A 一种红外焦平面传感器无封装应用方法 An infrared focal plane sensor applications without encapsulation method |
01/21/2015 | CN104302101A 包含具有矩形或方形截面的导线的布线印刷电路板或插件 Comprising wire having a rectangular or square cross section of the wiring board or plug |
01/21/2015 | CN104302100A 焊垫结构及应用其的印刷电路板与存储器存储装置 Bonding pad structure and application of a printed circuit board and its memory storage means |
01/21/2015 | CN104302099A 电路板及其制造方法 Circuit board and manufacturing method thereof |
01/21/2015 | CN104302098A 线路板层压对位靶标的结构和制作方法 PCB lamination alignment target structure and production methods |
01/21/2015 | CN104302097A 一种多层印刷电路板 A multilayer printed circuit board |
01/21/2015 | CN104302096A Pcb板 Pcb board |
01/21/2015 | CN104302095A 用来减小无线噪声干扰的电子装置 Used to reduce the noise of the wireless electronic device |
01/21/2015 | CN104302094A 多层式电路板 Multi-layer circuit board |
01/21/2015 | CN104302093A 柔性印刷电路膜及包括该柔性印刷电路膜的显示装置 The display device includes a flexible printed circuit film and the flexible printed circuit film |
01/21/2015 | CN104302092A 电路板结构及其制造方法 Board structure and manufacturing method |
01/21/2015 | CN104302091A 天线板制作叠构 Antenna plate production stack configuration |
01/21/2015 | CN104302090A 无线通讯天线板叠构及其制作方法 Wireless communications antenna panels stacked structure and fabrication method thereof |
01/21/2015 | CN104300249A 插槽结构与应用其的电路板 Slot structure and application of its board |
01/21/2015 | CN104299782A 多层陶瓷电容器和用于安装该多层陶瓷电容器的板 Plate for mounting a multilayer ceramic capacitor and a multilayer ceramic capacitor of the |
01/21/2015 | CN104299779A 多层陶瓷电容器及其安装板 The multilayer ceramic capacitor and a mounting plate |
01/21/2015 | CN103131130B 环氧树脂组成物及应用其的低介电常数绝缘材料 Epoxy resin composition and application thereof of low dielectric constant insulating material |
01/21/2015 | CN102626005B 一种构造可调谐rf滤波器的方法 A construction method tunable filter rf |
01/21/2015 | CN102281713B 印刷电路板及电子设备 Printed circuit boards and electronic equipment |
01/21/2015 | CN102029922B 基于双面铝基板的功率mosfet并联电路及结构设计 Power mosfet parallel circuit and structural design based on the double-sided aluminum plate |
01/21/2015 | CN102005311B 包括被覆层覆盖部分的装置的制造方法及被覆层除去装置 Including the manufacturing method and the coating layer means a coating layer covering the portion of the removing device |
01/21/2015 | CN101857609B 含磷化合物和其制造方法及用途 Phosphorus-containing compound and its manufacturing method and use |
01/21/2015 | CN101827495B 复合金属箔及其制造方法以及印刷布线板 Complex metal foil and its manufacturing method and a printed wiring board |
01/20/2015 | US8937807 Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature |
01/20/2015 | US8937727 Portable handheld device with multi-core image processor |
01/20/2015 | US8937513 Micro-scale system to provide thermal isolation and electrical communication between substrates |
01/20/2015 | US8937480 High frequency detection device and coaxial cable including the same |
01/20/2015 | US8937389 Semiconductor devices comprising GSG interconnect structures |
01/20/2015 | US8937258 Transceiver power distribution network |
01/20/2015 | US8937257 Electronic module |
01/20/2015 | US8937255 Superconductive multi-chip module for high speed digital circuits |
01/20/2015 | US8936967 Solder in cavity interconnection structures |
01/20/2015 | US8936488 Memory module socket with terminating apparatus |
01/20/2015 | US8936196 Camera unit incorporating program script scanner |
01/20/2015 | US8935851 Method for manufacturing a circuit board |
01/20/2015 | US8935850 Method of manufacturing printed wiring board |
01/20/2015 | US8935846 Method for contacting a lighting device and connection element for attachment on a lighting device |
01/15/2015 | WO2015006393A1 Fusion bonded liquid crystal polymer circuit structure |
01/15/2015 | WO2015005982A1 Printed circuit board with side access termination pads |
01/15/2015 | WO2015005319A1 Wiring substrate |
01/15/2015 | WO2015005220A1 Production method for electrically conductive cured article, electrically conductive cured article, curing method for pulsed light curing composition, and pulsed light curing composition |
01/15/2015 | WO2015005178A1 Composition for forming electrically conductive film, and method for producing electrically conductive film using same |
01/15/2015 | WO2015005046A1 Composition for forming electrically conductive film, method for producing electrically conductive film, and electrically conductive film |
01/15/2015 | WO2015005029A1 Resin multilayer substrate and resin multilayer substrate manufacturing method |
01/15/2015 | WO2015003884A1 Dielectric filmless electronic module and method for manufacturing same |
01/15/2015 | WO2015003399A1 Printed circuit board and electric device |
01/15/2015 | US20150018055 Flexible board and electronic device |
01/15/2015 | US20150017477 Printed circuit board and manufacturing method thereof |
01/15/2015 | US20150017457 Transparent conductive film, conductive element, composition, input device, display device and electronic instrument |
01/15/2015 | US20150017449 Resin composition, prepreg, resin sheet, and metal foil-clad laminate |
01/15/2015 | US20150017409 Composite member |
01/15/2015 | US20150016082 Printed circuit board and method of manufacturing the same |
01/15/2015 | US20150016080 Method for manufacturing an embedded package and structure thereof |
01/15/2015 | US20150016079 Printed wiring board |
01/15/2015 | US20150016078 Partitioned Hybrid Substrate for Radio Frequency Applications |
01/15/2015 | US20150016074 Device housing package |
01/15/2015 | US20150016073 Circuit Carrier Having a Conducting Path and an Electric Shield, and Method for Producing Said Circuit Carrier |
01/15/2015 | US20150016072 Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate |
01/15/2015 | US20150016071 Electronic component thickness measurement method, method for manufacturing a series of electronic components using the measurement method, a series of electronic components manufactured by the manufacturing method, and electronic component inspection apparatus |
01/15/2015 | US20150016070 Conductive structure and device with the conductive structure as electrode |
01/15/2015 | US20150016069 Printed circuit board |
01/15/2015 | US20150016068 3DIC Package Integration for High-Frequency RF System |
01/15/2015 | US20150016049 Semiconductor memory card, printed circuit board for memory card and method of fabricating the same |
01/15/2015 | US20150016048 Printed circuit arrangement and method of forming the same |
01/15/2015 | US20150016042 Packaging substrate that has electroplated pads that are free of plating tails |
01/15/2015 | US20150015980 Conductive film, display device equipped with same, and method for determining pattern of conductive film |
01/15/2015 | US20150015529 Connection apparatus for electrically conductive pads and touch control screen |
01/15/2015 | US20150015453 Transmit/Receive Daughter Card With Integral Circulator |
01/15/2015 | US20150014554 Packaging for high power integrated circuits and infrared emitter arrays |
01/15/2015 | US20150014046 Multilayer circuit board |
01/15/2015 | US20150014045 Sleeved Coaxial Printed Circuit Board Vias |
01/15/2015 | US20150014044 High speed via |
01/15/2015 | US20150014043 Printed wiring board and electric tool switch provided therewith |
01/15/2015 | US20150014042 Laminated electronic component |
01/15/2015 | US20150014041 Envelope tracking power amplifier with low impedance supply feed |
01/15/2015 | US20150014040 Multilayer ceramic capacitor and board for mounting of the same |
01/15/2015 | US20150014039 Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet |
01/15/2015 | US20150014038 Multilayer ceramic capacitor and mounting circuit board therefor |
01/15/2015 | US20150014037 Multilayer ceramic capacitor and board for mounting the same |
01/15/2015 | US20150014036 Multilayer ceramic capacitor and board for mounting the same |
01/15/2015 | US20150014035 Multilayer ceramic capacitor and mounting circuit board therefor |
01/15/2015 | US20150014034 Printed circuit board having embedded electronic device and method of manufacturing the same |
01/15/2015 | US20150014033 Multilayer ceramic capacitor and board for mounting the same |
01/15/2015 | US20150014032 Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same |
01/15/2015 | US20150014030 Composition for forming silver ion diffusion-suppressing layer, film for silver ion diffusion-suppressing layer, circuit board, electronic device, conductive film laminate, and touch panel |