Patents for H05K 1 - Printed circuits (98,583)
01/2015
01/21/2015CN204118318U 一种电连接器组件 An electrical connector assembly
01/21/2015CN104303609A 电路板、导电膜形成方法和粘合性改进剂 Circuit board, the conductive film forming method and an adhesion improving agent
01/21/2015CN104303607A 印刷基板的连接结构、电子装置和伺服马达 Printed circuit board connection structure, electronic means and the servo motor
01/21/2015CN104303606A 印刷电路板设备和其制造方法 A printed circuit board device and manufacturing method thereof
01/21/2015CN104303605A 金属基印刷电路板 Metal base printed circuit board
01/21/2015CN104303604A 基座、包括基座的组合件、组装方法和组装设备 Base assembly includes a base, assembly methods and assembly equipment
01/21/2015CN104303238A 透明导电性墨以及透明导电图案形成方法 Transparent conductive ink and a transparent conductive pattern forming method
01/21/2015CN104302555A 一种智能包装和有指示器的监测制系统及其制造方法 An intelligent packaging and an indicator monitoring-system and manufacturing method thereof
01/21/2015CN104302125A 一种高密度互连印刷电路板对位系统与对位方法 A high-density interconnect printed circuit board alignment system and method for position
01/21/2015CN104302122A 防止印刷电路板中焊环脱落的方法及印刷电路板 Printed circuit board to prevent solder ring shedding method and a printed circuit board
01/21/2015CN104302121A 前驱基板、软性印刷电路板的制造方法及前驱基板 Precursor substrate, method of manufacturing the flexible printed circuit board and the substrate precursor
01/21/2015CN104302106A 基于厚铜电路板的磁环定位结构 Based on the positioning ring structure thick copper circuit board
01/21/2015CN104302105A 通用电路板 General board
01/21/2015CN104302104A 组合电路板 Combining circuit board
01/21/2015CN104302103A 线路布局结构、线路板及电子总成 Circuit layout structure, circuit boards and electronic assemblies
01/21/2015CN104302102A 一种红外焦平面传感器无封装应用方法 An infrared focal plane sensor applications without encapsulation method
01/21/2015CN104302101A 包含具有矩形或方形截面的导线的布线印刷电路板或插件 Comprising wire having a rectangular or square cross section of the wiring board or plug
01/21/2015CN104302100A 焊垫结构及应用其的印刷电路板与存储器存储装置 Bonding pad structure and application of a printed circuit board and its memory storage means
01/21/2015CN104302099A 电路板及其制造方法 Circuit board and manufacturing method thereof
01/21/2015CN104302098A 线路板层压对位靶标的结构和制作方法 PCB lamination alignment target structure and production methods
01/21/2015CN104302097A 一种多层印刷电路板 A multilayer printed circuit board
01/21/2015CN104302096A Pcb板 Pcb board
01/21/2015CN104302095A 用来减小无线噪声干扰的电子装置 Used to reduce the noise of the wireless electronic device
01/21/2015CN104302094A 多层式电路板 Multi-layer circuit board
01/21/2015CN104302093A 柔性印刷电路膜及包括该柔性印刷电路膜的显示装置 The display device includes a flexible printed circuit film and the flexible printed circuit film
01/21/2015CN104302092A 电路板结构及其制造方法 Board structure and manufacturing method
01/21/2015CN104302091A 天线板制作叠构 Antenna plate production stack configuration
01/21/2015CN104302090A 无线通讯天线板叠构及其制作方法 Wireless communications antenna panels stacked structure and fabrication method thereof
01/21/2015CN104300249A 插槽结构与应用其的电路板 Slot structure and application of its board
01/21/2015CN104299782A 多层陶瓷电容器和用于安装该多层陶瓷电容器的板 Plate for mounting a multilayer ceramic capacitor and a multilayer ceramic capacitor of the
01/21/2015CN104299779A 多层陶瓷电容器及其安装板 The multilayer ceramic capacitor and a mounting plate
01/21/2015CN103131130B 环氧树脂组成物及应用其的低介电常数绝缘材料 Epoxy resin composition and application thereof of low dielectric constant insulating material
01/21/2015CN102626005B 一种构造可调谐rf滤波器的方法 A construction method tunable filter rf
01/21/2015CN102281713B 印刷电路板及电子设备 Printed circuit boards and electronic equipment
01/21/2015CN102029922B 基于双面铝基板的功率mosfet并联电路及结构设计 Power mosfet parallel circuit and structural design based on the double-sided aluminum plate
01/21/2015CN102005311B 包括被覆层覆盖部分的装置的制造方法及被覆层除去装置 Including the manufacturing method and the coating layer means a coating layer covering the portion of the removing device
01/21/2015CN101857609B 含磷化合物和其制造方法及用途 Phosphorus-containing compound and its manufacturing method and use
01/21/2015CN101827495B 复合金属箔及其制造方法以及印刷布线板 Complex metal foil and its manufacturing method and a printed wiring board
01/20/2015US8937807 Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature
01/20/2015US8937727 Portable handheld device with multi-core image processor
01/20/2015US8937513 Micro-scale system to provide thermal isolation and electrical communication between substrates
01/20/2015US8937480 High frequency detection device and coaxial cable including the same
01/20/2015US8937389 Semiconductor devices comprising GSG interconnect structures
01/20/2015US8937258 Transceiver power distribution network
01/20/2015US8937257 Electronic module
01/20/2015US8937255 Superconductive multi-chip module for high speed digital circuits
01/20/2015US8936967 Solder in cavity interconnection structures
01/20/2015US8936488 Memory module socket with terminating apparatus
01/20/2015US8936196 Camera unit incorporating program script scanner
01/20/2015US8935851 Method for manufacturing a circuit board
01/20/2015US8935850 Method of manufacturing printed wiring board
01/20/2015US8935846 Method for contacting a lighting device and connection element for attachment on a lighting device
01/15/2015WO2015006393A1 Fusion bonded liquid crystal polymer circuit structure
01/15/2015WO2015005982A1 Printed circuit board with side access termination pads
01/15/2015WO2015005319A1 Wiring substrate
01/15/2015WO2015005220A1 Production method for electrically conductive cured article, electrically conductive cured article, curing method for pulsed light curing composition, and pulsed light curing composition
01/15/2015WO2015005178A1 Composition for forming electrically conductive film, and method for producing electrically conductive film using same
01/15/2015WO2015005046A1 Composition for forming electrically conductive film, method for producing electrically conductive film, and electrically conductive film
01/15/2015WO2015005029A1 Resin multilayer substrate and resin multilayer substrate manufacturing method
01/15/2015WO2015003884A1 Dielectric filmless electronic module and method for manufacturing same
01/15/2015WO2015003399A1 Printed circuit board and electric device
01/15/2015US20150018055 Flexible board and electronic device
01/15/2015US20150017477 Printed circuit board and manufacturing method thereof
01/15/2015US20150017457 Transparent conductive film, conductive element, composition, input device, display device and electronic instrument
01/15/2015US20150017449 Resin composition, prepreg, resin sheet, and metal foil-clad laminate
01/15/2015US20150017409 Composite member
01/15/2015US20150016082 Printed circuit board and method of manufacturing the same
01/15/2015US20150016080 Method for manufacturing an embedded package and structure thereof
01/15/2015US20150016079 Printed wiring board
01/15/2015US20150016078 Partitioned Hybrid Substrate for Radio Frequency Applications
01/15/2015US20150016074 Device housing package
01/15/2015US20150016073 Circuit Carrier Having a Conducting Path and an Electric Shield, and Method for Producing Said Circuit Carrier
01/15/2015US20150016072 Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate
01/15/2015US20150016071 Electronic component thickness measurement method, method for manufacturing a series of electronic components using the measurement method, a series of electronic components manufactured by the manufacturing method, and electronic component inspection apparatus
01/15/2015US20150016070 Conductive structure and device with the conductive structure as electrode
01/15/2015US20150016069 Printed circuit board
01/15/2015US20150016068 3DIC Package Integration for High-Frequency RF System
01/15/2015US20150016049 Semiconductor memory card, printed circuit board for memory card and method of fabricating the same
01/15/2015US20150016048 Printed circuit arrangement and method of forming the same
01/15/2015US20150016042 Packaging substrate that has electroplated pads that are free of plating tails
01/15/2015US20150015980 Conductive film, display device equipped with same, and method for determining pattern of conductive film
01/15/2015US20150015529 Connection apparatus for electrically conductive pads and touch control screen
01/15/2015US20150015453 Transmit/Receive Daughter Card With Integral Circulator
01/15/2015US20150014554 Packaging for high power integrated circuits and infrared emitter arrays
01/15/2015US20150014046 Multilayer circuit board
01/15/2015US20150014045 Sleeved Coaxial Printed Circuit Board Vias
01/15/2015US20150014044 High speed via
01/15/2015US20150014043 Printed wiring board and electric tool switch provided therewith
01/15/2015US20150014042 Laminated electronic component
01/15/2015US20150014041 Envelope tracking power amplifier with low impedance supply feed
01/15/2015US20150014040 Multilayer ceramic capacitor and board for mounting of the same
01/15/2015US20150014039 Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet
01/15/2015US20150014038 Multilayer ceramic capacitor and mounting circuit board therefor
01/15/2015US20150014037 Multilayer ceramic capacitor and board for mounting the same
01/15/2015US20150014036 Multilayer ceramic capacitor and board for mounting the same
01/15/2015US20150014035 Multilayer ceramic capacitor and mounting circuit board therefor
01/15/2015US20150014034 Printed circuit board having embedded electronic device and method of manufacturing the same
01/15/2015US20150014033 Multilayer ceramic capacitor and board for mounting the same
01/15/2015US20150014032 Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same
01/15/2015US20150014030 Composition for forming silver ion diffusion-suppressing layer, film for silver ion diffusion-suppressing layer, circuit board, electronic device, conductive film laminate, and touch panel
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