Patents for H05K 1 - Printed circuits (98,583)
01/2015
01/29/2015US20150029690 Functional device, electronic apparatus, and moving object
01/29/2015US20150029689 Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
01/29/2015US20150029684 Flat panel display apparatus and method for manufacturing the same
01/29/2015US20150029683 Foldable display apparatus and method of manufacturing the same
01/29/2015US20150029682 Electronic control unit
01/29/2015US20150029681 Flexible composite, production thereof and use thereof
01/29/2015US20150029680 Mounting structure, electro-optical apparatus, and electronic apparatus
01/29/2015US20150029679 Circuit board, production method of circuit board, and electronic equipment
01/29/2015US20150029678 Substrateless device and the method to fabricate thereof
01/29/2015US20150029677 Multilayer wiring substrate, method of producing the same, and semiconductor product
01/29/2015US20150029674 Printed circuit board set having high-efficiency heat dissipation
01/29/2015US20150029673 Electronic element and electronic device
01/29/2015US20150029672 Power conversion apparatus
01/29/2015US20150029670 Sn-cu-based lead-free solder alloy
01/29/2015US20150029661 Wearable portable electronic device with heat conducting path
01/29/2015US20150029660 Configurable heat conducting path for portable electronic device
01/29/2015US20150029652 Foldable display
01/29/2015US20150029636 Connection structure of electronic device
01/29/2015US20150029436 Display apparatus
01/29/2015US20150029411 Touch panel, conductive film and method for manufacturing the same
01/29/2015US20150029275 Tear-proof circuit
01/29/2015US20150029166 Display apparatus and control method for the same
01/29/2015US20150028480 Substrate and assembly thereof with dielectric removal for increased post height
01/29/2015US20150028380 Wiring substrate and substrate module
01/29/2015US20150027769 Deposition by spin coating of a patterned thin layer on a substrate
01/29/2015US20150027768 Resin composition for solder bump formation, solder bump formation method, and member having solder bumps
01/29/2015US20150027766 Printed circuit board and image forming apparatus
01/29/2015US20150027765 Nickel powder for internal electrodes, multilayer ceramic capacitor including the same, and circuit board having electronic component mounted thereon
01/29/2015US20150027764 Multilayer ceramic capacitor, method of manufacturing the same, and board having the same mounted thereon
01/29/2015US20150027763 Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the same
01/29/2015US20150027762 Printed circuit board
01/29/2015US20150027761 Printed circuit board and method of manufacturing the same
01/29/2015US20150027760 Printed circuit board and manufacturing method thereof
01/29/2015US20150027759 Conductive element and method of manufacturing the same, wiring element, and master copy
01/29/2015US20150027758 Multilayer wiring substrate and manufacturing method therefor
01/29/2015US20150027757 Pcb having glass core
01/29/2015US20150027756 Circuit board structure for high frequency signals
01/29/2015US20150027755 Transparent conductive film, substrate carrying transparent conductive film, and production method thereof
01/29/2015US20150027754 Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
01/29/2015US20150027753 Panel structure
01/29/2015US20150027752 Printed circuit board and method of manufacturing same
01/29/2015US20150027751 Flexible circuit board with planarized cover layer structure
01/29/2015US20150027750 Wiring board
01/29/2015DE112013002235T5 Struktur zum Befestigen eines Substrats A structure for fixing a substrate
01/29/2015DE102013214478A1 Nutzen mit mehreren Leiterplatten und Verfahren zu seiner Herstellung Use with a plurality of printed circuit boards and method for its preparation
01/29/2015DE10146227B4 Siliciumnitrid-Sinterkörper, Leiterplatte und thermoelektrisches Modul Silicon nitride sintered body, PCB and thermoelectric module
01/28/2015EP2830400A1 Panel with multiple circuit boards and method of producing the same
01/28/2015EP2830399A1 Printed circuit board cooling
01/28/2015EP2830110A1 Patterning of a composition comprising silver nanowires
01/28/2015EP2830006A1 Article with an electromagnetic-coupling module
01/28/2015EP2829163A2 Substrate for a portable data carrier
01/28/2015CN204131836U 一次性温度记录仪的印制线路板结构 Disposable logger PCB structure
01/28/2015CN204131835U 软硬结合印制线路板 Rigid-Flex PCB
01/28/2015CN204131834U 背光显示屏的fpc金手指焊盘连接结构 Fpc finger pad connection structure backlit display
01/28/2015CN204131833U 改良的背光源fpc Improved backlight fpc
01/28/2015CN204131832U 一种印刷电路板、变压器及模块电源 A printed circuit boards, transformers and power modules
01/28/2015CN204131831U 一种防止大电流传导致使局部过热的电源板 A method of preventing high current conduction resulting in overheating of the power supply board
01/28/2015CN204131830U Pcb独立光学对位点防咬蚀结构 Pcb Optical independent loci anti corrosion structure bite
01/28/2015CN204131829U 改良结构的fpc柔性线路板 Fpc flexible circuit boards improved structure
01/28/2015CN204131828U 可靠性好的fpc线路板 Good reliability fpc board
01/28/2015CN204131827U 防射频干扰的fpc线路板 Anti-RF interference fpc board
01/28/2015CN204131826U 便携式报警仪的抗干扰pcb板 Portable Alarm immunity pcb board
01/28/2015CN204131825U 一种超导热均温电路板 A superconducting circuit board thermal average temperature
01/28/2015CN204131824U 一种柔性电路板 A flexible circuit board
01/28/2015CN204131823U 新型高导热电路板 New high thermal circuit board
01/28/2015CN204131822U 加强绝缘强度的led驱动电源线路板及其封装结构 Reinforced insulation strength led drive power circuit board and package structure
01/28/2015CN204131821U 电路板上led固定结构 Led board fixed structure
01/28/2015CN204131820U 电磁屏蔽膜及包括该电磁屏蔽膜的柔性线路板 Electromagnetic shielding film including the electromagnetic shielding film flexible circuit boards
01/28/2015CN204131819U 一种防止压合起皱的内层芯板 A method of preventing wrinkling laminated inner core
01/28/2015CN104322156A 用于固态光辐射源的安装支撑件及其光源 For solid state light emitter and light installation support
01/28/2015CN104322155A 使用基片结构的电磁信号的重定向 Use redirect electromagnetic signal substrate structure
01/28/2015CN104321469A 低反弹性电解铜箔、使用该电解铜箔的线路板及挠性线路板 Low rebound electrodeposited copper foil, an electrolytic copper foil using the circuit board and the flexible printed circuit board
01/28/2015CN104320917A 集刚性和柔性为一体的双面印制电路板 Set of rigid and flexible as one of the double-sided printed circuit board
01/28/2015CN104320910A 一种电路板焊接结构 A circuit board welding structure
01/28/2015CN104320909A 高阶梯铜电路板及其制作方法 High ladder copper circuit board and its production method
01/28/2015CN104320908A 散热型多层软硬结合印刷板 Thermally multilayer rigid-flex printed board
01/28/2015CN104320907A 包括中断线路的电子控制装置 Comprising an electronic control device interrupt line
01/28/2015CN104320906A 一种规则排版的卷带状补强片及其制作方法 A rule volume strip reinforcing sheet layout and production methods
01/28/2015CN104320905A 印刷电路板、pcba板和电子设备 A printed circuit board, pcba boards and electronic equipment
01/28/2015CN104320871A 一种led二合一电源pcb板 One kind of combo power led pcb board
01/28/2015CN104319504A 一种镶嵌在印刷电路板上的导电螺母连接件及使用方法 A conductive nut embedded in a printed circuit board connector and method of use
01/28/2015CN104319448A 一种基于附电阻膜的高频印制板的多层功率分配网络 A distribution network based on high-frequency printed circuit board attached to the resistive film multilayer power
01/28/2015CN104319264A 一种玻璃上芯片封装摄像头模组 On a glass chip camera module package
01/28/2015CN102781166B 散热基板及其制造方法以及生产该散热基板的涂布装置 Heat dissipation board and manufacturing method thereof and the production of a coating apparatus of the heat radiation substrate
01/28/2015CN102726128B 金属基电路基板的连续体形成方法以及金属基电路基板的连续体 Continuous metal base circuit board and method of forming a continuous metal base circuit board
01/28/2015CN102714915B 电子电路及其形成方法以及电子电路形成用覆铜层压板 And method of forming an electronic circuit and an electronic circuit forming copper-clad laminate
01/28/2015CN102571495B 印刷电路板布线的网络拓扑结构检查方法及检查装置 Printed circuit board wiring network topology inspection methods and inspection equipment
01/28/2015CN102438401B 多层印制线路板 Multilayer printed circuit boards
01/27/2015US8943460 Control unit and method for designing a circuit board of a control unit
01/27/2015US8942008 Electronic device with riser card
01/27/2015US8942006 PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types
01/27/2015US8942005 Low cost, high strength electronics module for airborne object
01/27/2015US8942004 Printed circuit board having electronic components embedded therein
01/27/2015US8942003 Multilayered printed wiring board
01/27/2015US8942002 Three dimensional passive multi-component structures
01/27/2015US8942000 Lead line structure and display panel having the same
01/27/2015US8941999 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
01/27/2015US8941975 Laminated ceramic electronic component
01/27/2015US8941908 Porous electrode sheet, method for producing the same, and display device
01/27/2015US8941552 Composite printed wiring board and wireless communication system
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