| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/14/2013 | WO2013021477A1 Circuit substrate manufacturing method |
| 02/14/2013 | WO2013020543A1 Method for producing a low-induction busbar |
| 02/14/2013 | WO2013020309A1 Electronic component embedded circuit board and manufacturing method thereof |
| 02/14/2013 | WO2012167937A3 Method for producing circuit boards and complete circuit board panels |
| 02/14/2013 | US20130040517 Resin composition for printed circuit board |
| 02/14/2013 | US20130039078 Light emitting device array and light system |
| 02/14/2013 | US20130039025 Printed circuit board |
| 02/14/2013 | US20130039022 Portable electronic device and detachable touch structure |
| 02/14/2013 | US20130039018 Three-Dimensionally Molded Electronic Substrate |
| 02/14/2013 | US20130037945 Semiconductor device |
| 02/14/2013 | US20130037847 Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode |
| 02/14/2013 | US20130037316 Structure and circuit board |
| 02/14/2013 | US20130037315 Delay line structure |
| 02/14/2013 | US20130037314 Bonding material, bonded portion and circuit board |
| 02/14/2013 | US20130037313 Liquid composition and metal-based circuit board |
| 02/14/2013 | US20130037312 High density trace formation method by laser ablation |
| 02/14/2013 | US20130037311 Functionalization of thermal management materials |
| 02/14/2013 | US20130037310 Epoxy resin composition for circuit board, prepreg, laminate, resin sheet, laminated base material for printed wiring board, printed wiring board, and semiconductor device |
| 02/14/2013 | US20130037309 Terminal-integrated metal base package module and terminal-integrated metal base packaging method |
| 02/14/2013 | US20130037308 Reinforced glass cell and method for fabricating the same and cover glass having the reinforced glass cell |
| 02/14/2013 | DE102011109992A1 Leiterplattenkabelvorrichtung für ein Laborprobengerät und Laborprobengerät PCB cable device for a laboratory sample unit and laboratory samples device |
| 02/14/2013 | DE102008032979B4 Elektromagnetische Bandgap-Struktur, diese umfassende Leiterplatte und Herstellungsverfahren Electromagnetic bandgap structure, this comprehensive PCB and manufacturing processes |
| 02/13/2013 | EP2557905A1 Light emitting device array and light system |
| 02/13/2013 | EP2557904A1 Three-dimensionally molded electronic substrate |
| 02/13/2013 | EP2557204A1 Copper foil for printed circuit |
| 02/13/2013 | EP2557099A1 Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board |
| 02/13/2013 | EP2556731A2 Process for producing electric circuits on a given surface |
| 02/13/2013 | EP2556295A2 Conformal oled luminaire with color control |
| 02/13/2013 | EP2138021B1 Electrical connection of components |
| 02/13/2013 | CN202738264U Chip positioning fixture and electronic system thereof |
| 02/13/2013 | CN202738263U Miniaturized voltage transformation device |
| 02/13/2013 | CN202738262U MPPO substrate multilayer circuit board provided with buried resistor |
| 02/13/2013 | CN202738261U Ceramic substrate multilayer circuit board provided with buried resistor |
| 02/13/2013 | CN202738260U FR-4 substrate multilayer circuit board provided with buried capacitor |
| 02/13/2013 | CN202738259U PTFE substrate multilayer circuit board provided with buried capacitor |
| 02/13/2013 | CN202738258U Efficient heat dissipating flexible circuit board |
| 02/13/2013 | CN202738257U FR-4 substrate multilayer circuit board provided with buried resistor |
| 02/13/2013 | CN202738256U PTFE substrate multilayer circuit board provided with buried resistor |
| 02/13/2013 | CN202738255U MPPO substrate multilayer circuit board provided with buried capacitor |
| 02/13/2013 | CN202738254U Ceramic substrate multilayer circuit board provided with buried capacitor |
| 02/13/2013 | CN202738253U Novel multilayer flexibility printed circuit |
| 02/13/2013 | CN202738252U Double-faced flexible circuit board with asymmetric copper thicknesses on two faces |
| 02/13/2013 | CN202738251U Printed circuit board inhibiting electromagnetic interference |
| 02/13/2013 | CN202738250U Semi-finished product for flexible circuit board |
| 02/13/2013 | CN202738249U Hard-and-soft combined circuit board in optical network unit module |
| 02/13/2013 | CN202738248U 印刷电路板 A printed circuit board |
| 02/13/2013 | CN202738247U Circuit board provided with improved heat dissipation performance |
| 02/13/2013 | CN202737725U Frequency converter drive board provided with bus bar |
| 02/13/2013 | CN202736908U Coated structure on surface of printed circuit board or semiconductor chip |
| 02/13/2013 | CN202736187U Motherboard of cash machine |
| 02/13/2013 | CN102934529A 柔性印刷配线板 A flexible printed wiring board |
| 02/13/2013 | CN102934528A Flow channel member, heat exchanger using same, and electronic component device |
| 02/13/2013 | CN102933389A Metal foil coated with filled resin layer and process for producing metal foil coated with filled resin layer |
| 02/13/2013 | CN102933038A Method and apparatus for accurately applying structures to a substrate |
| 02/13/2013 | CN102933036A Insulating board for circuit board production, circuit board and circuit board production method |
| 02/13/2013 | CN102933031A Printed circuit board and fabrication process of printed circuit board |
| 02/13/2013 | CN102933030A Auxiliary bonding pad |
| 02/13/2013 | CN102933029A Power board, single board and main board |
| 02/13/2013 | CN102933028A Printed circuit board and method for manufacturing compression joint holes thereof |
| 02/13/2013 | CN102933027A Method for improving warping or twisted deformation of copper clad laminate and printed circuit board (PCB) |
| 02/13/2013 | CN102933026A Circuit board for frequency generator and manufacturing method thereof |
| 02/13/2013 | CN102933025A Printed circuit board and coupling subassembly of printed circuit board |
| 02/13/2013 | CN102933024A Printed wiring board and method of manufacturing same |
| 02/13/2013 | CN102933023A Light emitting device array and light system |
| 02/13/2013 | CN102933022A Printed circuit board with high-speed differential signal wiring structure |
| 02/13/2013 | CN102928936A Manufacture method of optical printed wiring board |
| 02/13/2013 | CN102924869A Application of black modified silicon dioxide |
| 02/13/2013 | CN102924865A Cyanate ester resin composition and prepreg prepared from same, laminate and metal foil plated laminate produced by using prepreg |
| 02/13/2013 | CN102082376B 电连接器 The electrical connector |
| 02/13/2013 | CN102065630B Printed circuit board (PCB) with high-speed differential signal wiring structure |
| 02/13/2013 | CN102036498B Built-in assembly base plate structure and manufacture method thereof |
| 02/13/2013 | CN101971716B 10g xfp compliant pcb |
| 02/13/2013 | CN101854773B Gold finger protecting device |
| 02/13/2013 | CN101742813B Mount board and semiconductor module |
| 02/13/2013 | CN101691458B Conductive pattern formation ink, method of forming conductive pattern, conductive pattern and wiring substrate |
| 02/13/2013 | CN101546123B Light sensitive resin composition, cured matter and printed circuit substrate having solder mask layer formed with the cured matter |
| 02/13/2013 | CN101401490B Illumination assembly with enhanced thermal conductivity |
| 02/13/2013 | CN101248708B Dielectric substrate with holes and method of manufacture |
| 02/12/2013 | US8373992 Transmission/reception optical module |
| 02/12/2013 | US8373981 Expansion card fastening device |
| 02/12/2013 | US8373428 Probe card assembly and kit, and methods of making same |
| 02/12/2013 | US8373075 Implantable co-fired electrical feedthroughs |
| 02/12/2013 | US8373074 Integrated inductor |
| 02/12/2013 | US8373073 Wiring board and method for manufacturing the same |
| 02/12/2013 | US8373072 Printed circuit board |
| 02/12/2013 | US8373071 Embedded wiring board and method for manufacturing the same |
| 02/12/2013 | US8373070 Metal structure of flexible multi-layer substrate and manufacturing method thereof |
| 02/12/2013 | US8373069 Electronic component mounting substrate and method for manufacturing electronic component mounting substrate |
| 02/12/2013 | US8371026 Method for manufacturing multilayer ceramic electronic device |
| 02/11/2013 | CA2782887A1 Three-dimensionally molded electronic substrate |
| 02/08/2013 | DE202012010677U1 Schaltungsplatte Circuit board |
| 02/08/2013 | DE202012010676U1 Schaltungsplatte Circuit board |
| 02/07/2013 | WO2013019424A1 Apparatus incorporating an optically transmitting circuit board |
| 02/07/2013 | WO2013019085A2 Composition for preparing thermosetting resin and cured article thereof, prepreg including cured article, and metal foil laminated plate and printed wiring board employing prepreg |
| 02/07/2013 | WO2013018777A1 Composition set, electroconductive substrate and manufacturing method thereof, and electroconductive binding material composition |
| 02/07/2013 | WO2013018773A1 Electrolytic copper alloy foil, method for producing same, electrolytic solution used for production of same, negative electrode collector for secondary batteries using same, secondary battery, and electrode of secondary battery |
| 02/07/2013 | WO2013018344A1 Substrate for mounting elements and method for producing same, and semiconductor module and method for producing same |
| 02/07/2013 | WO2013018330A1 Substrate for mounting elements, and semiconductor power module |
| 02/07/2013 | WO2013018257A1 Wiring board |
| 02/07/2013 | WO2013017984A1 Modular lighting assembly adapter part |