| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/28/2013 | WO2013028418A1 Metal clad circuit board |
| 02/28/2013 | WO2013027856A2 Wiring board |
| 02/28/2013 | WO2013027781A1 Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same |
| 02/28/2013 | WO2013027732A1 Curable resin composition, film, prepreg, laminate, cured product and composite body |
| 02/28/2013 | WO2013027718A1 Component-mounting printed circuit board and manufacturing method for same |
| 02/28/2013 | WO2013027444A1 Copper foil for printed wiring board and laminated body using same |
| 02/28/2013 | WO2013027437A1 Rolled copper foil |
| 02/28/2013 | WO2013027409A1 Wiring board and high frequency module using same |
| 02/28/2013 | WO2013027169A2 Light source using a bent pcb |
| 02/28/2013 | WO2013026527A1 Substrate for the construction of electronic elements |
| 02/28/2013 | WO2012151372A3 High-voltage resistance and retention of printed flex circuits |
| 02/28/2013 | US20130053106 Integration of sensors and other electronic components |
| 02/28/2013 | US20130051018 Metal clad circuit board |
| 02/28/2013 | US20130050971 Laminate printed board and manufacturing method thereof |
| 02/28/2013 | US20130050969 Storage card |
| 02/28/2013 | US20130050968 Circuit board with higher current |
| 02/28/2013 | US20130050967 Functional device-embedded substrate |
| 02/28/2013 | US20130050957 Electronic component incorporating board and composite module |
| 02/28/2013 | US20130050948 Mobile electric apparatus having solar cells |
| 02/28/2013 | US20130050226 Die-cut through-glass via and methods for forming same |
| 02/28/2013 | US20130050044 Plane-structured ebg |
| 02/28/2013 | US20130049202 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board |
| 02/28/2013 | US20130048364 Ball grid array formed on printed circuit board |
| 02/28/2013 | US20130048363 Circuit board |
| 02/28/2013 | US20130048362 Wiring structure, display panel, and display device |
| 02/28/2013 | US20130048361 Component-incorporated wiring substrate and method of manufacturing the same |
| 02/28/2013 | US20130048360 System in package, printed circuit board provided with such system in package |
| 02/28/2013 | US20130048359 Substrate with spring terminal and method of manufacturing the same |
| 02/28/2013 | US20130048358 Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof |
| 02/28/2013 | US20130048357 Photosensitive resin composition, cured product thereof, and printed wiring board |
| 02/28/2013 | US20130048356 Mitigation and elimination of tin whiskers |
| 02/28/2013 | US20130048355 Printed wiring board |
| 02/28/2013 | US20130048354 Transparent conductive film and touch panel using the same |
| 02/28/2013 | US20130048353 Transparent conductive film and touch panel using the same |
| 02/28/2013 | US20130048352 Printed circuit board |
| 02/28/2013 | US20130048351 Electronic package structure and method for manufacturing same |
| 02/28/2013 | US20130048350 Base member |
| 02/28/2013 | US20130048349 Transparent conductive film and touch panel using the same |
| 02/28/2013 | US20130048348 Transparent conductive film and manufacturing method therefor |
| 02/28/2013 | US20130048347 Laminated flex circuit layers for electronic device components |
| 02/28/2013 | US20130048346 Wiring board having an engineered metallization layer |
| 02/28/2013 | US20130048345 Multilayer board |
| 02/28/2013 | US20130048344 High frequency circuit board |
| 02/28/2013 | US20130048343 Circuit board with handles |
| 02/28/2013 | US20130048342 Circuit board |
| 02/28/2013 | DE19842237B4 Befestigungsanordnung für eine Zusatzleiterplatte auf einer Mutterleiterplatte Mounting arrangement for an additional circuit board on a mother board |
| 02/28/2013 | DE112010004973T5 Leitpaste für Siebdruckverfahren Conductive paste for screen printing method |
| 02/28/2013 | DE10324047B4 Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit Electronic unit as well as methods for producing an electronic unit |
| 02/28/2013 | DE102012102804B3 Switching element for e.g. electrochromic display of e.g. children toy, has spacer formed such that switching portion applies compressive force on substrate layers to make conductors to contact in closed switch position |
| 02/28/2013 | DE102012100796A1 Chip-Zu-Chip-Abstandskontrolle für eine Halbleiterstruktur und Verfahren zu deren Herstellung Chip-to-chip spacing control for a semiconductor structure and process for their preparation |
| 02/28/2013 | DE102011111488A1 Leiterplattensystem Printed circuit boards |
| 02/28/2013 | DE102011110799A1 Substrat für den Aufbau elektronischer Elemente Substrate for the development of electronic elements |
| 02/28/2013 | DE102011081429A1 Adapter plug for printed circuit board system for electric appliance, has insulating portion that is arranged between inner conductor and screen case, and slots which are extended in clamping leg portions |
| 02/27/2013 | EP2563103A1 Wiring substrate, method for manufacturing wiring substrate, and via paste |
| 02/27/2013 | EP2563102A1 Light emitting module and backlight unit having the same |
| 02/27/2013 | EP2563101A1 Flexible circuit board and production method therefor |
| 02/27/2013 | EP2562195A1 Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
| 02/27/2013 | EP2561741A1 A thermally controlled assembly |
| 02/27/2013 | EP2561731A1 Metal core circuit board with conductive pins |
| 02/27/2013 | EP2561729A1 Printed circuit board with cavity |
| 02/27/2013 | EP2561728A1 A thermally controlled assembly |
| 02/27/2013 | EP2561531A1 Power supply module |
| 02/27/2013 | CN202759688U Printed circuit board and electronic product housing fixed structure |
| 02/27/2013 | CN202759666U Printed circuit board |
| 02/27/2013 | CN202759665U Flexible led t5 lamp tube aluminium base circuit board |
| 02/27/2013 | CN202759664U High-frequency substrate structure |
| 02/27/2013 | CN202759663U Flexible circuit board used for liquid crystal module provided with backlight source |
| 02/27/2013 | CN202759662U Multilayer printed circuit board |
| 02/27/2013 | CN202759661U Printed circuit board and electronic equipment |
| 02/27/2013 | CN202759660U Electroless nickel/immersion gold (ENIG) printed circuit board |
| 02/27/2013 | CN202759659U Equipment communication PCB board |
| 02/27/2013 | CN202759438U Circuit board layout structure of wireless emission module |
| 02/27/2013 | CN102948269A Hbn insulator layers and associated methods |
| 02/27/2013 | CN102948266A Printed circuit board with cavity |
| 02/27/2013 | CN102948265A Bonded material, and process for production thereof |
| 02/27/2013 | CN102948264A Laminate for circuit boards and metal-based circuit boards |
| 02/27/2013 | CN102947391A 膜或板 Film or sheet |
| 02/27/2013 | CN102947390A Resin composition used to form resin layer of metal base substrate, metal base substrate, and method for producing metal base substrate |
| 02/27/2013 | CN102946697A Film circuit board manufacturing method and film circuit board |
| 02/27/2013 | CN102946695A Through hole structure, printed circuit board, and manufacture method of through hole structure |
| 02/27/2013 | CN102946693A Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof |
| 02/27/2013 | CN102946689A Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure |
| 02/27/2013 | CN102946688A Flexible circuit board |
| 02/27/2013 | CN102946687A Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof |
| 02/27/2013 | CN102942878A Thermoplastic resin adhesive film |
| 02/27/2013 | CN102231936B Double sided flexible printed circuit board for use hinge region |
| 02/27/2013 | CN102215627B Multilayer circuit board |
| 02/27/2013 | CN101801156B Method for manufacturing flexible printed circuit board and structure thereof |
| 02/27/2013 | CN101657073B Multi-power-supply PCB composite panel |
| 02/27/2013 | CN101540449B Socket contact |
| 02/27/2013 | CN101316499B Cooling substrates and cooling material |
| 02/26/2013 | US8385748 Printed circuit board and optical transmission device |
| 02/26/2013 | US8385083 Method and system for isolating local area networks over a co-axial wiring for energy management |
| 02/26/2013 | US8385082 Electrical connection arrangement having PCB with contacts received therein |
| 02/26/2013 | US8385081 Stacked mounting structure |
| 02/26/2013 | US8385078 Power transducer |
| 02/26/2013 | US8385077 Electronic device |
| 02/26/2013 | US8385076 Electronic device with pivotable arm |
| 02/26/2013 | US8385057 Fully extendable dual-segmented housing assembly for mobile computing device |
| 02/26/2013 | US8385028 Galvanic isolator |