Patents for H05K 1 - Printed circuits (98,583)
02/2013
02/26/2013US8384204 Circuit carrier and semiconductor package using the same
02/26/2013US8383958 Method to build robust mechanical structures on substrate surfaces
02/26/2013US8383957 Printed circuit board
02/26/2013US8383956 Plating apparatus, plating method and multilayer printed circuit board
02/26/2013US8383955 Printed circuit board
02/26/2013US8383954 Warpage preventing substrates
02/26/2013US8383953 Circuit board and method for manufacturing the same
02/26/2013US8383952 Printed compatible designs and layout schemes for printed electronics
02/26/2013US8383951 Matched-impedance connector footprints
02/26/2013US8383950 Metal etch stop fabrication method and structure
02/26/2013US8383949 Method to form lateral pad on edge of wafer
02/26/2013US8383948 Flex-rigid wiring board and method for manufacturing the same
02/26/2013US8383947 Conductor module and electromagnetic welding method
02/26/2013US8383738 Epoxy resin composition, and prepreg and printed circuit board using the same
02/26/2013US8383230 Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
02/21/2013WO2013025473A2 Functionalization of thermal management materials
02/21/2013WO2013024849A1 Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same
02/21/2013WO2013024813A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
02/21/2013WO2013024711A1 Tuner module, circuit board, and method for assembling circuit board
02/21/2013WO2013024280A1 High resolution printing
02/21/2013WO2013024038A1 Electronic module, lighting device and manufacturing method of the electronic module
02/21/2013WO2013023388A1 Embeded circuit board and method for manufacturing the same
02/21/2013WO2012175580A3 Printed circuit board comprising an electrode configuration of an capacitive sensor
02/21/2013WO2012169550A9 Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate
02/21/2013US20130044448 Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement
02/21/2013US20130044447 Vehicle-mountable junction box, and circuit member and circuit unit usable for the vehicle-mountable junction box
02/21/2013US20130044443 Flexible printed circuit and touchscreen
02/21/2013US20130044442 Sensor having damping
02/21/2013US20130044441 Device for Electric Insulation of a Conducting Plane
02/21/2013US20130044438 Chip card holding mechanism and portable electronic device using the same
02/21/2013US20130043068 Touch panel and manufacturing method thereof
02/21/2013US20130043067 Wire Substrate Structure
02/21/2013US20130043066 Disc comprising an electrical connection element
02/21/2013US20130043065 Flexible substrates and method of manufacturing the same
02/21/2013US20130043064 Ceramic elements module
02/21/2013US20130043063 Method of producing printed circuit board, and printed board produced by the method
02/21/2013US20130043062 Method of forming a conductive image on a non-conductive surface
02/21/2013US20130043061 Circuit structure of electronic device and its manufacturing method
02/21/2013US20130043060 Method for forming coreless flip chip ball grid array (fcbga) substrates and such substrates formed by the method
02/21/2013DE102011004543B4 Widerstand, Leiterplatte und elektrisches oder elektronisches Gerät Resistance, PCB and electrical and electronic equipment
02/20/2013EP2560467A1 Method for mounting a component to an electric circuit board, electric circuit board and electric circuit board arrangement
02/20/2013EP2560466A1 Board and method for manufacturing board
02/20/2013EP2560027A1 Connection substrate
02/20/2013EP2559930A1 Three-dimensional tensile and helical circuit board for light-emitting diode lamp and manufacturing method thereof
02/20/2013EP2559327A1 Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein
02/20/2013EP2559101A2 Silk electronic components
02/20/2013EP2558849A1 Ion-sensitive sensor element
02/20/2013CN202750338U Resistor-burying circuit board
02/20/2013CN202750337U PCB (printed circuit board) with compatible single SIM (subscriber identity module) card base and dual SIM card base
02/20/2013CN202750336U Over-voltage protection printed circuit board (PCB)
02/20/2013CN202750335U 电路板 Board
02/20/2013CN202750334U Printed circuit board used for replacing coil of transformer
02/20/2013CN202750333U Printed circuit board
02/20/2013CN202750332U PCB circuit board
02/20/2013CN202750331U Printed circuit board
02/20/2013CN202750330U Isolating pillar for power amplifier circuit board
02/20/2013CN202750329U Film circuit substrate
02/20/2013CN202750328U Liquid crystal display module for FPC monolayer area windowing
02/20/2013CN202750327U Ceramic circuit board of solar concentrating photovoltaic photoelectric conversion receiver
02/20/2013CN202749623U Connector and circuit board
02/20/2013CN202749278U Circuit board structure capable of improving key feel
02/20/2013CN202749218U Current transformer based on PCB (printed circuit board)-type Rogowski coil
02/20/2013CN102939800A Surface-roughened copper foil and copper-clad laminated substrate
02/20/2013CN102939799A Method for contacting a printed circuit board having electric contacts on both sides and such a printed circuit board
02/20/2013CN102938971A Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof
02/20/2013CN102938970A Composite heat conduction type printed circuit board (PCB) and manufacture method thereof
02/20/2013CN101990355B Soft-hard circuit board and process thereof
02/20/2013CN101971375B Optoelectronic semiconductor component and printed circuit board
02/20/2013CN101847791B Electronic assembly and a storage device thereof
02/20/2013CN101651008B Inductor element
02/20/2013CN101533325B Double-sided touch sensitive panel and flex circuit bonding
02/19/2013US8380927 Upgradable system with reconfigurable interconnect
02/19/2013US8380326 Insulated implantable electrical circuit
02/19/2013US8380080 Optical transceiver
02/19/2013US8379407 Apparatus for mounting and electrical connection of a connector between a package LED lamp and a PCB
02/19/2013US8379395 Electrical component
02/19/2013US8379394 Sliding expansion data card
02/19/2013US8379393 Semiconductor memory card with controller chip
02/19/2013US8379392 Light-based sealing and device packaging
02/19/2013US8379163 Display device
02/19/2013US8378231 Semiconductor device and method for manufacturing the same
02/19/2013US8378230 Printed wiring board and method for manufacturing the same
02/19/2013US8378229 Circuit board and method for manufacturing semiconductor modules and circuit boards
02/19/2013US8378228 Surface mount component having magnetic layer thereon and method of forming same
02/19/2013US8378227 Method of forming wiring board and wiring board obtained
02/19/2013US8378226 Wired circuit board
02/19/2013US8378225 Printed circuit board and method for fabricating the same
02/19/2013US8378224 Tape for semiconductor package and cutting method thereof
02/19/2013US8378223 Delay line structure
02/19/2013US8378222 Method of reducing solder wicking on a substrate
02/19/2013US8377585 Low cost electrical terminals manufactured from conductive loaded resin-based materials
02/19/2013US8377544 Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity
02/19/2013US8375576 Method for manufacturing wafer scale heat slug system
02/14/2013WO2013023101A1 Multiple layer z-axis interconnect apparatus and method of use
02/14/2013WO2013022861A1 Compact, thermally-enhanced substrate for lighting applications
02/14/2013WO2013022602A1 Terminal with compliant barb
02/14/2013WO2013022030A1 Flexible conductive material
02/14/2013WO2013021895A1 Conductive material and connection structure
02/14/2013WO2013021834A1 Printed circuit board wiring-integrated sheet, printed circuit board formed using printed circuit board wiring-integrated sheet, and manufacturing method for printed circuit board wiring-integrated sheet
02/14/2013WO2013021750A1 Wiring substrate and method for manufacturing same and semiconductor device