Patents for H05K 1 - Printed circuits (98,583) |
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02/26/2013 | US8384204 Circuit carrier and semiconductor package using the same |
02/26/2013 | US8383958 Method to build robust mechanical structures on substrate surfaces |
02/26/2013 | US8383957 Printed circuit board |
02/26/2013 | US8383956 Plating apparatus, plating method and multilayer printed circuit board |
02/26/2013 | US8383955 Printed circuit board |
02/26/2013 | US8383954 Warpage preventing substrates |
02/26/2013 | US8383953 Circuit board and method for manufacturing the same |
02/26/2013 | US8383952 Printed compatible designs and layout schemes for printed electronics |
02/26/2013 | US8383951 Matched-impedance connector footprints |
02/26/2013 | US8383950 Metal etch stop fabrication method and structure |
02/26/2013 | US8383949 Method to form lateral pad on edge of wafer |
02/26/2013 | US8383948 Flex-rigid wiring board and method for manufacturing the same |
02/26/2013 | US8383947 Conductor module and electromagnetic welding method |
02/26/2013 | US8383738 Epoxy resin composition, and prepreg and printed circuit board using the same |
02/26/2013 | US8383230 Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
02/21/2013 | WO2013025473A2 Functionalization of thermal management materials |
02/21/2013 | WO2013024849A1 Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same |
02/21/2013 | WO2013024813A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module |
02/21/2013 | WO2013024711A1 Tuner module, circuit board, and method for assembling circuit board |
02/21/2013 | WO2013024280A1 High resolution printing |
02/21/2013 | WO2013024038A1 Electronic module, lighting device and manufacturing method of the electronic module |
02/21/2013 | WO2013023388A1 Embeded circuit board and method for manufacturing the same |
02/21/2013 | WO2012175580A3 Printed circuit board comprising an electrode configuration of an capacitive sensor |
02/21/2013 | WO2012169550A9 Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate |
02/21/2013 | US20130044448 Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement |
02/21/2013 | US20130044447 Vehicle-mountable junction box, and circuit member and circuit unit usable for the vehicle-mountable junction box |
02/21/2013 | US20130044443 Flexible printed circuit and touchscreen |
02/21/2013 | US20130044442 Sensor having damping |
02/21/2013 | US20130044441 Device for Electric Insulation of a Conducting Plane |
02/21/2013 | US20130044438 Chip card holding mechanism and portable electronic device using the same |
02/21/2013 | US20130043068 Touch panel and manufacturing method thereof |
02/21/2013 | US20130043067 Wire Substrate Structure |
02/21/2013 | US20130043066 Disc comprising an electrical connection element |
02/21/2013 | US20130043065 Flexible substrates and method of manufacturing the same |
02/21/2013 | US20130043064 Ceramic elements module |
02/21/2013 | US20130043063 Method of producing printed circuit board, and printed board produced by the method |
02/21/2013 | US20130043062 Method of forming a conductive image on a non-conductive surface |
02/21/2013 | US20130043061 Circuit structure of electronic device and its manufacturing method |
02/21/2013 | US20130043060 Method for forming coreless flip chip ball grid array (fcbga) substrates and such substrates formed by the method |
02/21/2013 | DE102011004543B4 Widerstand, Leiterplatte und elektrisches oder elektronisches Gerät Resistance, PCB and electrical and electronic equipment |
02/20/2013 | EP2560467A1 Method for mounting a component to an electric circuit board, electric circuit board and electric circuit board arrangement |
02/20/2013 | EP2560466A1 Board and method for manufacturing board |
02/20/2013 | EP2560027A1 Connection substrate |
02/20/2013 | EP2559930A1 Three-dimensional tensile and helical circuit board for light-emitting diode lamp and manufacturing method thereof |
02/20/2013 | EP2559327A1 Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
02/20/2013 | EP2559101A2 Silk electronic components |
02/20/2013 | EP2558849A1 Ion-sensitive sensor element |
02/20/2013 | CN202750338U Resistor-burying circuit board |
02/20/2013 | CN202750337U PCB (printed circuit board) with compatible single SIM (subscriber identity module) card base and dual SIM card base |
02/20/2013 | CN202750336U Over-voltage protection printed circuit board (PCB) |
02/20/2013 | CN202750335U 电路板 Board |
02/20/2013 | CN202750334U Printed circuit board used for replacing coil of transformer |
02/20/2013 | CN202750333U Printed circuit board |
02/20/2013 | CN202750332U PCB circuit board |
02/20/2013 | CN202750331U Printed circuit board |
02/20/2013 | CN202750330U Isolating pillar for power amplifier circuit board |
02/20/2013 | CN202750329U Film circuit substrate |
02/20/2013 | CN202750328U Liquid crystal display module for FPC monolayer area windowing |
02/20/2013 | CN202750327U Ceramic circuit board of solar concentrating photovoltaic photoelectric conversion receiver |
02/20/2013 | CN202749623U Connector and circuit board |
02/20/2013 | CN202749278U Circuit board structure capable of improving key feel |
02/20/2013 | CN202749218U Current transformer based on PCB (printed circuit board)-type Rogowski coil |
02/20/2013 | CN102939800A Surface-roughened copper foil and copper-clad laminated substrate |
02/20/2013 | CN102939799A Method for contacting a printed circuit board having electric contacts on both sides and such a printed circuit board |
02/20/2013 | CN102938971A Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
02/20/2013 | CN102938970A Composite heat conduction type printed circuit board (PCB) and manufacture method thereof |
02/20/2013 | CN101990355B Soft-hard circuit board and process thereof |
02/20/2013 | CN101971375B Optoelectronic semiconductor component and printed circuit board |
02/20/2013 | CN101847791B Electronic assembly and a storage device thereof |
02/20/2013 | CN101651008B Inductor element |
02/20/2013 | CN101533325B Double-sided touch sensitive panel and flex circuit bonding |
02/19/2013 | US8380927 Upgradable system with reconfigurable interconnect |
02/19/2013 | US8380326 Insulated implantable electrical circuit |
02/19/2013 | US8380080 Optical transceiver |
02/19/2013 | US8379407 Apparatus for mounting and electrical connection of a connector between a package LED lamp and a PCB |
02/19/2013 | US8379395 Electrical component |
02/19/2013 | US8379394 Sliding expansion data card |
02/19/2013 | US8379393 Semiconductor memory card with controller chip |
02/19/2013 | US8379392 Light-based sealing and device packaging |
02/19/2013 | US8379163 Display device |
02/19/2013 | US8378231 Semiconductor device and method for manufacturing the same |
02/19/2013 | US8378230 Printed wiring board and method for manufacturing the same |
02/19/2013 | US8378229 Circuit board and method for manufacturing semiconductor modules and circuit boards |
02/19/2013 | US8378228 Surface mount component having magnetic layer thereon and method of forming same |
02/19/2013 | US8378227 Method of forming wiring board and wiring board obtained |
02/19/2013 | US8378226 Wired circuit board |
02/19/2013 | US8378225 Printed circuit board and method for fabricating the same |
02/19/2013 | US8378224 Tape for semiconductor package and cutting method thereof |
02/19/2013 | US8378223 Delay line structure |
02/19/2013 | US8378222 Method of reducing solder wicking on a substrate |
02/19/2013 | US8377585 Low cost electrical terminals manufactured from conductive loaded resin-based materials |
02/19/2013 | US8377544 Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity |
02/19/2013 | US8375576 Method for manufacturing wafer scale heat slug system |
02/14/2013 | WO2013023101A1 Multiple layer z-axis interconnect apparatus and method of use |
02/14/2013 | WO2013022861A1 Compact, thermally-enhanced substrate for lighting applications |
02/14/2013 | WO2013022602A1 Terminal with compliant barb |
02/14/2013 | WO2013022030A1 Flexible conductive material |
02/14/2013 | WO2013021895A1 Conductive material and connection structure |
02/14/2013 | WO2013021834A1 Printed circuit board wiring-integrated sheet, printed circuit board formed using printed circuit board wiring-integrated sheet, and manufacturing method for printed circuit board wiring-integrated sheet |
02/14/2013 | WO2013021750A1 Wiring substrate and method for manufacturing same and semiconductor device |