Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
04/2014
04/30/2014EP2724386A1 Led structure with enhanced mirror reflectivity
04/30/2014DE112012003294T5 Optoelektronisches Element und dessen Herstellungsverfahren An opto-electronic element and its manufacturing method
04/30/2014DE102013111909A1 Organische lichtemittiernde Vorrichtung und Herstellungsverfahren derselben Organic lichtemittiernde device and manufacturing method thereof
04/30/2014DE102013000911A1 Formgehäuse für lichtemittierende Vorrichtung und lichtemittierende Vorrichtung, die dieses verwendet Case shape light emitting device and light emitting device using this
04/30/2014DE102012110403A1 Optoelektronisches Bauelement Optoelectronic component
04/30/2014DE102012110357A1 Method for pre-manufacturing LED housing, involves joining insulating layer and conductor rack substrate together, and galvanizing metal reflective layer on exposed sides of solder pads and strip conductors
04/30/2014DE102012110261A1 Gehäuse für ein optoelektronisches Bauelement und Verfahren zur Herstellung eines Gehäuses A housing for an optoelectronic device and method for producing a housing
04/30/2014DE102012021238A1 Dichter Steckverbinder und LED-Leuchtmodul ausgestattet mit einem gedichteten Steckverbinder Proof connector and LED light module equipped with a sealed connector
04/30/2014DE102012021223A1 Verfahren zur Optimierung der Farbqualität von Lichtquellen A method for optimizing the color quality of light sources
04/30/2014CN203574940U Circuit board of COB LED module
04/30/2014CN203574937U PCB (printed circuit board) structure used in LED nixie tube
04/30/2014CN203574007U LED support
04/30/2014CN203574006U LED light source
04/30/2014CN203574005U Self-packaging LED silica gel chip structure
04/30/2014CN203574004U LED support
04/30/2014CN203574003U LED having dynamically adjustable visual effect
04/30/2014CN203574002U Outdoor high-definition high-cup full-color LED support
04/30/2014CN203574001U Light-emitting diode
04/30/2014CN203574000U Light-emitting diode chip
04/30/2014CN203573984U Empty encapsulation LED digital tube
04/30/2014CN203573983U Cob led module
04/30/2014CN203573982U High-brightness COB LED module
04/30/2014CN203573981U Cob led module
04/30/2014CN203573980U LED surface light source
04/30/2014CN103765619A Light emitting device and display device
04/30/2014CN103765618A 发光装置和显示装置 A light emitting device and a display device
04/30/2014CN103765617A Light emitting apparatus, and light irradiation apparatus provided with light emitting apparatus
04/30/2014CN103765616A Light-emitting diode chip
04/30/2014CN103765615A LED structure with enhanced mirror reflectivity
04/30/2014CN103765614A Semiconductor light-emitting element
04/30/2014CN103765613A Light emitting devices having light coupling layers with recessed electrodes
04/30/2014CN103765612A Optoelectronic semiconductor chip
04/30/2014CN103765587A Solid state transducers with state detection, and associated systems and methods
04/30/2014CN103765586A Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods
04/30/2014CN103765567A Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging
04/30/2014CN103765556A Discontinuous patterned bonds for semiconductor devices and associated systems and methods
04/30/2014CN103765094A Optical semiconductor-based lighting apparatus
04/30/2014CN103765086A Automotive headlamp apparatus
04/30/2014CN103764790A Phosphor based on a lanthanum cerium terbium phosphate with stabilized brightness, preparation process and use in a luminescent device
04/30/2014CN103764363A Compression molding method and device for light-emitting device reflector
04/30/2014CN103762299A Manufacturing method of heat-dissipating light-emitting diode
04/30/2014CN103762298A LED wafer combination package material and technology
04/30/2014CN103762297A LED packaging material
04/30/2014CN103762296A Light emitting diode encapsulating structure
04/30/2014CN103762295A Method for packaging signal receiving and sending diode
04/30/2014CN103762294A Ceramic substrate with temperature sensing function and manufacturing method of ceramic substrate with temperature sensing function
04/30/2014CN103762293A Strength-bonding-type transparent and multi-angle light emission LED lamp bar and manufacturing method thereof
04/30/2014CN103762292A LED packaging technology for using low-light-reflection black EMC to achieve high-light-reflection effect
04/30/2014CN103762291A Sheet arrangement device and sheet feeding device suitable for EMC package of LED supports
04/30/2014CN103762290A Heat-dissipating light-emitting diode
04/30/2014CN103762289A Light-emitting diode
04/30/2014CN103762288A Reflective arc type isolation groove for high-voltage LED
04/30/2014CN103762287A Novel patterned substrate and manufacturing method thereof
04/30/2014CN103762286A LED with high light extraction efficiency
04/30/2014CN103762285A Method for self-assembly of substrates and devices obtained thereof
04/30/2014CN103762284A Growing method of silicon quantum dot crystal
04/30/2014CN103762283A LED flip chip
04/30/2014CN103762282A LED fluorescent film manufacturing method
04/30/2014CN103762265A Novel optical interconnection structure based on standard CMOS process and manufacturing method thereof
04/30/2014CN103762222A Modularized array high-voltage LED chip and method for manufacturing modularized array high-voltage LED chip
04/30/2014CN103762211A Flexible circuit substrate double-sided light-emitting LED array light source
04/30/2014CN103762210A Circuit substrate-free LED array light source
04/30/2014CN103762209A Color temperature and color rendering-adjustable light emitting diode
04/30/2014CN103761926A LED module and display unit for same
04/30/2014CN103761924A Light-emitting diode package and driving method thereof
04/30/2014CN103759228A Surface-mount Piranha LED lamp
04/30/2014CN103759148A LED (light emitting diode) light source
04/30/2014CN103756674A Oxynitride orange-red fluorescent material as well as light-emitting film or light-emitting sheet and light-emitting element comprising same
04/30/2014CN103756255A LED (Light Emitting Diode) lamp
04/30/2014CN102575164B Borosilicate luminescent material and preparing method thereof
04/30/2014CN102532900B Organosilicon lens material for power type light-emitting diode (LED) packaging
04/30/2014CN102420274B White light emission device based on ultraviolet light excitation and preparation method thereof
04/30/2014CN102412357B LED (light-emitting diode) of thin film structure
04/30/2014CN102386286B Chip transferring method and chip transferring equipment
04/30/2014CN102368523B Fully-automatic patch-type LED die bonder with new operation flows
04/30/2014CN102306691B Method for raising light emitting diode luminescence efficiency
04/30/2014CN102299226B LED (light emitting diode) with vertical structure and manufacturing method thereof
04/30/2014CN102290505B GaN-base light-emitting diode chip and manufacturing method thereof
04/30/2014CN102280567B Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same
04/30/2014CN102263181B Substrate, light-emitting diode (LED) epitaxial wafer with substrate, chip and luminous device
04/30/2014CN102257644B Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component
04/30/2014CN102194973B Wafer-grade packaging method of ultraviolet LED packaging structure
04/30/2014CN102194928B Method for manufacturing light emitting diode (LED) chip
04/30/2014CN102177595B Optoelectronic semiconductor body
04/30/2014CN102157504B Light emitting diode package and light unit having the same
04/30/2014CN102130272B Light emitting device package and light unit having the same
04/30/2014CN102104012B Manufacturing method of light-emitting diode
04/30/2014CN102047453B Semiconductor light-emitting device
04/30/2014CN101946115B Gls-alike led light source
04/30/2014CN101944565B Light emitting device and method for manufacturing same
04/30/2014CN101826588B Light emitting module and light unit having the same
04/30/2014CN101595574B Arrangement for generating mixed light, and method for the production of such an arrangement
04/29/2014US8711893 Optoelectronic component and method for producing an optoelectronic component
04/29/2014US8711066 Image display device and display unit for image display device
04/29/2014US8710741 Illuminating device
04/29/2014US8710737 Light-emitting device
04/29/2014US8710734 Light emitting device
04/29/2014US8710681 Isolation rings for blocking the interface between package components and the respective molding compound
04/29/2014US8710539 Metal foil laminate, substrate for mounting LED, and light source device
04/29/2014US8710538 Light-emitting device with a spacer at bottom surface
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