Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2014
05/14/2014CN103794698A 发光二极管 Led
05/14/2014CN103794697A 一种led封装工艺 One kind of led packaging technology
05/14/2014CN103794696A 一种多层曲面纹路的发光二极管封装结构 A light emitting diode package structure of the surface texture of a multilayer
05/14/2014CN103794695A 覆晶式led芯片 Flip-chip led chip
05/14/2014CN103794694A 具有拉伸应变的硅基锗薄膜及其制备方法 Silicon germanium film and preparation method has a tensile strain
05/14/2014CN103794693A 一种发光二极管及光学相干层析成像系统 A light-emitting diodes and optical coherence tomography system
05/14/2014CN103794692A 一种氧化锌基异质结发光器件及其制备方法 A zinc oxide-based heterojunction light emitting device and its preparation method
05/14/2014CN103794691A 发光二极管及其制造方法 The method of manufacturing a light emitting diode and
05/14/2014CN103794690A GaN基发光二极管及其制作方法 GaN-based light emitting diode and manufacturing method thereof
05/14/2014CN103794689A 覆晶式led芯片的制作方法 Production methods flip-chip led chip
05/14/2014CN103794688A 一种光子晶体结构GaN基LED的制备方法 One kind of the photonic crystal structure GaN-based LED in the preparation of
05/14/2014CN103794687A 氮化镓led制备方法、氮化镓led和芯片 GaN-led preparation, gallium nitride led and chips
05/14/2014CN103794686A 半导体发光器件及其制造方法 The semiconductor light emitting device and its manufacturing method
05/14/2014CN103794685A 一种led扩膜工艺 One kind of led expansion of the membrane process
05/14/2014CN103794684A 一种led裂片机的校准方法 A method of calibration machine led lobes
05/14/2014CN103794683A 一种新的倒膜工艺 A new inverted membrane technology
05/14/2014CN103794682A 一种新的清洗工艺 A new cleaning process
05/14/2014CN103794681A 一种新的腐蚀工艺 A new etching process
05/14/2014CN103794617A 发光二极管显示面板及其制作方法 Light-emitting diode display panel and manufacturing method thereof
05/14/2014CN103794604A 一体式功率半导体模块 Integrated power semiconductor module
05/14/2014CN103794603A 免封装uvled固化光源模组 Free Package uvled curing light module
05/14/2014CN103794602A 一种全方位出光的高效led模组器件 A holistic and efficient light led module devices
05/14/2014CN103794601A 插接式led荧光晶体片及其制备方法与led灯泡 Plug-led fluorescent crystal pieces and preparation method and led bulb
05/14/2014CN103794600A 高显色指数led均匀光源 High color rendering index led uniform light source
05/14/2014CN103792784A 图形化衬底用掩膜版、图形化衬底及其制造方法 Patterning the substrate with a mask, patterning a substrate and its manufacturing method
05/14/2014CN103791286A 线状led光源、线状led灯及线状led光源的制备方法 Preparation linear led light, led lights and linear led linear light sources
05/14/2014CN103789772A 金属的表面处理剂 A metal surface treatment agent
05/14/2014CN103788948A 铕铽共掺杂稀土硅酸盐发光材料、制备方法及其应用 A total of europium, terbium-doped rare earth silicate luminescent materials, preparation methods and its application
05/14/2014CN103788658A 硅酮树脂组合物、使用该组合物的硅酮积层基板及它的制造方法、和led装置 A silicone resin composition, a silicone laminated substrate using the composition and its manufacturing method, and led apparatus
05/14/2014CN102876281B 纳米TiO2改性的COB-LED压条用高折有机硅胶的制备方法 Nano-TiO2 modified COB-LED batten with high refractive silicone preparation of
05/14/2014CN102863623B 树枝状聚合物改性高折射率有机硅树脂的制备方法 Dendrimer modified high refractive index silicone resin prepared
05/14/2014CN102569565B 发光二极管晶片的点测方法 Point-emitting diode wafer measurement method
05/14/2014CN102447044B 绝缘底板发光芯片封装结构 The light emitting chip package structure insulating substrate
05/14/2014CN102437267B 金属基底板发光芯片封装结构 The metal base plate the light emitting chip package structure
05/14/2014CN102326267B 氮化物系半导体发光元件及其制造方法 The nitride-based semiconductor light-emitting device and its manufacturing method
05/14/2014CN102319680B 一种smd led贴片分光机的芯片定位装置 One kind of sorting machines smd led SMD chip positioning device
05/14/2014CN102280558B 一种搪瓷电致发光元件电极结构 An enameled electroluminescent element electrode structure
05/14/2014CN102265416B 半导体发光元件 The semiconductor light emitting element
05/14/2014CN102214617B 半导体封装基板 The semiconductor package substrate
05/14/2014CN102194945B 发光装置及其形成方法 Light-emitting device and method of forming
05/14/2014CN102179970B 导热材料及其制备工艺,以及使用该导热材料的led线路板 Thermally conductive material and its preparation process, and the use of the thermal conductivity of the material led board
05/14/2014CN102163666B 混合发光二极管芯片和具有其的发光二极管器件及制造法 Mixing the light emitting diode chip having a light emitting diode device and its manufacturing method
05/14/2014CN102101910B 聚合物及其制造方法,以及包括其的光学元件及光电装置 Polymers and their manufacturing method, and an optical element including a photovoltaic device, and
05/14/2014CN102007612B 发光设备和使用该发光设备的显示设备 A light emitting device using the light-emitting device and a display device
05/14/2014CN101894893B 基于双层MgZnO薄膜异质结的电致发光器件 Electric double layer electroluminescent devices based on MgZnO thin film heterojunction
05/14/2014CN101807657B 发光器件封装和包括其的照明系统 The light emitting device package, and a lighting system including
05/14/2014CN101784838B 包含侧发光半导体发光器件的背光 Contains backlight side-emitting semiconductor light emitting device
05/14/2014CN101755030B 荧光体及其制造方法和使用该荧光体的发光装置 Phosphor and its manufacturing method and light-emitting device of the phosphor
05/13/2014US8724051 Backlight device, and liquid crystal display using the same
05/13/2014US8723903 Drive device, LED array, LED head, and image forming apparatus provided therewith
05/13/2014US8723403 Light assembly with light-mixing function
05/13/2014US8723336 Semiconductor light emitting device and method for manufacturing same
05/13/2014US8723325 Structure and method of forming a pad structure having enhanced reliability
05/13/2014US8723217 White light emitting diode package
05/13/2014US8723216 Method of tuning work function of metal nanostructure-based transparent conductor
05/13/2014US8723215 LED module
05/13/2014US8723214 Submount and manufacturing method thereof
05/13/2014US8723213 Light emitting device and light emitting device package
05/13/2014US8723212 Semiconductor light source
05/13/2014US8723211 Optoelectronic device with housing body
05/13/2014US8723210 Light emitting device and light emitting device package having the same
05/13/2014US8723209 Out coupling layer containing particle polymer composite
05/13/2014US8723208 Light-emitting device having a fine structure interposed between a light-emitting layer and a substrate
05/13/2014US8723207 Radiation-emitting optical component
05/13/2014US8723206 Semiconductor light emitting device with contact hole passing through active layer
05/13/2014US8723205 Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
05/13/2014US8723203 Light emitting device, electrode structure, light emitting device package, and lighting system
05/13/2014US8723202 Semiconductor light emitting device having roughness layer
05/13/2014US8723201 Light-emitting devices with substrate coated with optically denser material
05/13/2014US8723200 Lead frame, light emitting diode having the lead frame, and backlight unit having the light emitting diode
05/13/2014US8723199 Radiation emitting body and method for producing a radiation-emitting body
05/13/2014US8723198 Wavelength-converting converter material, light-emitting optical component, and method for the production thereof
05/13/2014US8723197 Nitride semiconductor light emitting device and method of manufacturing the same
05/13/2014US8723196 Light emitting device
05/13/2014US8723195 Light emitting device with plurality of LED chips and/or electrode wiring pattern
05/13/2014US8723194 Array substrate and pixel unit of display panel
05/13/2014US8723193 Multi-layer wiring substrate, active matrix substrate, image display apparatus using the same, and multi-layer wiring substrate manufacturing method
05/13/2014US8723191 Electronic device which performs as light emitting diode and solar cell
05/13/2014US8723189 Ultraviolet light emitting diode structures and methods of manufacturing the same
05/13/2014US8723184 Semiconducting sheet
05/13/2014US8723159 Defect-controlling structure for epitaxial growth, light emitting device containing defect-controlling structure, and method of forming the same
05/13/2014US8722530 Method of making a die with recessed aluminum die pads
05/13/2014US8722442 Nitrogen-doped transparent graphene film and manufacturing method thereof
05/13/2014US8722439 Engineered-phosphor LED packages and related methods
05/13/2014US8722433 Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
05/13/2014US8721924 White light emitting devices utilizing phosphors
05/13/2014US8721912 Nanocomposite thermoelectric conversion material and method of producing the same
05/13/2014US8721131 Lighting unit
05/13/2014US8721126 Slim type backlight unit with through-hole adhesive heat dissipating means
05/13/2014CA2682594C Insulating and dissipating heat structure of an electronic part
05/13/2014CA2481637C Device package and methods for the fabrication and testing thereof
05/08/2014WO2014070576A2 Led die dispersal in displays and light panels with preserving neighboring relationship
05/08/2014WO2014070423A1 Semiconductor structure having nanocrystalline core and nanocrystalline shell pairing with compositional transition layer
05/08/2014WO2014069546A1 Thermosetting resin composition, light-reflective anisotropic electroconductive adhesive, and light-emitting device
05/08/2014WO2014069488A1 Polymetalloxane compound, method for producing same, and application thereof
05/08/2014WO2014069366A1 Light emitting diode driving circuit, display device, lighting device, and liquid crystal display device
05/08/2014WO2014069362A1 Optical device, method for manufacturing same, and electronic device
05/08/2014WO2014069235A1 Ultraviolet light emitting diode and method for producing same
05/08/2014WO2014068983A1 Method for manufacturing light-emitting device and light-emitting device
05/08/2014WO2014068912A1 Ultraviolet light-emitting module and ultraviolet light irradiation device
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