Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2012
03/08/2012US20120058579 Method for packaging led chip modules and moving fixture thereof
03/08/2012US20120057902 Method of manufacturing surface emitting laser, and surface emitting laser, surface emitting laser array, optical scanning device and image forming apparatus
03/08/2012US20120057110 Liquid crystal display device and manufacturing method thereof
03/08/2012US20120057105 Light emitting device, light emitting device package and image display device including the same
03/08/2012US20120056237 Semiconductor compound structure and method of fabricating the same using graphene or carbon nanotubes, and semiconductor device including the semiconductor compound structure
03/08/2012US20120056236 Low gas permeable silicone resin composition and optoelectronic device
03/08/2012US20120056235 Optoelectronic module and method of producing an optoelectronic module
03/08/2012US20120056234 Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
03/08/2012US20120056233 Led package
03/08/2012US20120056232 Semiconductor light emitting device and method for manufacturing same
03/08/2012US20120056230 Light emitting device
03/08/2012US20120056229 Light emitting structure and manufacturing method thereof
03/08/2012US20120056228 Led chip modules, method for packaging the led chip modules, and moving fixture thereof
03/08/2012US20120056227 Light emitting diode package and manufacturing method thereof
03/08/2012US20120056226 Chip package
03/08/2012US20120056225 Light emitting device
03/08/2012US20120056224 Light emitting device
03/08/2012US20120056223 Led package structure and packaging method thereof
03/08/2012US20120056222 Semiconductor light emitting device and method for manufacturing same
03/08/2012US20120056221 Light emitting element
03/08/2012US20120056220 Semiconductor light emmiting device
03/08/2012US20120056219 Back-to-back solid state lighting devices and associated methods
03/08/2012US20120056218 Lead frame package with multiple bends
03/08/2012US20120056217 Light emitting diode package
03/08/2012US20120056215 Led package having an array of light emitting cells coupled in series
03/08/2012US20120056214 Light emitting device and manufacturing method thereof
03/08/2012US20120056213 Light-emitting element, light-emitting device, display device, and electronic apparatus
03/08/2012US20120056212 Light-emitting device and the manufacturing method thereof
03/08/2012US20120056211 Polarizing film, optical film laminate including polarizing film, stretched laminate for use in production of optical film laminate including polarizing film, production methods for them, and organic el display device having polarizing film
03/08/2012US20120056206 Solid state lighting dies with quantum emitters and associated methods of manufacturing
03/08/2012US20120056204 Light emitting device and manufacturing method thereof
03/08/2012US20120056193 Series Connected Segmented LED
03/08/2012US20120056190 EL Display Device and a Method of Manufacturing the Same
03/08/2012US20120056189 Thin film transistor, method for manufacturing the same, and display device using the same
03/08/2012US20120056188 Organic light emitting diode display and manufacturing method thereof
03/08/2012US20120056185 Liquid crystal display device
03/08/2012US20120056158 Light emitting diodes with a p-type surface bonded to a transparent submount to increase light extraction efficiency
03/08/2012US20120056157 Semiconductor light emitting device and method for manufacturing same
03/08/2012US20120056156 Semiconductor light emitting device
03/08/2012US20120056155 Semiconductor light emitting device and method for manufacturing the same
03/08/2012US20120056154 Method of fabricating semiconductor light emitting device and semiconductor light emitting device
03/08/2012US20120056153 Semiconductor device
03/08/2012US20120056152 Light emitting devices
03/08/2012US20120056150 Nitride semiconductor light-emitting device with electrode pattern
03/08/2012US20120055532 Semiconductor optoelectronic device
03/08/2012DE102011053274A1 Licht emittierende Vorrichtung und Verfahren zur Herstellung derselben A light emitting device and method for manufacturing the same
03/08/2012DE102011009803A1 Lichtemittierendes Element The light-emitting element
03/08/2012DE102010044738A1 Dünnschichtverkapselung, optoelektronischer Halbleiterkörper mit einer Dünnschichtverkapselung und Verfahren zur Herstellung einer Dünnschichtverkapselung TFE, optoelectronic semiconductor body with a thin-film encapsulation and method of manufacturing a thin-film encapsulation
03/08/2012DE102010044560A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements A method for producing an optoelectronic semiconductor component
03/08/2012DE102010036269A1 Leuchtdiodenchip LED chip
03/08/2012DE102010036180A1 Leuchtdiodenchip LED chip
03/08/2012CA2810394A1 A light emitting apparatus
03/07/2012EP2426747A1 Light emitting module, illuminating device, display device, and television receiver
03/07/2012EP2426746A1 Light emitting device
03/07/2012EP2426745A2 Wavelength conversion configuration for a light emitting device
03/07/2012EP2426744A2 Light emitting diode package and manufacturing method thereof
03/07/2012EP2426743A2 GaN compound semiconductor light emitting element and method of manufacturing the same
03/07/2012EP2426742A2 Electrode configuration for a light emitting diode
03/07/2012EP2426741A2 Semiconductor light emitting device and method of fabricating the same
03/07/2012EP2426740A1 Substrate retainer, electronic apparatus, and display apparatus
03/07/2012EP2426716A2 Light emitting device
03/07/2012EP2426702A1 Method of deposition of chemical compound semiconductor and device
03/07/2012EP2426399A1 Illuminating device, display device, and television receiver
03/07/2012EP2426398A1 Illuminating device, display device, and television receiver
03/07/2012EP2426397A1 Light-source unit, lighting device, displaying device, television-receiver device, and manufacturing method of reflection-sheets for light-sources
03/07/2012EP2425688A1 Method for producing a circuit board having leds and printed reflector surfaces, and circuit board produced according to the method
03/07/2012EP2425466A1 Led package with increased feature sizes
03/07/2012EP2425465A2 White led for liquid crystal display backlights
03/07/2012EP2425464A1 Light emitting diode and method for producing a light emitting diode
03/07/2012EP2425463A2 Cluster tool for leds
03/07/2012EP2425462A1 Controlling edge emission in package-free led die
03/07/2012EP1887836B1 Light-emitting diode based products
03/07/2012EP1410426B1 Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
03/07/2012DE202009018568U1 Lichtemittierende Diode und lichtemittierende Vorrichtung Light emitting diode and light emitting device
03/07/2012DE202008018233U1 Gehäuse für eine lichtemittierende Vorrichtung A housing for a light emitting device
03/07/2012CN202159709U 一种低温共烧陶瓷led基板结构 Low-temperature co-fired ceramic substrate structure led
03/07/2012CN202159708U 一种具有装饰效果的led灯珠 Led lamp beads having a decorative effect
03/07/2012CN202159707U 一种高亮度led光源 A high-brightness led light
03/07/2012CN202159706U 包括led器件的led显示器 Including led led display device
03/07/2012CN202159705U 一种led芯片在金属基板上的镀镍钯封装结构 One kind led chip on a metal substrate, a nickel-plated palladium package structure
03/07/2012CN202159704U 防led显示屏的封装单元管脚弯曲的结构 Anti pin package unit led display curved structure
03/07/2012CN202159703U 带叶轮的烟囱式led芯片散热器 Chimney led chip radiator with impeller
03/07/2012CN202159702U 改良的led支架结构 Improved led stent structure
03/07/2012CN202159701U Led支架结构以及料带结构 Led support structure and the structure of the strip
03/07/2012CN202159700U Led光源矩形集成封装基板 Led light rectangular integrated package substrate
03/07/2012CN202159699U 一种芯片倒装的发光二极管 A chip flip-emitting diodes
03/07/2012CN202159698U 一种高密封性能的表面贴装led Surface mount led a high sealing performance
03/07/2012CN202159697U 直接用交流电驱动的发光二极管 Direct use of AC-driven light-emitting diodes
03/07/2012CN202159664U 一种led集成光源 One kind of led integrated light source
03/07/2012CN202159663U 大功率led厚膜集成面光源 Thick film integrated power led surface light source
03/07/2012CN202158422U 小尺寸显示器的led背光源改良结构及其电子设备 Led backlight improved structures and electronic equipment of small size displays
03/07/2012CN102369609A Luminescent device
03/07/2012CN102369608A 光源模块 The light source module
03/07/2012CN102369607A Light emitting apparatus and illumination apparatus
03/07/2012CN102369606A Optoelectronic semiconductor chip
03/07/2012CN102369605A Light emitting diode element and method for producing the same
03/07/2012CN102369604A Vertical light-emitting diode structure and manufacturing method thereof
03/07/2012CN102369590A Method for growing crystals of nitride semiconductor, and process for manufacture of semiconductor device
03/07/2012CN102369466A Led collimation optics module providing an isolation fitting
03/07/2012CN102368532A LED (light emitting diode) encapsulation structure with metal radiating fins
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