| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 02/02/2012 | DE102010032813A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
| 02/02/2012 | DE102010032512A1 Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements The light-emitting semiconductor device and method of manufacturing a light-emitting semiconductor component |
| 02/02/2012 | DE102010032497A1 Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips Radiation-emitting semiconductor chip and method of manufacturing a radiation-emitting semiconductor chips |
| 02/02/2012 | CA2806687A1 Method of producing a light emitting device |
| 02/01/2012 | EP2413392A2 Light-emitting diode package |
| 02/01/2012 | EP2413391A1 Light unit for LED lamp and method for the same |
| 02/01/2012 | EP2413390A2 Substrate for mounting light-emitting element, production process thereof and light-emitting device |
| 02/01/2012 | EP2413389A2 Light emitting device package |
| 02/01/2012 | EP2413388A2 Three-dimensional light-emitting diode structure with vertically displaced active region and method for fabricating the same |
| 02/01/2012 | EP2413387A2 Three-dimensional light-emitting diode structure with vertically displaced active region and method for fabricating the same |
| 02/01/2012 | EP2413386A2 Method for producing light-emitting diode device |
| 02/01/2012 | EP2413385A2 III-nitride light-emitting diode and method of producing the same |
| 02/01/2012 | EP2413360A2 Multi-element LED lamp package |
| 02/01/2012 | EP2413359A2 Light emitting diode substrate, method of making the same and light source employing the same |
| 02/01/2012 | EP2413358A1 LED lamp with multiple color temperatures |
| 02/01/2012 | EP2413026A1 Cold light source |
| 02/01/2012 | EP2412782A1 Phosphor, method for producing same, light-emitting device, and image display apparatus |
| 02/01/2012 | EP2412038A1 Illumination device with remote luminescent material |
| 02/01/2012 | EP2412037A2 System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices |
| 02/01/2012 | EP2412036A1 Indirect-bandgap-semiconductor, light-emitting diode |
| 02/01/2012 | EP2412022A1 Optoelectronic semiconductor component and display device |
| 02/01/2012 | EP2412021A1 Light diode |
| 02/01/2012 | EP1957607B1 Display device with solid state fluorescent material |
| 02/01/2012 | EP1425832B1 Method of manufacturing optical devices and related improvements |
| 02/01/2012 | DE202010017509U1 Lichtemittierende Vorrichtung und Beleuchtungssystem A light emitting device and lighting system |
| 02/01/2012 | CN202134575U Led散热基板 Led heat dissipation board |
| 02/01/2012 | CN202134574U Led芯片封装结构 Led chip package |
| 02/01/2012 | CN202134573U 发光二极管封装模块 A light emitting diode package module |
| 02/01/2012 | CN202134572U 用于结合背光模组的led散热基板 Led backlight module for combined heat dissipation board |
| 02/01/2012 | CN202134571U 一种垂直结构的发光器件 A vertical structure of the light emitting device |
| 02/01/2012 | CN202134570U Led芯片 Led chip |
| 02/01/2012 | CN202134569U Led封装体 Led package |
| 02/01/2012 | CN202134537U 一种GaN基LED交流电照明芯片 One kind of GaN-based LED chip AC Lighting |
| 02/01/2012 | CN202134535U Led集成封装光源模块 Led light module integrated package |
| 02/01/2012 | CN202134534U 导电性引线框和发光器件封装体 Conductive leadframe and light emitting device package |
| 02/01/2012 | CN1964090B 氮化物基半导体器件及其制造方法 The nitride-based semiconductor device and its manufacturing method |
| 02/01/2012 | CN1917245B 氮化物基发光器件及其制造方法 The nitride-based light emitting device and a method of manufacturing |
| 02/01/2012 | CN102341926A Light-emitting module, method of producing light-emitting module, and lighting unit |
| 02/01/2012 | CN102341925A Illuminating device |
| 02/01/2012 | CN102341924A Method of bonding a semiconductor device using a compliant bonding structure |
| 02/01/2012 | CN102341923A Led assembly having redundancy electrode and fabrication method thereof |
| 02/01/2012 | CN102341922A Nitride semiconductor element and method for manufacturing same |
| 02/01/2012 | CN102341887A III-nitride light emitting device incorporating boron |
| 02/01/2012 | CN102341740A Light-emitting unit array, method for fabricating the same and projection apparatus |
| 02/01/2012 | CN102341640A Light emitting module, light emitting module unit and backlight system |
| 02/01/2012 | CN102339945A High-power light-emitting diode (LED) with cooling substrate made of diamond powder-copper powder composite |
| 02/01/2012 | CN102339944A Encapsulating structure of light-emitting diode |
| 02/01/2012 | CN102339943A Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same |
| 02/01/2012 | CN102339942A LED (light-emitting diode) heat-radiation technology |
| 02/01/2012 | CN102339941A Light emitting diode packaging structure and light emitting diode module |
| 02/01/2012 | CN102339940A Encapsulation structure of light-emitting diode (LED) and manufacturing method thereof |
| 02/01/2012 | CN102339939A Light-emitting diode (LED) device package structure with fixing device |
| 02/01/2012 | CN102339938A Packaging structure of light-emitting diode |
| 02/01/2012 | CN102339937A White-light LED (Light-emitting Diode) manufactured by utilizing quantum-dot fluorescent powder and manufacturing method thereof |
| 02/01/2012 | CN102339936A Package structure for light-emitting device and method for manufacturing same |
| 02/01/2012 | CN102339935A Flip-chip-type LED (light-emitting diode) package structure |
| 02/01/2012 | CN102339934A Practical white packaging technique implemented by preparing fluorescent powder (for heat dissipation and light attenuation resistance) from silica gel |
| 02/01/2012 | CN102339933A Light-emitting diode (LED) radiating based on diamond microscopic graph structure |
| 02/01/2012 | CN102339932A Outdoor ceramic high-power LED (light-emitting diode) light source |
| 02/01/2012 | CN102339931A Component for light-emitting device, light-emitting device and producing method thereof |
| 02/01/2012 | CN102339930A Light emitting device |
| 02/01/2012 | CN102339929A Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| 02/01/2012 | CN102339928A Encapsulation structure of light-emitting diode (LED) |
| 02/01/2012 | CN102339927A Light emitting diode |
| 02/01/2012 | CN102339926A Lead frame assembly for light-emitting diodes (LEDs) and method for manufacturing same |
| 02/01/2012 | CN102339925A Packaging method of light-emitting elements |
| 02/01/2012 | CN102339924A Gan light emitting diode and method for increasing light extraction on gan light emitting diode |
| 02/01/2012 | CN102339923A Light emitting diode (LED) chip |
| 02/01/2012 | CN102339922A Light emitting diode (LED) and manufacturing method thereof |
| 02/01/2012 | CN102339921A Semiconductor light-emitting device and method of producing the same |
| 02/01/2012 | CN102339920A Light-emitting component |
| 02/01/2012 | CN102339919A Epitaxial structure and process for LEDs (light-emitting diodes) |
| 02/01/2012 | CN102339918A Light emitting device |
| 02/01/2012 | CN102339917A Heat-removal LED (light-emitting diode) integrating SiC substrate and diamond film |
| 02/01/2012 | CN102339916A Bonding method and packaging method for light-emitting diode (LED) chip and silicon substrate |
| 02/01/2012 | CN102339915A GaN substrate and device using the substrate |
| 02/01/2012 | CN102339914A Preparation method for light-emitting diode provided with white light photonic crystals |
| 02/01/2012 | CN102339913A High-voltage LED (Light Emitting Diode) device and manufacturing method thereof |
| 02/01/2012 | CN102339912A Method for manufacturing light-emitting device |
| 02/01/2012 | CN102339911A Manufacturing method for light emitting diode |
| 02/01/2012 | CN102339821A High-power straw-hat-shaped integrated packaging light-emitting diode (LED) light source structure for automobile headlight |
| 02/01/2012 | CN102339820A Integrated encapsulated LED (light-emitting diode) lamp bulb |
| 02/01/2012 | CN102339819A Light-emitting diode package structure and method for forming same |
| 02/01/2012 | CN102338292A LED (Light-emitting Diode) device |
| 02/01/2012 | CN102337134A Manganese-cerium codoped yttrium aluminum garnet fluorescent powder material and preparation method and application thereof |
| 02/01/2012 | CN102337132A Method for preparing surface-coated yellow fluorescent powder |
| 02/01/2012 | CN102337125A Borate fluorescent powder for warm white LED (light-emitting diode) |
| 02/01/2012 | CN102337104A Ant nest-like heat dissipation material and heat dissipation device prepared from the ant nest-like heat dissipation material |
| 02/01/2012 | CN102337084A Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof |
| 02/01/2012 | CN102337017A Polycarbonate composition with LED (Light-emitting Diode) photoconversion function and application thereof |
| 02/01/2012 | CN102337006A Resin composition, B stage sheet, metal foil with resin, metal substrate, and LED substrate |
| 02/01/2012 | CN102334783A Electronic button and light emitting diode button component |
| 02/01/2012 | CN102005510B 发光二极管组件的制造方法 The method of manufacturing a light emitting diode assembly |
| 02/01/2012 | CN101968204B 防止led灯粒自led模块掉落的led照明装置 Prevent grain self-led module led lights led lighting devices fall |
| 02/01/2012 | CN101964314B 自校准发光二极管框架灌胶胶接方法 Self-calibration emitting diodes framework Glue bonding method |
| 02/01/2012 | CN101943368B Led聚光透镜 Led condenser lens |
| 02/01/2012 | CN101858556B 多透镜led集成光源板、专用模具及制造方法 Integrated multi-lens led light board, special tooling and manufacturing method |
| 02/01/2012 | CN101821861B 不含磷的基于氮化物的红和白发光二极管的制造 Based on the manufacturing of red and white light emitting diode nitride no phosphorous |
| 02/01/2012 | CN101807631B 发光二极管封装结构及其制作方法 Light emitting diode package structure and production methods |
| 02/01/2012 | CN101785119B 光电子半导体器件及其制造方法 Optoelectronic semiconductor device and its manufacturing method |