| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 04/11/2012 | EP2438625A2 Method of forming a dielectric layer on a semiconductor light emitting device |
| 04/11/2012 | EP2438613A1 Optoelectronic semi-conductor component |
| 04/11/2012 | EP2438348A1 Lighting devices with discrete lumiphor-bearing regions on remote surfaces thereof |
| 04/11/2012 | EP2437939A1 Multilayer barrier film |
| 04/11/2012 | EP1958268B9 Composite component provided with an optical element |
| 04/11/2012 | EP1766287B1 High power led electro-optic assembly |
| 04/11/2012 | CN202189833U 热电分离的发光二极管模块和相关的高反射性散热载板 Thermal separation of the light emitting diode module and the associated carrier plate of high heat reflective |
| 04/11/2012 | CN202189832U Led元件成型结构及其模组 Led elements forming the structure and modules |
| 04/11/2012 | CN202189831U 一种高功率高亮度led光源封装结构 A high-power, high brightness led light package |
| 04/11/2012 | CN202189830U Led铜柱 Led Tongzhu |
| 04/11/2012 | CN202189829U 一种发光二极体、显示装置及照明装置 A light-emitting diode display device and a lighting device |
| 04/11/2012 | CN202189828U 一种led集成式方形散热板 One kind of led integrated rectangular radiating plate |
| 04/11/2012 | CN202189827U 一种led封装模块 One kind of led encapsulation module |
| 04/11/2012 | CN202189826U 蓝光led外延芯片结构 Blue led epitaxial silicon structures |
| 04/11/2012 | CN202189788U 一种阵列式发光二极管 One kind of light-emitting diode array |
| 04/11/2012 | CN202189782U Cobled集成封装结构 Cobled integrated package structure |
| 04/11/2012 | CN202188339U 一种红光led光源组件 One kind of red led light assembly |
| 04/11/2012 | CN1993075B Light source apparatus and endoscope equipped with light source apparatus |
| 04/11/2012 | CN1581610B Nitride semiconductor light-emitting device and method for fabrication thereof |
| 04/11/2012 | CN102414851A Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module |
| 04/11/2012 | CN102414850A 具有磷光体的照明装置 Illumination apparatus having a phosphor |
| 04/11/2012 | CN102414849A Light emitting diode and method for producing a light emitting diode |
| 04/11/2012 | CN102414848A 半导体元件及制作半导体元件的方法 The method of making a semiconductor element and a semiconductor element |
| 04/11/2012 | CN102414847A Light emitting diode, light emitting diode lamp and illuminating device |
| 04/11/2012 | CN102414846A 用于led制造的改良多腔室分离处理 Improved multi-chamber for separation led manufacture |
| 04/11/2012 | CN102414845A 用于制造led的mocvd单一腔室分割工艺 Mocvd single chamber segmentation process for the manufacture of led |
| 04/11/2012 | CN102414844A Cluster tool for LEDs |
| 04/11/2012 | CN102414843A Substrate retainer, electronic apparatus, and display apparatus |
| 04/11/2012 | CN102414797A 在HVPE中形成原位预GaN沉积层的方法 The method of in-situ deposition of the pre-GaN layer is formed on the HVPE |
| 04/11/2012 | CN102414796A 制作晶片产品的方法及制作氮化镓基半导体光元件的方法 The method of production of the product wafer and a method of fabricating a gallium nitride-based semiconductor optical element |
| 04/11/2012 | CN102414790A Hvpe腔室硬件 Hvpe chamber hardware |
| 04/11/2012 | CN102414786A 在原位清洁后利用NH<sub>3</sub>净化对MOCVD腔室进行去污染处理 In-situ cleaning after use NH <sub> 3 </ sub> purification of the MOCVD chamber for de-pollution treatment |
| 04/11/2012 | CN102412365A Led的导热基板及散热模块结构 Thermally conductive substrate and the cooling module structure Led |
| 04/11/2012 | CN102412364A Thermally efficient packaging for a photonic device |
| 04/11/2012 | CN102412363A 一种led灯具的晶圆级封装结构及其制备方法 One kind of led lamps wafer level package structure and preparation method |
| 04/11/2012 | CN102412362A 一种加透镜的全户外led灯 An all-outdoor led lights plus lenses |
| 04/11/2012 | CN102412361A Laminating Heat Dissipating Substrate And Electric Package Assembly Using The Same |
| 04/11/2012 | CN102412360A Light-emitting diode packaging substrate and forming method of light-emitting diode packaging structure |
| 04/11/2012 | CN102412359A 用于一微型投影系统的发光二极管装置 Light-emitting diode device for a miniature projection systems |
| 04/11/2012 | CN102412358A Packaging substrate |
| 04/11/2012 | CN102412357A 一种薄膜结构发光二极管 A thin film light-emitting diode structure |
| 04/11/2012 | CN102412356A Epitaxial substrate |
| 04/11/2012 | CN102412355A Light emitting device |
| 04/11/2012 | CN102412354A 一种白光led外延结构及制作方法、白光led芯片结构 One kind of white led epitaxial structure and production methods, white led chip architecture |
| 04/11/2012 | CN102412353A 一种可直接连接在交流电上的led芯片组制作方法 A method of manufacturing chipset led directly connected to the AC |
| 04/11/2012 | CN102412352A 用石墨烯制作的大功率led光源封装结构及其生产工艺 Graphene produced by high-power led light package structure and production process |
| 04/11/2012 | CN102412351A 提高ESD的复合n-GaN层结构的制备方法 Preparation method to improve ESD composite n-GaN layer structure |
| 04/11/2012 | CN102412350A Flexible substrate, mounting method of flexible substrate, and lighting system |
| 04/11/2012 | CN102412349A 半导体发光元件制造方法与半导体发光元件 The semiconductor light emitting device manufacturing method of the semiconductor light emitting element |
| 04/11/2012 | CN102412348A 制造半导体发光器件的方法 The method of manufacturing a semiconductor light emitting device |
| 04/11/2012 | CN102412347A 具荧光粉的基板的制造方法及发光组件的制造方法 A manufacturing method of the phosphor and the light emitting module having a substrate |
| 04/11/2012 | CN102412346A Method for manufacturing light-emitting diode |
| 04/11/2012 | CN102412345A Light-emitting diode packaging structure and manufacturing method thereof |
| 04/11/2012 | CN102412344A Light emitting diode (LED) packaging method |
| 04/11/2012 | CN102412246A 一种基于金属基pcb板的led模组及其制造工艺 A metal base pcb board led modules based on its manufacturing process |
| 04/11/2012 | CN102412245A Light emitting component and manufacturing method thereof |
| 04/11/2012 | CN102412244A 发光装置 Light-emitting device |
| 04/11/2012 | CN102412212A 电子/光电组件的散热装置 Cooling apparatus for electronic / optoelectronic components |
| 04/11/2012 | CN102410512A 线性发光体及具有该线性发光体的纺织品 Linear luminous body and textiles have the linear light emitter |
| 04/11/2012 | CN102408856A 一种用于led封装的导电胶及其制备方法 Conductive plastic and preparation method for led encapsulation |
| 04/11/2012 | CN102408724A 光半导体元件密封用树脂组合物及发光装置 The optical semiconductor sealing resin composition and a device light emitting device |
| 04/11/2012 | CN102408544A Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 04/11/2012 | CN102408543A Heat curable resin composition for light reflection, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 04/11/2012 | CN102408542A Heat curable resin composition for light reflection, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 04/11/2012 | CN102408541A Heat curable resin composition for light reflection, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 04/11/2012 | CN102407335A High heat conductivity LED packaging material and preparation method thereof |
| 04/11/2012 | CN101964310B Bonding machine incorporating dual-track transfer mechanism |
| 04/11/2012 | CN101776220B 用于维持多芯片发光二极管组件的光特性的方法 Maintaining the optical characteristics of the multi-chip light emitting diode assembly method for |
| 04/11/2012 | CN101636839B Light emitting module and method for the production of a light emitting module |
| 04/11/2012 | CN101583670B 散热性树脂组合物、led实装用基板、反射器以及具有反射器部的led实装用基板 Heat-dissipating resin composition, led mounting substrate, a reflector and a reflector portion having led mounting substrate |
| 04/11/2012 | CN101565620B Single-phase white-emitting phosphor based on near ultraviolet excitation and preparation method thereof |
| 04/11/2012 | CN101343367B 包含聚硼硅氧烷的光学半导体元件封装用树脂 The optical semiconductor element encapsulation containing a polyborosiloxane resin |
| 04/11/2012 | CN101286541B 具有叠合透明电极的半导体发光装置 A transparent electrode laminated semiconductor light emitting device having |
| 04/11/2012 | CN101206271B Device for transmitting and coupling in full reflection side |
| 04/11/2012 | CN101064330B Composite semiconductor light emitting device, led head , and image forming apparatus |
| 04/10/2012 | US8154792 Multi-layer gallium arsenide-based fresnel phase-shift device for infrared wavelength conversion |
| 04/10/2012 | US8154199 Display apparatus |
| 04/10/2012 | US8154191 Silicate base luminescent materials having multiple emission peaks, processes for preparing the same and light emitting devices using the same |
| 04/10/2012 | US8154190 Light emitting device with resin layer containing blue, green and red emitting phosphors which emits white light when excited by ultraviolet light |
| 04/10/2012 | US8154047 Solid element device and method for manufacturing the same |
| 04/10/2012 | US8154046 Semiconductor light emitting device including bonding layer and semiconductor light emitting device package |
| 04/10/2012 | US8154045 Semiconductor light-emitting device |
| 04/10/2012 | US8154044 Light emitting diode package structure and method for fabricating the same |
| 04/10/2012 | US8154043 Packaged light emitting devices |
| 04/10/2012 | US8154042 Light emitting device with trenches and a top contact |
| 04/10/2012 | US8154041 Light emitting device |
| 04/10/2012 | US8154040 Light-emitting diode arrangement and method for producing the same |
| 04/10/2012 | US8154039 High efficiency group III nitride LED with lenticular surface |
| 04/10/2012 | US8154038 Group-III nitride for reducing stress caused by metal nitride reflector |
| 04/10/2012 | US8154036 Nitride semiconductor device |
| 04/10/2012 | US8154033 LED device and method of packaging the same |
| 04/10/2012 | US8154032 Electrooptical device, electronic apparatus, and method for producing electrooptical device |
| 04/10/2012 | US8154031 Module comprising radiation-emitting semiconductor bodies |
| 04/10/2012 | US8154029 Planar light source device |
| 04/10/2012 | US8154018 Semiconductor device, its manufacture method and template substrate |
| 04/10/2012 | US8154009 Light emitting structure including high-al content MQWH |
| 04/10/2012 | US8153509 Method of fabricating light emitting diode using laser lift-off technique and laser lift-off apparatus having heater |
| 04/10/2012 | US8153470 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 04/10/2012 | US8153461 Light-emitting diode apparatus and manufacturing method thereof |
| 04/10/2012 | US8153460 Surface mount optoelectronic component with lens having protruding structure |