| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 02/23/2012 | US20120043565 Display device and method of producing the same |
| 02/23/2012 | US20120043564 Common optical element for an array of phosphor converted light emitting devices |
| 02/23/2012 | US20120043563 High Voltage Low Current Surface Emitting Light Emitting Diode |
| 02/23/2012 | US20120043562 Organic electroluminescence display device and manufacturing method therefor |
| 02/23/2012 | US20120043561 Organic Light Emitting Diode Display |
| 02/23/2012 | US20120043560 Lamp module |
| 02/23/2012 | US20120043559 Light emitting device |
| 02/23/2012 | US20120043557 Semiconductor light-emitting device with improved light extraction efficiency |
| 02/23/2012 | US20120043555 Liquid fluorescent composition and light emitting device |
| 02/23/2012 | US20120043554 Light-emitting devices |
| 02/23/2012 | US20120043552 System and Method for Selected Pump LEDs with Multiple Phosphors |
| 02/23/2012 | US20120043550 Semiconductor light emitting device and method for manufacturing same |
| 02/23/2012 | US20120043546 Organic light-emitting display device and method of manufacturing the same |
| 02/23/2012 | US20120043538 Process to make metal oxide thin film transistor array with etch stopping layer |
| 02/23/2012 | US20120043527 Light emitting device |
| 02/23/2012 | US20120043526 Light emitting device and lighting system having the same |
| 02/23/2012 | US20120043525 Light emitting device |
| 02/23/2012 | US20120043524 Light-emitting diode |
| 02/23/2012 | US20120043523 Light emitting diode and manufacturing method thereof |
| 02/23/2012 | US20120043522 High-reflectivity and low-defect density LED structure |
| 02/23/2012 | DE202008018199U1 Lichtemittierende Halbleitervorrichtung A semiconductor light emitting device |
| 02/23/2012 | DE102011080832A1 Verbundwerkstoff aus Keramik Composite ceramic |
| 02/23/2012 | DE102011003608A1 Gehäustes LED-Modul A housed LED module |
| 02/23/2012 | DE102010039382A1 Electronic component i.e. optoelectronic component, has semiconductor chips whose side surfaces are covered by electrical isolating insulating material, and line structures partially resting against insulating material |
| 02/23/2012 | DE102010035110A1 Polymerkomposit, Verwendung des Polymerkomposits und optoelektronisches Bauelement enthaltend das Polymerkomposit Polymer composite using the composite polymer and optoelectronic component comprising the composite polymer |
| 02/23/2012 | DE102010034924A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component |
| 02/23/2012 | DE102010034923A1 Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht Method for producing a layered composite from a luminescence conversion layer and a diffusion layer |
| 02/23/2012 | DE102010034915A1 Optoelektronisches Halbleiterbauteil und Streukörper An optoelectronic semiconductor device and diffuser |
| 02/23/2012 | DE102010034913A1 Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements Radiation emitting device and method for manufacturing the radiation-emitting component |
| 02/23/2012 | DE102010034665A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for the production of optoelectronic semiconductor chips |
| 02/23/2012 | DE102010034565A1 Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauelements A process for producing at least one optoelectronic semiconductor component |
| 02/23/2012 | DE102004003928B4 Ein miniaturisiertes mit SM-Technologie bestückbares optoelektronisches Bauelement und Verfahren zur Herstellung dieses Bauelements A miniaturized with SM technology bestückbares optoelectronic component and methods for making this component |
| 02/22/2012 | EP2421062A1 Led unit |
| 02/22/2012 | EP2421061A1 Light-emitting device |
| 02/22/2012 | EP2421060A1 Light-emitting diode |
| 02/22/2012 | EP2421059A2 Light-emitting diode structure and method for manufacturing the same |
| 02/22/2012 | EP2421058A2 Light-Emitting devices with substrate coated with optically denser material |
| 02/22/2012 | EP2421039A1 Light emitting apparatus |
| 02/22/2012 | EP2421038A1 Radiation substrate for power led and power led production and manufacturing method thereof |
| 02/22/2012 | EP2420723A1 Planar light source device and display device provided with the planar light source device |
| 02/22/2012 | EP2420482A2 Nitride sintered body and method for manufacturing thereof |
| 02/22/2012 | EP2419943A1 Methods and apparatus for forming uniform layers of phosphor material on an led encapsulation structure |
| 02/22/2012 | EP2050124B1 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails |
| 02/22/2012 | EP1666515B1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition |
| 02/22/2012 | CN202150493U 一种led散热系统 One kind of led cooling system |
| 02/22/2012 | CN202150492U 一种带薄型复眼透镜的集成led模块 A thin led module integrated with the fly's eye lens |
| 02/22/2012 | CN202150491U 具有高显色性的白光led器件和led芯片模块 White led components and led chip module with high color rendering |
| 02/22/2012 | CN202150490U 一种3w的led灯珠 One kind 3w led lights beads |
| 02/22/2012 | CN202150489U 无导线图案电镀基板结构 No lead pattern plating substrate structure |
| 02/22/2012 | CN202150488U 一种用于led晶片的贴装结构 Mounting structure for wafer led |
| 02/22/2012 | CN202150487U 一种led散热器 One kind of led radiator |
| 02/22/2012 | CN202150486U 一种大功率led光源圆形集成封装基板 One kind of power led light source integrated package substrate round |
| 02/22/2012 | CN202150485U 一种矩形集成封装大功率led光源模块 One kind of rectangular integrated package of high-power led light source module |
| 02/22/2012 | CN202150484U Led光源模块封装用凸杯底座结构 Led light source module package with convex glass base structure |
| 02/22/2012 | CN202150483U 白光led色温检测修复机 White led color temperature detector repair machine |
| 02/22/2012 | CN202150482U Led固晶机的晶片吸取的升降装置 Lessons Led lifting device wafer Bonder's |
| 02/22/2012 | CN202150455U 全彩表面贴装元件及支架 Full-color surface mount components and brackets |
| 02/22/2012 | CN202150454U 双反光杯led护栏管灯珠 Dual reflector lamp beads led guardrail |
| 02/22/2012 | CN202150227U 显示器 Monitor |
| 02/22/2012 | CN1943050B 化合物半导体发光器件、其晶片以及该晶片的制造方法 The method of manufacturing a compound semiconductor light-emitting device wafer and wafer |
| 02/22/2012 | CN1941052B 驱动电路和使用该驱动电路的电子设备 Drive circuit and the driver circuit using an electronic device |
| 02/22/2012 | CN102362348A Light diode |
| 02/22/2012 | CN102362018A Method for manufacturing sapphire substrate, and semiconductor device |
| 02/22/2012 | CN102361956A Phosphor, method for produicng phosphor, phosphor-containing composition, light-emitting device, illuminating device, and image display device |
| 02/22/2012 | CN102361953A Phosphor member, method for producing phosphor member, and lighting device |
| 02/22/2012 | CN102361060A Encapsulating structure for high-power LED (Light-Emitting Diode) radiating base |
| 02/22/2012 | CN102361059A Heat column for LED (light-emitting diode) packaging and manufacturing method thereof |
| 02/22/2012 | CN102361058A Method for improving light quality of chip-on-board (COB) packaging of white light-emitting diode (LED) |
| 02/22/2012 | CN102361057A Optical film with raster |
| 02/22/2012 | CN102361056A High brightness large power light emitting diode and manufacture method thereof |
| 02/22/2012 | CN102361055A Radiation emitting semi-conductor element |
| 02/22/2012 | CN102361054A Photoelectric semiconductor device |
| 02/22/2012 | CN102361053A Light-emitting diode with photonic crystal structure |
| 02/22/2012 | CN102361052A Light emitting diode having vertical topology and method of making the same |
| 02/22/2012 | CN102361051A Method for encapsulating LED (Light Emitting Diode) light source module |
| 02/22/2012 | CN102360161A Large-size wafer level nano-patterned sapphire substrate imprinting device and method |
| 02/22/2012 | CN102358963A Preparation method for CaSi2O2N2:Eu<2+> fluorescence nano-fiber |
| 02/22/2012 | CN102088048B 一种发光二极管的封装工艺 A light emitting diode packaging technology |
| 02/22/2012 | CN101937951B 氮化镓基垂直结构发光二极管转移衬底的腐蚀方法 GaN-based light emitting diode vertical structure of the transfer substrate etching method |
| 02/22/2012 | CN101900290B 一种led配光透镜及含有该透镜的led路灯 One kind of led light led street containing the lens and lens |
| 02/22/2012 | CN101828273B 发光装置、使用该发光装置的车辆用灯具及前照灯 A light emitting device using the light-emitting device and a vehicle headlamp lighting |
| 02/22/2012 | CN101689523B 电子器件的制作方法、外延衬底的制作方法、Ⅲ族氮化物半导体元件及氮化镓外延衬底 Method of manufacturing an electronic device, method of manufacturing an epitaxial substrate, Ⅲ nitride semiconductor element and a gallium nitride epitaxial substrate, |
| 02/22/2012 | CN101652602B 光输出设备 A light output device |
| 02/22/2012 | CN101443925B 带有微透镜的发光元件阵列以及光写入头 With the light-emitting element array and the micro lens optical writing head |
| 02/22/2012 | CN101420001B 自我接合磊晶的方法 Epitaxy method of self-bonding |
| 02/22/2012 | CN101198200B 电子设备、显示装置、以及半导体装置和其驱动方法 Electronic device, a display device, and a semiconductor device and a driving method thereof |
| 02/21/2012 | USRE43200 High power light emitting diode package |
| 02/21/2012 | US8120571 LED driver and display device using the same |
| 02/21/2012 | US8120283 LED device and LED driver |
| 02/21/2012 | US8120247 Light emitting device with a plurality of uniform diameter ceramic spherical color converter elements |
| 02/21/2012 | US8120240 Light emission device and method utilizing multiple emitters |
| 02/21/2012 | US8120237 Photoluminescent composition and light source device |
| 02/21/2012 | US8120151 Optical semiconductor device and method for manufacturing the same |
| 02/21/2012 | US8120079 Light-sensing device for multi-spectral imaging |
| 02/21/2012 | US8120057 Semiconductor light emitting element |
| 02/21/2012 | US8120056 Light emitting diode assembly |
| 02/21/2012 | US8120055 Light source |
| 02/21/2012 | US8120054 Light emitting diode package having heat dissipating slugs |
| 02/21/2012 | US8120053 Semiconductor light emitting device |
| 02/21/2012 | US8120052 Flip chip type LED lighting device manufacturing method |