Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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03/15/2012 | US20120061705 Method for Treating Metal Surfaces |
03/15/2012 | US20120061704 Light emitting device and lighting instrument including the same |
03/15/2012 | US20120061703 Light emitting device and manufacturing method of light emitting device |
03/15/2012 | US20120061702 Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants |
03/15/2012 | US20120061700 Method and system for providing a reliable light emitting diode semiconductor device |
03/15/2012 | US20120061699 Electric lamp |
03/15/2012 | US20120061698 Method for Treating Metal Surfaces |
03/15/2012 | US20120061697 Organic light-emitting element, organic light-emitting transistor, and light-emitting display device |
03/15/2012 | US20120061696 Method for manufacturing display and display |
03/15/2012 | US20120061695 Light-emitting diode package |
03/15/2012 | US20120061694 Light-emitting structure |
03/15/2012 | US20120061693 Optoelectronic component with flip-chip mounted optoelectronic device |
03/15/2012 | US20120061691 Light-emitting device |
03/15/2012 | US20120061690 Led module and packing method of the same |
03/15/2012 | US20120061678 Method of laser annealing semiconductor layer and semiconductor devices produced thereby |
03/15/2012 | US20120061677 Semiconductor device |
03/15/2012 | US20120061675 Transistor structure, manufacturing method of transistor structure, and light emitting apparatus |
03/15/2012 | US20120061673 Method for manufacturing light-emitting display device |
03/15/2012 | US20120061671 Semiconductor device and light-emitting device |
03/15/2012 | US20120061667 Light-emitting element |
03/15/2012 | US20120061666 Semiconductor device and display device |
03/15/2012 | US20120061664 Light-emitting display device and method for manufacturing the same |
03/15/2012 | US20120061660 ZnO NANOSTRUCTURE-BASED LIGHT EMITTING DEVICE |
03/15/2012 | US20120061656 Organic el element |
03/15/2012 | US20120061646 Light emission device and manufacturing method thereof |
03/15/2012 | US20120061645 Optoelectronic device based on non-polar and semi-polar aluminum indium nitride and aluminum indium gallium nitride alloys |
03/15/2012 | US20120061644 Blue Light Emitting Semiconductor Nanocrystal Materials |
03/15/2012 | US20120061643 GaN-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE AND THE METHOD FOR MAKING THE SAME |
03/15/2012 | US20120061642 Semiconductor light emitting device and manufacturing method thereof |
03/15/2012 | US20120061641 Group iii nitride nanorod light emitting device and method of manufacturing thereof |
03/15/2012 | US20120061640 Semiconductor light emitting device |
03/15/2012 | US20120061570 Infrared light transmissivity for a membrane sensor |
03/15/2012 | DE102011053360A1 Verfahren und system zum bereitstellen eines zuverlässigen leuchtdioden-halbleiterbauelements Method and system for providing a reliable light-emitting semiconductor component |
03/15/2012 | DE102010045403A1 Optoelektronisches Bauelement Optoelectronic component |
03/15/2012 | DE102010045390A1 Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronisches Halbleiterbauteils An optoelectronic semiconductor device and process for the production of an opto-electronic semiconductor device |
03/15/2012 | DE102010045368A1 Silicophosphat-Leuchtstoffe Silicophosphate phosphors |
03/15/2012 | DE102010045316A1 Strahlungsemittierendes Bauelement Radiation-emitting component |
03/15/2012 | DE102010044987A1 Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung An optoelectronic semiconductor device and process for its preparation |
03/15/2012 | DE102010044986A1 Leuchtdiodenchip und Verfahren zur Herstellung eines Leuchtdiodenchips LED chip and method for producing a light-emitting diode chips |
03/15/2012 | DE102010044985A1 Verfahren zum Aufbringen eines Konversionsmittels auf einen optoelektronischen Halbleiterchip und optoelektronisches Bauteil A method for applying a conversion means to an optoelectronic semiconductor chip and the optoelectronic component |
03/15/2012 | CA2810371A1 An optoelectronic device comprising nanostructures of hexagonal type crystals |
03/14/2012 | EP2429009A2 Method for manufacturing an opto-electronic component and opto-electronic component |
03/14/2012 | EP2429006A2 Method for manufacturing chip elements provided with wire insertion grooves |
03/14/2012 | EP2428981A1 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails |
03/14/2012 | EP2428979A1 Solid-state laser lift-off apparatus and lift-off method |
03/14/2012 | EP2427924A1 Re-emitting semiconductor carrier devices for use with leds and methods of manufacture |
03/14/2012 | EP2427923A1 Extension of contact pads to the die edge with electrical isolation |
03/14/2012 | EP2427922A1 Re-emitting semiconductor construction with enhanced extraction efficiency |
03/14/2012 | EP2427921A1 Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms |
03/14/2012 | CN202168280U 一种led灯电路板 One kind of led light board |
03/14/2012 | CN202167544U 一种光照性能好的led表面贴装支架 One kind of good performance led lighting surface mount bracket |
03/14/2012 | CN202167543U 一种绑定复合金属线的led A composite metal wire led binding |
03/14/2012 | CN202167542U 一种led One kind of led |
03/14/2012 | CN202167541U 一种led灯 One kind of led lights |
03/14/2012 | CN202167540U 一种食人鱼led One kind of piranha led |
03/14/2012 | CN202167539U 一种led支架及led One kind of led bracket and led |
03/14/2012 | CN202167538U 封装结构 Package structure |
03/14/2012 | CN202167537U Led光源模组 Led light module |
03/14/2012 | CN202167536U 硅基蓝绿光led的反光镜装置 Blue-green led silicon mirror device |
03/14/2012 | CN202167535U 一种能消除应力的发光二极管结构 A light-emitting diode structure can eliminate stress |
03/14/2012 | CN202167534U 一种多led立体封装设备 Led a multi-dimensional packaging equipment |
03/14/2012 | CN202167489U 大功率led的cob矩阵封装结构 Cob power led matrix package |
03/14/2012 | CN202167488U 全彩led显示屏的打线结构 Wire structure full color led display |
03/14/2012 | CN202167487U 2rgb型led显示屏封装结构 2rgb type package structure led display |
03/14/2012 | CN202167486U 一种大功率led发光模组 One kind of led light module power |
03/14/2012 | CN202167485U Secondary packaging piece of semiconductor light-emitting diode |
03/14/2012 | CN202167484U 一种5050led支架及led光源 One kind 5050led bracket and led light |
03/14/2012 | CN202167481U 一种改进的4mm发光二极管封装结构 An improved light emitting diode package structure of 4mm |
03/14/2012 | CN202165891U Led面光源 Led surface light source |
03/14/2012 | CN202163896U Led固晶机或焊线机的取料装置 Reclaimer device Led Bonder or wire bonders |
03/14/2012 | CN1964094B Nitride semiconductor device |
03/14/2012 | CN1958887B Single crystalline A-plane nitride semiconductor wafer having orientation flat |
03/14/2012 | CN1932370B Illumination device and display device provided with the same |
03/14/2012 | CN1897319B Light emitting diode and method of fabricating the same |
03/14/2012 | CN102379040A Optoelectronic component |
03/14/2012 | CN102378801A Luminescent converter for a phosphor- enhanced light source comprising organic and inorganic phosphors |
03/14/2012 | CN102378791A Wholly aromatic thermotropic liquid-crystal polyester resin composition, molded object, and led reflector |
03/14/2012 | CN102376867A LED heat-conducting and radiating integrated forming device |
03/14/2012 | CN102376866A Light emitting diode |
03/14/2012 | CN102376865A Light emitting diode |
03/14/2012 | CN102376864A Light emitting element |
03/14/2012 | CN102376863A Manufacturing method for light-emitting component |
03/14/2012 | CN102376862A Inverted LED |
03/14/2012 | CN102376861A Radiation reflection plate for LED |
03/14/2012 | CN102376860A Light emitting apparatus and method for manufacturing thereof |
03/14/2012 | CN102376859A Light source module and adhesive component thereof |
03/14/2012 | CN102376858A Light-emitting diode (LED) |
03/14/2012 | CN102376857A Packaging method for light-emitting manner of LED (Light-Emitting Diode) with specific wavelength |
03/14/2012 | CN102376856A Thermoelectric separation light-emitting diode (LED) |
03/14/2012 | CN102376855A Light emitting device and lighting system comprising the same |
03/14/2012 | CN102376854A Light emitting device and lighting system having the same |
03/14/2012 | CN102376853A Light emitting device and lighting system having the same |
03/14/2012 | CN102376852A Substrate structure of LED (light emitting diode) packaging and method of the same |
03/14/2012 | CN102376851A Light-emitting device |
03/14/2012 | CN102376850A 发光装置及图像显示单元 The light emitting device and an image display unit |
03/14/2012 | CN102376849A Semiconductor light emitting device |
03/14/2012 | CN102376848A Manufacturing method of light-emitting device |
03/14/2012 | CN102376847A Composite optical device, mold, preparation method and optical system |
03/14/2012 | CN102376846A Light emitting diode combination |
03/14/2012 | CN102376845A Packaging structure of light-emitting diode |