Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
04/2012
04/04/2012EP2437321A2 Light emitting diode package structure and manufacturing method thereof
04/04/2012EP2437320A2 Light emitting diode sealing member and method for producing light emitting diode device
04/04/2012EP2437319A2 Method for producing lensed SMD light diodes
04/04/2012EP2437318A2 Light-Emitting Device
04/04/2012EP2437286A1 GaN single-crystal substrate
04/04/2012EP2436047A2 Light scattering and conversion plate for leds
04/04/2012EP2436046A1 Method for producing a light-emitting diode
04/04/2012EP2436045A1 Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
04/04/2012EP2435754A1 Ceramic illumination device
04/04/2012EP2435752A1 Illumination device with an envelope enclosing a light source
04/04/2012EP2435212A1 Barrel grinding of lumiramic platelets
04/04/2012EP1297060B2 Polymer matrix electroluminescent materials and devices
04/04/2012CN202183416U 一种led集成式矩形散热板 One kind of led integrated rectangular radiating plate
04/04/2012CN202183415U 一种蝙蝠翼形led封装结构 One kind of bat wing led package structure
04/04/2012CN202183414U 一种大功率发光二极管封装结构 A light emitting diode package structure of power
04/04/2012CN202183413U 环氧树脂基小功率白光led封装 Epoxy-based low-power white led package
04/04/2012CN202183412U 发光二极管封装结构 A light emitting diode package structure
04/04/2012CN202183411U Led封装结构 Led package structure
04/04/2012CN202183410U 一种smd led贴片分光机用芯片转向装置 One kind smd led SMD chip sorting machines steering apparatus
04/04/2012CN202183409U Led联体支架 Led conjoined bracket
04/04/2012CN202183367U 封装支架 Package bracket
04/04/2012CN102405538A Semiconductor white light-emitting device
04/04/2012CN102405537A 形成有图案的基板的制造方法 Forming a patterned substrate manufacturing method
04/04/2012CN102405536A 间接带隙半导体发光二极管 Indirect bandgap semiconductor light-emitting diodes
04/04/2012CN102405513A Led基板处理 Led substrate processing
04/04/2012CN102404933A 一种金属基板贯穿热通路的印刷电路板及其制备方法 A metal substrate through the printed circuit board and a method for preparing a thermal path
04/04/2012CN102403444A Radiating structure of high-power LED
04/04/2012CN102403443A Heat sink
04/04/2012CN102403442A 发光二极管的导热结构 The thermal conductivity of the structure of the light emitting diode
04/04/2012CN102403441A Light emitting diode packaging structure
04/04/2012CN102403440A Light-emitting device
04/04/2012CN102403439A Led device with re-emitting semiconductor construction and converging optical element
04/04/2012CN102403438A Light emitting device
04/04/2012CN102403437A 半导体发光元件搭载用基板以及使用其的半导体发光装置 The semiconductor light-emitting element mounting substrate and a semiconductor light emitting device using the same
04/04/2012CN102403436A 半导体发光元件的散热座的制作方法 The heat sink manufacturing method of the semiconductor light emitting element
04/04/2012CN102403435A 发光二极管 Led
04/04/2012CN102403434A 一种垂直结构led芯片的制作方法 A method of making a vertical structure led chip
04/04/2012CN102403433A 发光装置 Light-emitting device
04/04/2012CN102403432A 发光结构及其制造方法 Light-emitting structure and manufacturing method
04/04/2012CN102403431A 发光二极管 Led
04/04/2012CN102403430A Graphene light-emitting device and method of manufacturing same
04/04/2012CN102403429A 发光装置 Light-emitting device
04/04/2012CN102403428A Group III nitride nanorod light emitting device and method of manufacturing thereof
04/04/2012CN102403427A Semiconductor light-emitting device and a method of manufacture thereof
04/04/2012CN102403426A 一种制造宽色域白光led的方法 A method of manufacturing a wide gamut of white led
04/04/2012CN102403425A 一种倒装led芯片的制作方法 A method of making a flip-led chip
04/04/2012CN102403424A 一种集成电阻的发光二极管芯片制作方法 A method of making a light emitting diode chip integrated resistor
04/04/2012CN102403423A Led荧光胶层制备工艺及采用该工艺封装成的封装结构 Led fluorescent layer preparation and adoption of the technology package into the package structure
04/04/2012CN102403422A 一种led封装结构的加工方法及led封装结构 Processing method led package structure and led package structure
04/04/2012CN102403421A 一种led模组荧光粉混合物涂层方法 A modular method led phosphor coating mixture
04/04/2012CN102403420A 一种图形化蓝宝石衬底的制备方法 A graphical method for preparing a sapphire substrate
04/04/2012CN102403419A Manufacturing technology of high-power LED radiating structure
04/04/2012CN102403418A Manufacturing method of high-power LED radiating structure
04/04/2012CN102403417A Group III nitride nanorod light emitting device and method of manufacturing the same
04/04/2012CN102403416A Light source apparatus
04/04/2012CN102403415A 发光二极管的制造方法 The method of manufacturing a light emitting diode
04/04/2012CN102403414A 发光器件、发光器件封装及其图像显示装置 Light-emitting device, the light emitting device package and image display device
04/04/2012CN102403413A LED (Light-Emitting Diode) heat dissipation base plate, LED packaging structure, and manufacturing method of LED heat dissipation base plate and LED packaging structure
04/04/2012CN102403330A Light-emitting structure
04/04/2012CN102403309A Light emitting device
04/04/2012CN102403307A 一种led基板结构 One kind of led substrate structure
04/04/2012CN102403306A Light-emitting diode packaging structure
04/04/2012CN102399558A 一种钒酸盐红色荧光粉、制备方法及应用 A vanadium salts red phosphor, preparation method and application
04/04/2012CN102399557A Red light-emitting flourescent substance and light-emitting device employing the same
04/04/2012CN102399556A Fluorescent substance and light-emitting device employing same
04/04/2012CN102399554A 氮化物红色发光材料、包括其的发光件以及发光器件 Nitride red light emitting material, including a light emitting element and a light emitting device
04/04/2012CN102398313A 光器件晶片的加工方法 Optical device wafer processing method
04/04/2012CN101807634B 高亮度发光二极管芯片 High-brightness light-emitting diode chips
04/04/2012CN101752469B 发光二极管及其制造方法 The method of manufacturing a light emitting diode and
04/04/2012CN101661984B 一种基于倒转粗糙面的GaN基垂直结构发光二极管的制造方法 A method for producing a rough surface of the inverted vertical structure GaN-based light-emitting diodes based on
04/04/2012CN101501874B Light emitting device and illumination device
04/04/2012CN101438423B Low optical loss electrode structures for leds
04/04/2012CN101339968B Luminous device and method of manufacturing the same
04/04/2012CN101315963B 半导体发光装置 The semiconductor light emitting device
04/04/2012CN101300688B Surface-mounted optoelectronic semiconductor component and method for the production thereof
04/04/2012CN101192637B 发光二极管元件 Light-emitting diode element
04/03/2012US8149259 Drive device, LED array, LED head, and image forming apparatus provided therewith
04/03/2012US8148903 Light emitting diode driving circuit
04/03/2012US8148897 Backlight unit for LCD using LED
04/03/2012US8148890 Light-emitting device and method for manufacturing the same
04/03/2012US8148887 Light emitting diode lamp and light emitting device
04/03/2012US8148753 Compound semiconductor substrate having multiple buffer layers
04/03/2012US8148747 Semiconductor chip assembly with post/base/cap heat spreader
04/03/2012US8148746 Semiconductor light emitting device
04/03/2012US8148745 Semiconductor light emitting module and method for manufacturing the same
04/03/2012US8148744 Semiconductor light emitting device
04/03/2012US8148743 Semiconductor device including semiconductor circuit made from semiconductor element and manufacturing method thereof
04/03/2012US8148742 Type II broadband or polychromatic LEDs
04/03/2012US8148741 Polychromatic LED's and related semiconductor devices
04/03/2012US8148740 Semiconductor light emitting device and method of manufacturing the same
04/03/2012US8148739 LED package structure
04/03/2012US8148737 Light emitting device, light emitting device package and lighting system
04/03/2012US8148736 Flip chip type light-emitting element
04/03/2012US8148734 Light emitting device having a lateral passivation layer
04/03/2012US8148733 Vertical LED with current guiding structure
04/03/2012US8148732 Carbon-containing semiconductor substrate
04/03/2012US8148731 Films and structures for metal oxide semiconductor light emitting devices and methods
04/03/2012US8148726 Display device and manufacturing method thereof
04/03/2012US8148725 Light-emitting device and repairing method thereof
04/03/2012US8148722 Method of manufacturing P-type ZnO semiconductor layer using atomic layer deposition and thin film transistor including the P-type ZnO semiconductor layer
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