Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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03/29/2012 | US20120074415 Liquid crystal display device |
03/29/2012 | US20120074414 Organic light emitting diode display device and method of manufacturing the same |
03/29/2012 | US20120074413 Organic light-emitting display device and method of manufacturing the same |
03/29/2012 | US20120074408 Organic light emitting display device and method of manufacturing the same |
03/29/2012 | US20120074399 Method of making oxide thin film transistor array, and device incorporating the same |
03/29/2012 | US20120074384 Protection for the epitaxial structure of metal devices |
03/29/2012 | US20120074383 Device of light-emitting diode |
03/29/2012 | US20120074382 Light emitting diode and method for manufacture of the same |
03/29/2012 | US20120074381 Re-emitting semiconductor construction with enhanced extraction efficiency |
03/29/2012 | US20120074380 White light emitting diode |
03/29/2012 | US20120074379 Light-emitting element and the manufacturing method thereof |
03/29/2012 | DE202012002417U1 Leuchtvorrichtung Lighting device |
03/29/2012 | DE102010046792A1 Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung The optoelectronic semiconductor chip and method of manufacture |
03/29/2012 | DE102010046790A1 Optoelectronic semiconductor component comprises two semiconductor chips, a conversion element, a prefabricated housing having a cavity, and a continuous emission spectrum, where the semiconductor chips comprise an active layer |
03/29/2012 | DE102010046648A1 LED device, has LED including two terminals that are electrically contacted with heat conducting metal block and electrical component respectively, where metal block is arranged in heat conducting contact with inside wall of through-opening |
03/29/2012 | DE102010041420A1 Lichtsystem mit erhöhter Effizienz Light system with increased efficiency |
03/29/2012 | DE102010041236A1 Optoelektronisches Halbleiterbauelement Optoelectronic semiconductor component |
03/29/2012 | DE102010037813A1 Sealing compound manufacturing method for LED, involves heating and stamping two sealing compound layers and phosphor powder to form compact component that is cut from sealing compound layers and phosphor powder to form covering of LED |
03/29/2012 | DE102010026343A1 Bauelement und Verfahren zur Herstellung eines Bauelements Device and method for manufacturing a device |
03/29/2012 | DE102009040115B4 Anordnung von Lampenfassung und Lampensockel Arrangement of lamp socket and lamp base |
03/28/2012 | EP2434554A2 Light-emitting device |
03/28/2012 | EP2434553A2 Light emitting device package and lighting apparatus using the same |
03/28/2012 | EP2434335A2 Light source unit for backlight, backlight device for liquid crystal display,and transmissive liquid crystal display device |
03/28/2012 | EP2433314A1 Non-radiatively pumped wavelength converter |
03/28/2012 | EP2432832A1 Encapsulant compositions, methods of manufacture and uses thereof |
03/28/2012 | EP2193696B1 High thermal performance packaging for optoelectronics devices |
03/28/2012 | EP2095433B1 Semiconductor component and associated production method |
03/28/2012 | EP1579511B1 Method for roughening a surface of an opto-electronic semiconductor body. |
03/28/2012 | EP1454370B1 Light emitting device and method for making same |
03/28/2012 | EP1398839B1 Light emitting device comprising light emitting diode chip |
03/28/2012 | CN202178916U 一种车用前照灯led电路板 A vehicle headlamp led board |
03/28/2012 | CN202178914U 载体白色覆盖膜 Vector white cover film |
03/28/2012 | CN202178296U 复合散热板结构 Composite structures radiating plate |
03/28/2012 | CN202178295U 发光二极管封装件 Light emitting diode package |
03/28/2012 | CN202178294U 荧光板 Fluorescent plate |
03/28/2012 | CN202178293U 发光二极管的支架 A light emitting diode holder |
03/28/2012 | CN202178292U 一种led支架及led One kind of led bracket and led |
03/28/2012 | CN202178291U 一种蓝光led结构 One kind of Blu-led structure |
03/28/2012 | CN202178290U Led灯条全自动加工设备的传送料盘 Transfer trays Led light bar automatic processing equipment |
03/28/2012 | CN202178254U 直立堆叠式发光二极管结构 Upright stacked light emitting diode structure |
03/28/2012 | CN202178253U 阵列式发光二极管 An array of light-emitting diodes |
03/28/2012 | CN202176924U Led灯 Led lights |
03/28/2012 | CN1790760B Nitride semiconductor device |
03/28/2012 | CN102396083A Optical device structure using gan substrates for laser applications |
03/28/2012 | CN102396065A Optical device using non-radiative energy transfer |
03/28/2012 | CN102396014A Led assembly with improved visibility and shapability, attaching method of the same, and banner using the same |
03/28/2012 | CN102395648A Red phosphor, method for producing same, and light-emitting element |
03/28/2012 | CN102394267A LED chip capable of improving light extraction efficiency |
03/28/2012 | CN102394266A Curable adhesive type light emitting diode (LED) dispensing structure |
03/28/2012 | CN102394265A Manufacturing method of SMD full color LED component |
03/28/2012 | CN102394264A Method for enhancing purple light electroluminescent property of ZnO-based light emitting diode |
03/28/2012 | CN102394263A Method for enhancing electroluminescent property of n-ZnO/AlN/p-GaN light-emitting diode |
03/28/2012 | CN102394262A Graphical substrate preparation method for improving luminous efficiency of GaN-based LED |
03/28/2012 | CN102394261A Method of epitaxially growing nitride epitaxial film on sapphire patterned substrate |
03/28/2012 | CN102394236A LED (light-emitting diode) luminous module and manufacturing method thereof |
03/28/2012 | CN102391869A Red fluorescent powder for light-emitting diodes and preparation method thereof |
03/28/2012 | CN102391864A Single-substrate fluorescent powder for ultraviolet excitation white-light LED (Light-Emitting Diode) as well as preparation and application methods thereof |
03/28/2012 | CN102391863A SrMoO4:Eu<3+> red phosphor for LED and preparation method for SrMoO4:Eu<3+> red phosphor |
03/28/2012 | CN102391859A Green fluorescent powder for white LED (light-emitting diode) use, its preparation method and application |
03/28/2012 | CN102391858A Fluorescent powder for white-light and backlight LEDs (light-emitting diode) and preparation method thereof |
03/28/2012 | CN102391811A Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) |
03/28/2012 | CN102391652A Preparation process for organic silicon rubber for light-emitting diode (LED) chip packaging |
03/28/2012 | CN102391651A Formula of organic silicon rubber for light-emitting diode (LED) chip packaging |
03/28/2012 | CN102391529A Preparation method of silicone resin type organic/inorganic hybrid material for packaging |
03/28/2012 | CN101980382B LED chip manufacturing method, LED chip and LED |
03/28/2012 | CN101943369B Lens |
03/28/2012 | CN101901864B LED (Light-Emitting Diode) module and LED illumination device |
03/28/2012 | CN101826591B LED packaging process |
03/28/2012 | CN101796657B Light emitting device employing non-stoichiometric tetragonal alkaline earth silicate phosphors |
03/28/2012 | CN101749567B LED system |
03/28/2012 | CN101740672B Photoelectric element, back light module device and illuminating device |
03/28/2012 | CN101728469B Light-emitting diode and grain thereof |
03/28/2012 | CN101689594B Radiation-emitting semiconductor body |
03/28/2012 | CN101608780B Ring-shaped led focusing printed circuit board and ring-shaped led focusing energy saving lamp |
03/28/2012 | CN101521196B Light-emitting diode (LED) and method for preparing LED and base of LED |
03/28/2012 | CN101517753B Method for manufacturing for light emitting diode |
03/28/2012 | CN101479859B Optoelectronic component and illumination device |
03/28/2012 | CN101442088B Method for shaping patch type LED optical lens model |
03/28/2012 | CN101409322B Semiconductor luminous element and manufacturing method thereof |
03/28/2012 | CN101402857B Red luminous material for LED and producing process thereof |
03/28/2012 | CN101378015B Group III nitride semiconductor and a manufacturing method thereof |
03/28/2012 | CN101346584B Luminaire using LED |
03/28/2012 | CN101195742B Phosphor and light emission appliance using phosphor |
03/27/2012 | US8144087 Color LED driver |
03/27/2012 | US8143770 LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element |
03/27/2012 | US8143643 Light device and fabrication method thereof |
03/27/2012 | US8143642 Light emitting diode |
03/27/2012 | US8143641 Integrated-type LED and manufacturing method thereof |
03/27/2012 | US8143640 GaN compound semiconductor light emitting element and method of manufacturing the same |
03/27/2012 | US8143639 Light emitting device and light emitting device package having the same |
03/27/2012 | US8143638 Light emitting diode package structure and method thereof |
03/27/2012 | US8143637 Optically coupled device with an optical waveguide |
03/27/2012 | US8143636 Light-emitting device |
03/27/2012 | US8143635 Gallium nitride compound semiconductor light-emitting device, method of manufacturing the same, and lamp including the same |
03/27/2012 | US8143634 Light emitting diode package with a phosphor substrate |
03/27/2012 | US8143633 LED package structure and manufacturing process thereof |
03/27/2012 | US8143630 Zinc sulfide substrates for group III-nitride epitaxy and group III-nitride devices |
03/27/2012 | US8143627 Semiconductor device |
03/27/2012 | US8143622 Display panel |
03/27/2012 | US8143618 ZnO based semiconductor device and its manufacture method |