Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2012
03/22/2012DE102010045783A1 Trägersubstrat für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement A carrier substrate for an optoelectronic component, to processes for its preparation and optoelectronic component
03/22/2012DE102010045596A1 Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Leiterrahmenvebund Surface-mountable optoelectronic semiconductor component and Leiterrahmenvebund
03/22/2012DE102010041114A1 Leuchtvorrichtung Lighting device
03/21/2012EP2432038A1 Light emitting diode package structure
03/21/2012EP2432037A1 Semiconductor white light-emitting device
03/21/2012EP2432036A2 Light emitting diode
03/21/2012EP2431964A1 Display apparatus
03/21/2012EP2430673A1 Semiconductor light emitting diodes having reflective structures and methods of fabricating same
03/21/2012EP2430672A1 Tunnel diodes made of stress-compensated compound semiconductor layers
03/21/2012EP2430359A1 Led lamp producing sparkle
03/21/2012EP1783192B1 Phosphor and light-emitting device using same
03/21/2012EP1509957B1 High power, high luminous flux light emitting diode and method of making same
03/21/2012EP0942459B1 Method of growing nitride semiconductors
03/21/2012CN202172090U Led封装构造 Led package structure
03/21/2012CN202172089U 发光二极管改良结构 Improved structure of light-emitting diodes
03/21/2012CN202172088U 双半球体透光led灯珠 Dual hemispherical transmittance led lamp beads
03/21/2012CN202172087U 一种smd led贴片分光机的吸料移送装置 Smd led one kind of suction machine placement spectral transfer device
03/21/2012CN202172068U LED (light-emitting diode) packaging piece connected through bonded filamentary silver coated with palladium layer on surface
03/21/2012CN202172067U 电子照明装置 Electrical lighting equipment
03/21/2012CN202171158U 一种led柔性线光源 One kind of led flexible line source
03/21/2012CN1988109B Process for producing a free-standing III-N layer, and free-standing III-N substrate
03/21/2012CN1934720B Semiconductor light-emitting device and illuminating device
03/21/2012CN1909190B Gallium nitride device substrate containing a lattice parameter altering element
03/21/2012CN1728912B Automatic flashy portable mobile communication terminal device and method for realizing automatic flash
03/21/2012CN102388473A Light-emitting diode package
03/21/2012CN102388472A Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components
03/21/2012CN102388471A Semiconductor light emitting diode and method of producing same
03/21/2012CN102388470A Semiconductor light emitting diode and method of producing same
03/21/2012CN102388469A Fabrication of compact opto-electronic component packages
03/21/2012CN102388436A Apparatus and method for manufacturing light-emitting diode
03/21/2012CN102388432A Methods and apparatus for treating effluent
03/21/2012CN102388090A Optical device and method of producing the same
03/21/2012CN102386320A Semiconductor apparatus, inspection method thereof and electric device
03/21/2012CN102386319A Light-emitting devices
03/21/2012CN102386318A Packaging structure and packaging method of light-emitting diode
03/21/2012CN102386317A Lead frame combination of light-emitting diode
03/21/2012CN102386316A LED (Light Emitting Diode) module with optical lens
03/21/2012CN102386315A LED (Light Emitting Diode) module forming white light
03/21/2012CN102386314A LED (Light Emitting Diode)
03/21/2012CN102386313A Light emitting device, light emitting device package, and light unit
03/21/2012CN102386312A LED packaging process
03/21/2012CN102386311A Integrated light-emitting diode (LED) light source and manufacturing method thereof
03/21/2012CN102386310A Light-emitting diode (LED) chip bracket
03/21/2012CN102386309A Light emitting device
03/21/2012CN102386308A Light-emitting device and method for manufacturing light-emitting device
03/21/2012CN102386307A LED package with contrasting face
03/21/2012CN102386306A LED (light-lighting diode) chip packaging method and packaging structure
03/21/2012CN102386305A Semiconductor light source structure with vacuum base
03/21/2012CN102386304A LED (light-emitting diode) reflective condensing part
03/21/2012CN102386303A Electrical connection structure and light-emitting diode module, weaving line circuit and signal fabric which use same
03/21/2012CN102386302A Light-emitting diode module with reflecting face with preset angle
03/21/2012CN102386301A LED (Light Emitting Diode) module
03/21/2012CN102386300A Light emitting diode (LED) module used for improving luminous efficiency
03/21/2012CN102386299A Light-emitting diode module for forming white light
03/21/2012CN102386298A Light-emitting diode (LED) module used for forming white light
03/21/2012CN102386297A Light-emitting diode module
03/21/2012CN102386296A Graphene transparent electrode, graphene light-emitting diode and preparation method thereof
03/21/2012CN102386295A Light-emitting element
03/21/2012CN102386294A Light emitting element
03/21/2012CN102386293A 发光二极管 Led
03/21/2012CN102386292A III-group nitride-based luminous device capable of improving light extraction efficiency and manufacture method thereof
03/21/2012CN102386291A Light-emitting devices with two-dimensional composition-fluctuation active-region and method for fabricating the same
03/21/2012CN102386290A Packaging structure of light-emitting diode
03/21/2012CN102386289A Integrated light-emitting diode packaging method
03/21/2012CN102386288A Method of manufacturing a light emitting device
03/21/2012CN102386287A Imaging substrate and preparation method thereof as well as light-emitting diode
03/21/2012CN102386286A Chip transferring method and chip transferring equipment
03/21/2012CN102386201A Light-emitting device and the manufacturing method thereof
03/21/2012CN102386179A Light emitting apparatus and multi-surface pattern substrate
03/21/2012CN102386178A High-voltage-driving LED light-emitting device and manufacturing method thereof
03/21/2012CN102386177A Light-emitting diode (LED) lamp
03/21/2012CN102386176A 发光二极管封装件及其制造方法 A light emitting diode package and a manufacturing method
03/21/2012CN102386174A LED (Light Emitting Diode) module for forming white light
03/21/2012CN102386155A Semiconductor device and method for forming light-emitting diode component
03/21/2012CN102386103A Method for manufacturing package substrate, and package substrate structure
03/21/2012CN102384405A LED light source unit for backlight of liquid crystal display, and liquid crystal display
03/21/2012CN102383193A Free-standing (Al, Ga, In)N and parting method for forming same
03/21/2012CN102382656A LED-excited green-orange fluorescent powder
03/21/2012CN102382655A Phosphorus-containing LED fluorescent powder, preparation method and prepared light-emitting device thereof
03/21/2012CN102382652A Green emitting phosphor powder capable of being excited by ultraviolet-blue ray light-emitting diode (LED) and preparation method thereof
03/21/2012CN102382651A Preparation method of nitride red fluorescent powder for light-emitting diodes
03/21/2012CN102382650A Nitride red phosphor synthesized at normal pressure for white light and backlight LED
03/21/2012CN102064164B Freely combined lamp wick of flip-chip power LED tube core
03/21/2012CN102044624B Light-emitting device (LED) capable of emitting compound light, light-emitting element and manufacturing methods of LED and light-emitting element
03/21/2012CN102024896B Light-emitting diode epitaxial wafer and manufacturing method thereof
03/21/2012CN101958372B Light-emitting diode packaging structure with upper electrode and lower electrode and packaging method thereof
03/21/2012CN101924099B Light-emitting diode device
03/21/2012CN101866831B Epitaxial substrate with low surface defect density and manufacturing method thereof
03/21/2012CN101853842B Package structure for chip and method for forming the same
03/21/2012CN101840968B Semiconductor photoelectric element capable of improving light extraction efficiency and method for manufacturing same
03/21/2012CN101814486B LED and LED lamp
03/21/2012CN101772846B Semiconductor light emitting element and method for manufacturing the same
03/21/2012CN101711434B Led lighting device
03/21/2012CN101694859B Light emitting diode with large power and manufacturing method thereof
03/21/2012CN101681828B Method for manufacturing semiconductor element
03/21/2012CN101680639B Silicon moulded part comprising luminous bodies
03/21/2012CN101677117B Method for configuring high color rendering light emitting diode and system
03/21/2012CN101645474B Photoelectric element and manufacturing method thereof, backlight module device and illuminating apparatus
03/21/2012CN101627481B Wafer level phosphor coating method and devices fabricated ultilizing method
03/21/2012CN101603634B LED lamp fitting
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