| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 04/26/2012 | US20120097959 Thin Film Transistor Array, Method for Manufacturing the Same, and Active Matrix Type Display Using the Same |
| 04/26/2012 | US20120097958 Active-matrix field emission pixel |
| 04/26/2012 | US20120097956 Organic light emitting display device |
| 04/26/2012 | US20120097951 Organic light emitting display device and manufacturing method thereof |
| 04/26/2012 | US20120097945 Polycrystalline metal-based led heat dissipating structure and method for manufacturing the same |
| 04/26/2012 | US20120097940 Display device and method for manufacturing the same |
| 04/26/2012 | US20120097922 Light emitting element, method of producing same, lamp, electronic equipment, and mechinical apparatus |
| 04/26/2012 | US20120097921 Cadmium-free Re-Emitting Semiconductor Construction |
| 04/26/2012 | US20120097920 Iii-nitride light-emitting diode and method of producing the same |
| 04/26/2012 | US20120097919 Limiting strain relaxation in iii-nitride hetero-structures by substrate and epitaxial layer patterning |
| 04/26/2012 | US20120097918 Implanted current confinement structure to improve current spreading |
| 04/26/2012 | DE112006003435B4 Lichtemittierende Diode in Kopfabstrahlungs- und Seitenabstrahlungsbauart Light-emitting diode in Kopfabstrahlungs- and side view type |
| 04/26/2012 | DE102011002960B3 Solarsimulator und Verfahren zum Betreiben eines Solarsimulators Solar simulator and method of operating a solar simulator |
| 04/26/2012 | DE102010049333A1 Endless band shaped structure for retaining e.g. power LEDs, has reflecting film covering strip guard structure, where reflecting film is left blank in punched receiving areas utilized for retaining electronic parts |
| 04/26/2012 | DE102010049312A1 Verfahren zur Herstellung eines Konversionsplättchens und Konversionsplättchen A method for producing a wafer conversion and conversion platelets |
| 04/26/2012 | DE102010049186A1 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optoelectronic component and process for its preparation |
| 04/26/2012 | DE102010049146A1 Leuchtanordnung, Verfahren zu deren Herstellung sowie Leuchtvorrichtung The light assembly, to processes for their preparation and light-emitting device |
| 04/26/2012 | DE102006030890B4 System und Verfahren zum Erzeugen von weißem Licht unter Verwendung einer Kombination von weißen Leuchtstoffumwandlungs-LEDs und Nicht-Leuchtstoffumwandlung-Farb-LEDs System and method for generating white light using a combination of white phosphor conversion LEDs and non-fluorescent conversion-color LEDs |
| 04/25/2012 | EP2445066A1 Group III nitride LED with undoped cladding layer and multiple quantum well |
| 04/25/2012 | EP2445024A1 Led array module and fabrication method thereof |
| 04/25/2012 | EP2445023A2 Light emitting diode packaging structure and light emitting diode stereoscopic display device |
| 04/25/2012 | EP2445022A2 Light emitting devices with improved light extraction efficiency |
| 04/25/2012 | EP2445021A2 Lighting emitting diode (LED) package and method of fabrication |
| 04/25/2012 | EP2445020A2 Light emitting diode package structure |
| 04/25/2012 | EP2445019A2 Electrode configuration for a light emitting diode |
| 04/25/2012 | EP2445018A1 Semiconductor light-emitting device, light-emitting module, and illumination device |
| 04/25/2012 | EP2445017A2 Vertical light-emitting semiconductor device |
| 04/25/2012 | EP2445007A2 Multichip package structure using a constant voltage power supply |
| 04/25/2012 | EP2445006A2 Light-emitting device and method for manufacturing the same |
| 04/25/2012 | EP2443677A1 Light emitting diode package, and backlight unit and display device using the same |
| 04/25/2012 | EP2443676A2 Phosphor converting ir leds |
| 04/25/2012 | EP2443675A2 Light emitting diodes |
| 04/25/2012 | EP2443674A2 Optoelectronic semiconductor component |
| 04/25/2012 | EP2443673A1 Conversion led with increased robustness, and method for the production thereof |
| 04/25/2012 | EP2443672A2 Wavelength specific silicon light emitting structure |
| 04/25/2012 | EP2443671A2 AN ALL SILICON 750nm AND CMOS-BASED OPTICAL COMMUNICATION SYSTEM UTILIZING MOD-E AVALANCHE LEDs |
| 04/25/2012 | EP2443670A1 Semiconductor light emitting device with a contact formed on a textured surface |
| 04/25/2012 | EP2443488A2 Light extraction member and organic light emitting diode including the same |
| 04/25/2012 | EP2443465A2 Cmos moems sensor device |
| 04/25/2012 | EP1869715B1 Nitride semiconductor led and fabrication method thereof |
| 04/25/2012 | CN202206656U Led电路板 Led board |
| 04/25/2012 | CN202205816U 新型食人鱼支架散热结构 The new Piranha bracket dissipation structure |
| 04/25/2012 | CN202205815U 一种led的贴片结构 One kind of led patch structure |
| 04/25/2012 | CN202205814U 一种发光二极管器件 A light emitting diode device |
| 04/25/2012 | CN202205813U 一种发光二极管点阵模块 A light-emitting diode dot matrix module |
| 04/25/2012 | CN202205812U LED heat dissipation apparatus |
| 04/25/2012 | CN202205811U 一种薄膜倒装光子晶体led芯片 A thin-film flip-chip photonic crystal led |
| 04/25/2012 | CN202205810U 双翼型灯珠 Wings lamp beads |
| 04/25/2012 | CN202205809U 插接式led灯珠 Plug-led lamp beads |
| 04/25/2012 | CN202205808U 一种带有真空基座的半导体光源结构 A semiconductor light source structure with vacuum base |
| 04/25/2012 | CN202205807U 红外线发射二极管 Infrared emitting diode |
| 04/25/2012 | CN202205806U 一种大功率led封装结构 One kind of high power led package structure |
| 04/25/2012 | CN202205805U 发光二极管结构 Light-emitting diode structure |
| 04/25/2012 | CN202205804U 直驱式固晶机的摆臂机构 Bonder direct-drive swing arm mechanism |
| 04/25/2012 | CN202205803U 一种全自动贴膜贴片机 A fully automatic foil placement machine |
| 04/25/2012 | CN202205745U 一种户外显示用的led贴片结构 Kind of outdoor display with SMD led structure |
| 04/25/2012 | CN202205743U 易安装led灯珠 Easy to install led lamp beads |
| 04/25/2012 | CN202205742U 一种led灯珠 One kind of led lamp beads |
| 04/25/2012 | CN202205741U 分层高密led灯珠 Stratified density led lamp beads |
| 04/25/2012 | CN202205740U 高散热多晶片封装结构 High heat multi-chip package structure |
| 04/25/2012 | CN202205739U 凸式led封装结构 Convex type led package structure |
| 04/25/2012 | CN202203904U 灯具散热装置及其散热体结构 Lighting and cooling heat sink structure |
| 04/25/2012 | CN202203799U 一种新型led背光源 A novel led backlight |
| 04/25/2012 | CN202203733U 集成封装led灯泡 Integrated package led bulb |
| 04/25/2012 | CN202199522U 一种smd led贴片分光机的芯片定位装置 One kind of sorting machines smd led SMD chip positioning device |
| 04/25/2012 | CN1826694B Nanowhiskers with PN junctions and methods of fabricating thereof |
| 04/25/2012 | CN1610135B Method of manufacturing light-emitting device |
| 04/25/2012 | CN102428584A 光源装置及具有该光源装置的显示装置 The light source device and a display device having the light source apparatus |
| 04/25/2012 | CN102428583A Light scattering and conversion plate for leds |
| 04/25/2012 | CN102428582A Light emitting module, method of producing light-emitting module, and lighting fixture unit |
| 04/25/2012 | CN102428581A Optoelectronic component |
| 04/25/2012 | CN102428580A 发光二极管和发光二极管灯以及照明装置 Light-emitting diodes and light-emitting diode lamps and lighting devices |
| 04/25/2012 | CN102428579A 光电子半导体芯片和用于制造光电子半导体芯片的方法 Method of fabricating an optoelectronic semiconductor chip and a semiconductor chip photoelectron |
| 04/25/2012 | CN102428578A Methods and apparatus for forming uniform layers of phosphor material on an led encapsulation structure |
| 04/25/2012 | CN102428138A Encapsulant compositions, methods of manufacture and uses thereof |
| 04/25/2012 | CN102427109A 光源的辅助部件及其连接电路 Auxiliary light source components and their connection circuit |
| 04/25/2012 | CN102427108A 用于多电流注入区器件的倒装焊结构及其制作方法 Flip-chip structure and method for making the device more than the current injection region |
| 04/25/2012 | CN102427107A 一种大功率白光led倒装芯片及其制作方法 One kind of white led high power flip-chip and its manufacturing method |
| 04/25/2012 | CN102427106A 一种反射式二极管发光装置的封装结构 The package structure of a reflection type light emitting diode device |
| 04/25/2012 | CN102427105A 具有调制掺杂分布布拉格反射层的发光二极管 Having a modulation-doped distributed Bragg reflector layer, a light emitting diode |
| 04/25/2012 | CN102427104A 碳化硅衬底外延片、封装芯片、白光led及工艺方法 Silicon carbide substrate wafer, packaged chips, white led and process methods |
| 04/25/2012 | CN102427103A 氮化镓基ⅲ-ⅴ族化合物半导体led外延片及其生长方法以及包括其的led显示装置 GaN-based ⅲ-ⅴ compound semiconductor epitaxial wafer led its growth method and apparatus including led display |
| 04/25/2012 | CN102427102A 一种防止外延层生长二次位错的方法 An epitaxial layer growth method of preventing secondary dislocations |
| 04/25/2012 | CN102427101A 半导体结构及其形成方法 And a method for forming a semiconductor structure |
| 04/25/2012 | CN102427100A 半导体结构及其形成方法 And a method for forming a semiconductor structure |
| 04/25/2012 | CN102427081A 一种led发光模组 One kind of led light module |
| 04/25/2012 | CN102427075A LED apparatus and field sequential display |
| 04/25/2012 | CN102424751A Bismuth-layer-structured red light emitting phosphor, preparation method thereof, and application thereof |
| 04/25/2012 | CN102110750B Method for packaging wafer level glass micro-cavity of light-emitting diode (LED) |
| 04/25/2012 | CN101928111B 发光玻璃的制造方法、发光玻璃及其用途 The method of manufacturing a light-emitting glass, luminous glass and its use |
| 04/25/2012 | CN101840964B 低阻p-GaN欧姆接触电极制备方法 Low resistivity p-GaN ohmic contact electrode preparation |
| 04/25/2012 | CN101828228B 凹部形成方法、凹-凸制品的制造方法、发光元件的制造方法和光学元件的制造方法 Convex products, a manufacturing method, the manufacturing method of the light emitting element and the optical element - a method of forming a concave portion, a concave |
| 04/25/2012 | CN101816072B 用于制造发光器件的方法 The method of manufacturing a light emitting device |
| 04/25/2012 | CN101809768B 发光器件封装 Light emitting device package |
| 04/25/2012 | CN101803047B 准直器 Collimator |
| 04/25/2012 | CN101689587B 半导体发光元件 The semiconductor light emitting element |
| 04/25/2012 | CN101681956B Quantum dot light emitting device |
| 04/25/2012 | CN101656286B 发光二极管与其制造方法 Light-emitting diode and its manufacturing method |
| 04/25/2012 | CN101599533B 发光系统 Lighting system |
| 04/25/2012 | CN101467271B Led device with re-emitting semiconductor construction and converging optical element |