Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2012
05/10/2012US20120112158 Epitaxial substrate, semiconductor light-emitting device using such epitaxial substrate and fabrication thereof
05/10/2012US20120110842 Led package with stepped aperture
05/10/2012DE112010001379T5 Lichtemitterdiodenelement und Verfahren zu dessen Herstellung Light emitting diode element and process for its preparation
05/10/2012DE102010050832A1 Lumineszenzkonversionselement, Verfahren zu dessen Herstellung und optoelektronisches Bauteil mit Lumineszenzkonversionselement Luminescence, to processes for its preparation and opto-electronic component having luminescence
05/10/2012DE102010050343A1 Chipintegrierte Durchkontaktierung von Mehrlagensubstraten Integrated chip through connection of multi-layer substrates
05/10/2012DE102010050342A1 Laminat mit integriertem elektronischen Bauteil Laminate with integrated electronic component
05/10/2012DE102010043726A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device
05/10/2012DE102010043378A1 Optoelectronic component for use as headlight in vehicle, has transparent plate e.g. glass plate, applied on conversion layer, where thermal expansion coefficients of transparent plate and semiconductor chip lie in same order of magnitude
05/09/2012EP2450973A1 Mounting substrate for semiconductor light emitting element, backlight chassis, display device and television receiver
05/09/2012EP2450972A1 Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
05/09/2012EP2450971A2 Solid state light emitting device and method for making the same
05/09/2012EP2450616A1 Lighting device
05/09/2012EP2450182A1 Metal laminate structure and process for production of metal laminate structure
05/09/2012EP2449609A1 Cadmium-free re-emitting semiconductor construction
05/09/2012EP2449608A1 Electroluminescent devices with color adjustment based on current crowding
05/09/2012EP2449607A1 Light emitting diode circuit for ambient light
05/09/2012EP2449606A1 Optoelectronic component
05/09/2012EP2449605A1 P-contact layer for a iii-p semiconductor light emitting device
05/09/2012EP2449604A1 Controlling pit formation in a iii-nitride device
05/09/2012EP2449589A1 Multicolor light emitting diodes
05/09/2012EP1806789B1 Lighting apparatus comprising light emitting diodes and liquid crystal display comprising the lighting apparatus
05/09/2012EP1735837B1 Method of separating layers of material
05/09/2012EP1409240B1 Luminescent nanoparticles and methods for their preparation
05/09/2012CN202217707U Light source radiating structure for light-emitting diodes
05/09/2012CN202217706U LED heat conducting plate
05/09/2012CN202217705U Surface mount type LED support
05/09/2012CN202217704U LED heat radiation structure
05/09/2012CN202217703U Ceramic substrate structure used for high power LED integration packaging
05/09/2012CN202217702U Light source module group and lighting device
05/09/2012CN202217701U High-power GaN-based LED (Light Emitting Diode) structure
05/09/2012CN202217700U Light-emitting diode
05/09/2012CN202217699U Epitaxial structure for LED
05/09/2012CN202217662U Ceramic self-cooling LED light source module
05/09/2012CN202217661U Ultra-thin energy saving LED panel light
05/09/2012CN202215998U Mixed LED lamp bead
05/09/2012CN1927996B Fluorescent powder material, preparation method thereof and white light LED electric light source
05/09/2012CN102449788A Light emitting module, illuminating device, display device, and television receiver
05/09/2012CN102449787A Method and device for mounting semiconductor light-emitting element
05/09/2012CN102449785A Optical device, semiconductor substrate, optical device producing method, and semiconductor substrate producing method
05/09/2012CN102449743A Substrate pretreatment for subsequent high temperature group III depositions
05/09/2012CN102449381A Light-source unit, lighting device, displaying device, television-receiver device, and manufacturing method of reflection-sheets for light-sources
05/09/2012CN102449374A Ceramic illumination device
05/09/2012CN102449373A Illumination device with an envelope enclosing a light source
05/09/2012CN102449034A Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor
05/09/2012CN102448668A Barrel Grinding Of Lumiramictm Platelets
05/09/2012CN102448254A Four degree-of-freedom series-parallel surface-mounted manipulator
05/09/2012CN102447052A LED heat-dissipation substrate and a manufacturing method thereof
05/09/2012CN102447051A Light emitting diode sealing member and method for producing light emitting diode device
05/09/2012CN102447050A LED (light-emitting diode) luminous element with stitches
05/09/2012CN102447049A LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator
05/09/2012CN102447048A 发光装置 Light-emitting device
05/09/2012CN102447047A Light-emitting device and lighting device provided with the same
05/09/2012CN102447046A Light emitting diode package structure and manufacturing method thereof
05/09/2012CN102447045A Light emitting diodes and manufacturing method thereof
05/09/2012CN102447044A Insulating base light-emitting chip packaging structure
05/09/2012CN102447043A Light emitting diode package structure
05/09/2012CN102447042A LED (Light Emitting Diode) package structure and process
05/09/2012CN102447041A Light emitting diode package structure and manufacturing method thereof
05/09/2012CN102447040A Packaging structure of light emitting diode and manufacturing method thereof
05/09/2012CN102447039A Integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate
05/09/2012CN102447038A Formation method of light-emitting diode packaging structure
05/09/2012CN102447037A Light emitting device and light emitting diode printing head applying same
05/09/2012CN102447036A Light emitting diode module
05/09/2012CN102447035A LED (light emitting diode) as well as mold and method for manufacturing LED
05/09/2012CN102447034A LED (light emitting diode) packaging structure and manufacturing method thereof
05/09/2012CN102447033A LED (light-emitting diode) chip with high light efficiency, low light attenuation and high package yield
05/09/2012CN102447032A Light emitting device
05/09/2012CN102447031A Light emitting device and light emitting device package thereof
05/09/2012CN102447030A Light emitting device and lighting system
05/09/2012CN102447029A Light emitting device and lighting instrument including the same
05/09/2012CN102447028A Light-emitting element
05/09/2012CN102447027A Vertical structure type light-emitting diode with high light extraction window
05/09/2012CN102447026A Light emitting diode (LED) epitaxial structure
05/09/2012CN102447025A Nickel tin bonding system with barrier layer for semiconductor wafers and devices
05/09/2012CN102447024A Method for manufacturing nanometer-level PSS (Patterned Sapphire Substrate)
05/09/2012CN102447023A Method for producing group III nitride semiconductor light-emitting device
05/09/2012CN102447022A Method for producing compound semiconductor light-emitting device
05/09/2012CN102447021A Manufacturing method of semiconductor titanium crystal health care chip
05/09/2012CN102447020A Method for manufacturing high-brightness vertical light emitting diode
05/09/2012CN102447019A Sealing compound technology for light-emitting diode and housing structure manufactured by same
05/09/2012CN102447018A Improved combination structure and combining method of baseplate and heat dissipating structure
05/09/2012CN102447017A LED (Light Emitting Diode) waterproof jig and LED cutting method
05/09/2012CN102447016A LED (Light Emitting Diode) structure and manufacturing method thereof
05/09/2012CN102447015A Vertical structural light emitting diode (LED)
05/09/2012CN102446949A Light-emitting element having a plurality of contact parts
05/09/2012CN102446948A Light emitting element
05/09/2012CN102446909A Light-emitting diode combination
05/09/2012CN102446908A Light-emitting diode and formation method thereof
05/09/2012CN102446735A Sapphire wafer dividing method
05/09/2012CN102446715A Systems and methods for forming semiconductor materials by atomic layer deposition
05/09/2012CN102443391A Method of providing a phosphor with a precisely controlled element composition, a phosphor provided by the same, a phosphor, and a light emitting device comprising the said phosphor
05/09/2012CN102443246A Silicon-containing resin packaging composition
05/09/2012CN102443137A Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device
05/09/2012CN102442781A LED packaging material, preparation method and application thereof
05/09/2012CN102442025A Manufacture method for heat dissipation aluminum substrate
05/09/2012CN102104099B Method for manufacturing high-brightness light emitting diode chip
05/09/2012CN101984508B Light emitting diode (LED) aging method
05/09/2012CN101937908B Heat pipe type high-power LED (Light Emitting Diode) module
05/09/2012CN101783341B LED light-source module with heat dissipation structure
05/09/2012CN101630713B Ultraviolet electroluminescence device based on titanium dioxide film
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