| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 07/25/2012 | EP2478557A1 Optoelectronic module |
| 07/25/2012 | EP2478291A1 Lighting device with off-state white appearance |
| 07/25/2012 | EP2478290A1 Light emitting, photovoltaic or other electronic apparatus and system and method of making same |
| 07/25/2012 | EP2478289A1 Luminaire and optical component |
| 07/25/2012 | EP2478285A2 Horticultural led lighting assembly |
| 07/25/2012 | EP2020036B1 Two-phase silicate-based yellow phosphor |
| 07/25/2012 | EP1561247B1 Light emitting device and fabrication method thereof |
| 07/25/2012 | CN202352732U Heat conductor tight combining structure of radiator |
| 07/25/2012 | CN202352731U Self-driving LED (Light-emitting Diode) radiating device cooled based on liquid metal thermosyphon effect |
| 07/25/2012 | CN202352730U Radiating structure for large-power LED (Light-emitting Diode) |
| 07/25/2012 | CN202352729U 发光二极管支架 Light-emitting diodes bracket |
| 07/25/2012 | CN202352728U Luminescent device based on ceramic substrate |
| 07/25/2012 | CN202352727U LED packaging substrate with bulge-shaped reflection surfaces |
| 07/25/2012 | CN202352726U Concave cup shaped light-emitting diode (LED) lamp |
| 07/25/2012 | CN202352725U Horizontal omni directional light emitting light-emitting diode (LED) |
| 07/25/2012 | CN202352724U Improved high-power LED (light-emitting diode) integrated strip-shaped support |
| 07/25/2012 | CN202352723U LED (light emitting diode) device with even fluorescent powder coating structure |
| 07/25/2012 | CN202352722U High-power light-emitting diode (LED) radiation structure |
| 07/25/2012 | CN202352721U Packaging substrate and packaging structure thereof |
| 07/25/2012 | CN202352720U Packaging structure for white LED (Light-emitting diode) extension chip |
| 07/25/2012 | CN202352719U Material discharging bracket device |
| 07/25/2012 | CN202352718U Material clamping device |
| 07/25/2012 | CN202352685U Supporting element, supporting assembly, solar photovoltaic optical collector and LED illumination device |
| 07/25/2012 | CN202352675U Power type light-emitting diode (LED) support and LED |
| 07/25/2012 | CN202352674U Light-emitting diode (LED) substrate with U-shaped return circuit |
| 07/25/2012 | CN202352673U Light-emitting diode module |
| 07/25/2012 | CN202352672U LED encapsulating structure |
| 07/25/2012 | CN202352671U Light-emitting diode (LED) packaging structure |
| 07/25/2012 | CN202352670U Light-emitting diode (LED) lamp |
| 07/25/2012 | CN202352669U Planar package structure for packaging sheet LED on aluminum baseplate |
| 07/25/2012 | CN202352668U Light-emitting device and illuminating device with same |
| 07/25/2012 | CN202352251U High-density light emitting diode (LED) full-color lattice module |
| 07/25/2012 | CN202349642U Light emitting diode (LED) lamp |
| 07/25/2012 | CN102612861A Light-emitting diode drive device and light-emitting diode illumination control method |
| 07/25/2012 | CN102612761A Light-emitting device and method for manufacturing same |
| 07/25/2012 | CN102612760A Light emitting diodes including integrated backside reflector and die attach |
| 07/25/2012 | CN102612744A Electronic device submounts with thermally conductive vias and light emitting devices including the same |
| 07/25/2012 | CN102612622A Surface light source unit, surface illumination device, and liquid crystal display device |
| 07/25/2012 | CN102612575A Single-crystal sapphire for producing single-crystal sapphire substrate for LED, single-crystal sapphire substrate for LED, luminescent element, and processes for producing these |
| 07/25/2012 | CN102612261A High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board |
| 07/25/2012 | CN102612254A Heat radiation type LED (Light-Emitting Diode) flexible circuit board |
| 07/25/2012 | CN102610738A High-power LED (Light Emitting Diode) lamp bead with integrated heat-radiating pad and heat-radiating substrate |
| 07/25/2012 | CN102610737A Heat-radiating device of high-power LED (Light Emitting Diode) |
| 07/25/2012 | CN102610736A White-light LED (Light-Emitting Diode) device |
| 07/25/2012 | CN102610735A Light-emitting device with thermoelectric separated structure and manufacturing method of light-emitting device |
| 07/25/2012 | CN102610734A White-light light-emitting diode (LED) and preparation method for white-light LED |
| 07/25/2012 | CN102610733A LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure |
| 07/25/2012 | CN102610732A Mold structure for light-emitting diode package |
| 07/25/2012 | CN102610731A Light emitting diode element and manufacturing method thereof |
| 07/25/2012 | CN102610730A Light emitting diode packaging structure and manufacturing method of light emitting diode packaging structure |
| 07/25/2012 | CN102610729A Luminescent device embedded with self-assembly photonic crystal thin film and preparation method for luminescent device |
| 07/25/2012 | CN102610728A Light-emitting diode (LED) with back silver-plated reflecting layer and manufacturing method of LED |
| 07/25/2012 | CN102610727A High-efficient white-light LED-paster light emitting diode |
| 07/25/2012 | CN102610726A Light-emitting assembly |
| 07/25/2012 | CN102610725A Semiconductor quantum dot light-emitting diode and preparing method thereof |
| 07/25/2012 | CN102610724A Electroluminescent device based on CdZnO thin film and preparation method of electroluminescent device |
| 07/25/2012 | CN102610723A Deformed indium-gallium-aluminum-nitrogen-based semiconductor light emitting device and manufacturing method thereof |
| 07/25/2012 | CN102610722A LED device and manufacture method thereof |
| 07/25/2012 | CN102610721A Light emitting device processes |
| 07/25/2012 | CN102610720A Light-emitting diode (LED) with omnidirectional reflector and manufacturing method of LED |
| 07/25/2012 | CN102610719A Metamorphic substrate system, method of manufacture of same, and iii-nitrides semiconductor device |
| 07/25/2012 | CN102610718A Substrate used for growing epitaxial structure and using method thereof |
| 07/25/2012 | CN102610717A Semiconductor lighting chip and manufacturing method thereof |
| 07/25/2012 | CN102610716A Method for large-area manufacture of nano-gallium nitride patterned substrates |
| 07/25/2012 | CN102610715A Method for producing nano fluorescent powder-free gallium nitride white light-emitting diode |
| 07/25/2012 | CN102610714A Method for preventing GaAs cover layer from oxidizing and improving heat stability of oxide layer synchronously |
| 07/25/2012 | CN102610713A Method for growing nitride light emitting diode by adopting metal-organic chemical vapor deposition (MOCVD) technology |
| 07/25/2012 | CN102610712A Light emitting diode (LED) package method and structure |
| 07/25/2012 | CN102610711A Method for manufacturing LED chip |
| 07/25/2012 | CN102610710A Method for manufacturing graphical substrate |
| 07/25/2012 | CN102610709A Package carrier and manufacturing method thereof |
| 07/25/2012 | CN102610708A Method for manufacturing light-emitting diodes |
| 07/25/2012 | CN102610707A Method for manufacturing semiconductor device for relieving stress of indium-gallium-aluminum-nitrogen thin film |
| 07/25/2012 | CN102610706A Stress adjusting method used in manufacturing process of indium-gallium-aluminum-nitrogen-based light emitting device |
| 07/25/2012 | CN102610705A Preparation method of gallium nitride substrate |
| 07/25/2012 | CN102610704A Light emitting diode chip packaging body and packaging method thereof |
| 07/25/2012 | CN102610703A Encapsulating method for photoelectric elements |
| 07/25/2012 | CN102610626A Alternating-current LED device with Wheatstone bridges and manufacturing method thereof |
| 07/25/2012 | CN102610603A Luminous device |
| 07/25/2012 | CN102610602A High-resolution LED (light emitting diode) light source made of single-package-based material and manufacturing process of high-resolution LED light source |
| 07/25/2012 | CN102610600A High-power white light emitting diode (LED) module encapsulated by nano silver solder paste and encapsulation method of high-power white light emitting diode module |
| 07/25/2012 | CN102610599A Light-emitting device package and method of manufacturing the light-emitting device package |
| 07/25/2012 | CN102610598A Total-outdoor LED (Light-Emitting Diode) lamp with high brightness, high density and high contrast ratio |
| 07/25/2012 | CN102610597A Package having a light-emitting element and method of fabricating the same |
| 07/25/2012 | CN102610540A Rapid quality control board for surface-mounted diodes |
| 07/25/2012 | CN102610487A Method of forming a wafer map |
| 07/25/2012 | CN102608865A High-temperature-resisting transparent thick-film photoresist and application thereof in preparing LED phosphor layer |
| 07/25/2012 | CN102606915A High-power LED lamp |
| 07/25/2012 | CN102604638A Eu<3+>-activated phosphate red phosphor powder as well as preparation method and application thereof |
| 07/25/2012 | CN102604636A Red and green fluorine sulfide flourescent materials, preparation methods and white light emitting diode device thereof |
| 07/25/2012 | CN102604635A Zirconium-phosphate-based luminescent material, preparation method thereof, and application thereof |
| 07/25/2012 | CN102604219A Preparation method of high-heat-conduction thermal-plasticizing inorganic substance composition and heat-dissipation part manufactured by method |
| 07/25/2012 | CN102184840B Method for manufacturing dual-layer quartz cylinder |
| 07/25/2012 | CN102157636B Method for strengthening silicon-based thin film electroluminescence |
| 07/25/2012 | CN102130228B LED bonding wire heating mold |
| 07/25/2012 | CN102130223B Method for coarsening surface of GaN-based LED epitaxial wafer |
| 07/25/2012 | CN102074620B Semiconductor light-emitting device |
| 07/25/2012 | CN102064250B Substrate-glaring SiC substrate vertical structure light-emitting tube and preparation method thereof |
| 07/25/2012 | CN102064167B Helical packaging structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof |
| 07/25/2012 | CN102024883B Preparation method of light-emitting diode radiating substrate |