Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
07/2012
07/04/2012CN202308025U 一种不间断固晶机进料系统 One kind of uninterrupted Bonder feed system
07/04/2012CN202308024U 适用于贴片式led固晶机的万能夹具 Suitable for SMD led Bonder universal fixture
07/04/2012CN202308023U 固晶焊头机构 Solid crystal horn agency
07/04/2012CN202308022U 发光二极管晶圆的应力消除装置 A light emitting diode wafer stress relief means
07/04/2012CN202308021U 一种线路板型表面贴装发光二极管 A circuit board type surface mount light emitting diode
07/04/2012CN202307891U 贴片数码管 SMD digital
07/04/2012CN202307890U 一种新型集成大功率led封装结构 A new integrated power led package
07/04/2012CN202307889U 一种大功率led集成封装结构 One kind of led integrated power package
07/04/2012CN202307888U 一种大功率白光led封装结构 One kind of high-power white led package structure
07/04/2012CN202307887U 高功率发光二极体装置 High-power light-emitting diode device
07/04/2012CN202307886U 一种led球泡灯光源 One kind of led bulb light source
07/04/2012CN202307885U 发光二极管及应用该发光二极管的显示屏 Light-emitting diodes and the application of the light-emitting diode display
07/04/2012CN202307883U 一种新型led灯珠芯片结构 A new chip architecture led lamp beads
07/04/2012CN202307882U 发光装置及具备该发光装置的照明器具 Light emitting device and lighting fixture with the light-emitting device
07/04/2012CN202307836U 凸轮式驱动装置及固晶机 Cam drives and solid crystal
07/04/2012CN202302947U 贴片led铜线灯串 SMD led copper wire string lights
07/04/2012CN202302944U Led面光源用cob封装灯条模块 Led surface light source light strip modules packaged with cob
07/04/2012CN202302870U 灯具模块 Lighting module
07/04/2012CN202296356U 一种推料装置 One kind of pusher device
07/04/2012CN202293492U 一种铝基覆铜板 An alumina based CCL
07/04/2012CN202292401U 发光二极管晶圆的研磨系统 Light-emitting diode wafer polishing system
07/04/2012CN1988186B Light emitting diode and its producing method
07/04/2012CN1973375B Method of separating layers of material using laser beam
07/04/2012CN1941439B Light emitting diode and method for manufacturing the same
07/04/2012CN1896343B Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
07/04/2012CN1894771B Non-polarity (Al, B, Inc, Ga) N Quantum pit
07/04/2012CN1877681B Image display
07/04/2012CN1840958B System-in-package high-power high-efficiency diode bulb
07/04/2012CN102549786A Light-emitting diode with compensating conversion element and corresponding conversion element
07/04/2012CN102549785A Light emitting device
07/04/2012CN102549784A Electronic, especially optical or optoelectronic component, and method for the production thereof
07/04/2012CN102549783A Reflective substrate for LEDs
07/04/2012CN102549782A Group III nitride semiconductor light-emitting device
07/04/2012CN102549781A Method for producing semiconductor light-emitting element
07/04/2012CN102549780A Stable p-type semiconducting behavior in Li and Ni codoped ZnO
07/04/2012CN102549779A Solid state lighting devices with selected thermal expansion and/or surface characteristics, and associated methods
07/04/2012CN102549778A High quality non-polar/semi-polar semiconductor element on tilt substrate and fabrication method thereof
07/04/2012CN102549777A An all silicon 750nm and CMOS-based optical communication system utilizing mod-e avalanche LEDs
07/04/2012CN102549746A Optoelectronic semiconductor chip and method for adapting a contact structure for electrically contacting an optoelectronic semiconductor chip
07/04/2012CN102549745A Potted optoelectronic module having a plurality of semiconductor components and method for producing an optoelectronic module
07/04/2012CN102549335A Lighting device with off-state white appearance
07/04/2012CN102549333A Luminaire and optical component
07/04/2012CN102549329A 灯 Light
07/04/2012CN102549203A Method for production of laminate
07/04/2012CN102549071A Liquid-crystal polyester resin composition, molded object thereof, and optical device
07/04/2012CN102549069A Epoxy resin compositions
07/04/2012CN102549038A Urethane resin composition, cured object, and photosemiconductor device using cured object
07/04/2012CN102544344A Composite phase-change three-dimensional light emitting diode (LED) heat radiator
07/04/2012CN102544343A Method for improving heat-dissipating performance of LED substrate
07/04/2012CN102544342A Heat radiator and electrode integrated heat radiating device and manufacturing method thereof
07/04/2012CN102544341A Light emitting device and illumination apparatus using same
07/04/2012CN102544340A Leadframe package with recessed cavity for led
07/04/2012CN102544339A SMD(surface mount device) type LED short-pitch lead frame
07/04/2012CN102544338A Lead frame of light-emitting diode
07/04/2012CN102544337A Encapsulation structure for improving luminous efficiency of light-emitting diode (LED) chip through utilizing concave lens-shaped transparent yttrium aluminum garnet (YAG) ceramics or crystals
07/04/2012CN102544336A Visible light full-spectrum high-reflectivity LED (light-emitting diode) packaging structure
07/04/2012CN102544335A Optoelectronic component and illumination device
07/04/2012CN102544334A Highly efficiently luminescent electroluminescent device
07/04/2012CN102544333A Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same
07/04/2012CN102544332A Semiconductor light emitting devices including flexible unitary film on aluminum nitride substrate
07/04/2012CN102544331A Light emitting device
07/04/2012CN102544330A 光学装置 Optical device
07/04/2012CN102544329A Wafer level light emitting diode encapsulation structure and manufacturing process thereof
07/04/2012CN102544328A LED encapsulation piece
07/04/2012CN102544327A White light LED (light emitting diode) and packaging process thereof
07/04/2012CN102544326A Phosphor with Ce3+/Ce3+, Li+ doped luminescent materials
07/04/2012CN102544325A Light emitting diode (LED) integrated module and method for manufacturing same
07/04/2012CN102544324A Semiconductor light source module
07/04/2012CN102544323A LED (light-emitting diode) fluorescent powder bearing device and packaging module implementing method
07/04/2012CN102544322A White light LED (light emitting diode) and packaging process thereof
07/04/2012CN102544321A Semiconductor luminescent device and production method thereof
07/04/2012CN102544320A Semiconductor luminescent device and production method thereof
07/04/2012CN102544319A LED bracket, LED and LED packaging technology
07/04/2012CN102544318A Light-emitting diode device
07/04/2012CN102544317A LED (light-emitting diode) luminescent device with positioning sleeve
07/04/2012CN102544316A Light-emitting diode (LED) integration packaging module
07/04/2012CN102544315A Light emitting diode (LED) package
07/04/2012CN102544314A Light emitting module and backlight unit using the same
07/04/2012CN102544313A Light-emitting diode lamp with low thermal resistance
07/04/2012CN102544312A Optical semiconductor device
07/04/2012CN102544311A Lighting device
07/04/2012CN102544310A Mounting substrate and manufacturing method thereof
07/04/2012CN102544309A Light emitting diode (LED) chip packaging structure with concave-mirror-shaped packaging base
07/04/2012CN102544308A Light-emitting diode module which is used for improving radiating efficiency and is provided with fluorescent layer
07/04/2012CN102544307A Light-emitting diode module used for improving heat radiation efficiency and provided with high-reflectivity material layer
07/04/2012CN102544306A Light-emitting diode module which is used for improving radiating efficiency and is provided with upright chip
07/04/2012CN102544305A Light-emitting diode module for improving heat radiation efficiency
07/04/2012CN102544304A Carrier, semiconductor package and manufacturing method for semiconductor package
07/04/2012CN102544303A Light-emitting diode packaging structure
07/04/2012CN102544302A Direct liquid cooling method for light emitting didoes and light emitting diode package utilizing method
07/04/2012CN102544301A Led封装结构 Led package structure
07/04/2012CN102544300A LED packaging structure
07/04/2012CN102544299A Light emitting diode chip and preparation method thereof
07/04/2012CN102544298A Deep-ultraviolet light emitting diode capable of effectively improving external quantum efficiency and method for preparing deep-ultraviolet light emitting diode
07/04/2012CN102544297A Light emitting device and method for fabricating the same
07/04/2012CN102544296A Manufacturing method for flip-chip LED (Light Emitting Diode) chip
07/04/2012CN102544295A High-light efficiency white light LED (Light-Emitting Diode) flip chip
07/04/2012CN102544294A LED (Light Emitting Diode) chip capable of improving current transmission
07/04/2012CN102544293A Light-emitting device and producing method thereof, forming method of transparent conductive film and electronic device
07/04/2012CN102544292A Light emitting device
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