Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
08/2012
08/28/2012US8251530 Light emitting device
08/28/2012US8251528 Wavelength conversion plate and light emitting device using the same
08/28/2012US8251520 Optical display systems and methods
08/23/2012WO2012112725A1 Defect-controlling structure for epitaxial growth, light emitting device containing defect-controlling structure, and method of forming the same
08/23/2012WO2012112666A2 Light emitting semiconductor device having multi-level substrate
08/23/2012WO2012112379A1 Light emitting diode (led) arrays including direct die attach and related assemblies
08/23/2012WO2012112362A1 Non-polar semiconductor light emission devices
08/23/2012WO2012112342A2 Method and apparatus for improved laser scribing of opto-electric devices
08/23/2012WO2012112310A1 Flexible light emitting semiconductor device having thin dielectric substrate
08/23/2012WO2012112073A1 Light-emitting diode source of white light with a remote phosphor converter
08/23/2012WO2012111884A1 Laminate substrate and method of fabricating the same
08/23/2012WO2012111765A1 Curable resin composition and colour conversion material using same
08/23/2012WO2012111641A1 Led substrate
08/23/2012WO2012111379A1 Semiconductor device and manufacturing method thereof
08/23/2012WO2012111292A1 Light emitting module and lighting device for vehicle
08/23/2012WO2012111041A1 Led lighting device
08/23/2012WO2012110994A1 An electro-optical device and method of manufacture
08/23/2012WO2012110695A1 Light source and light-source band
08/23/2012WO2012110365A1 Carrier substrate and method for producing semiconductor chips
08/23/2012WO2012110364A1 Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips
08/23/2012WO2012110147A1 Method for manufacturing at least one optoelectronic semiconductor device
08/23/2012WO2012109797A1 Photoelectric element and manufacturing method thereof
08/23/2012WO2012091329A3 Method for manufacturing light-emitting device and light-emitting device manufactured thereby
08/23/2012WO2012091325A3 Method for manufacturing light-emitting diode using nano-structures and light-emitting diode manufactured thereby
08/23/2012WO2012091275A8 Light-emitting diode and method for manufacturing same
08/23/2012WO2012067428A3 Group-iii nitride semiconductor light-emitting device
08/23/2012US20120214268 Group-iii nitride semiconductor laser device, and method for fabricating group-iii nitride semiconductor laser device
08/23/2012US20120214267 Roughening method and method for manufacturing light-emitting diode having roughened surface
08/23/2012US20120214266 Manufacturing method of nitride semiconductor light emitting elements
08/23/2012US20120214265 Method for forming coating film on facet of semiconductor optical device
08/23/2012US20120214264 Manufacturing method for led package
08/23/2012US20120214263 Fabrication System and Manufacturing Method of Light Emitting Device
08/23/2012US20120213465 Method for making polarization rotator and the polarization rotator made thereby
08/23/2012US20120213241 Broad Area Laser Having an Epitaxial Stack of Layers and Method for the Production Thereof
08/23/2012US20120212137 Led lamp and production method of the same
08/23/2012US20120211797 Heat-curable silicone resin composition for sealing optical semiconductors, and a sealed optical semiconductor using the same
08/23/2012US20120211796 Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same
08/23/2012US20120211795 Semiconductor light emitting device including substrate having protection layers and method for manufacturing the same
08/23/2012US20120211794 Light-emitting device
08/23/2012US20120211793 Low Temperature High Strength Metal Stack for Die Attachment
08/23/2012US20120211792 Package Substrate and Method for Forming the Same
08/23/2012US20120211791 LED Packaging Structure and Fabricating Method Thereof
08/23/2012US20120211790 Optical device for semiconductor based lamp
08/23/2012US20120211789 Light emitting device package
08/23/2012US20120211788 Semiconductor light-emitting device
08/23/2012US20120211787 Method for Fabricating a Semiconductor Component based on GaN
08/23/2012US20120211786 Led package structure with a wide optical field
08/23/2012US20120211785 High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink
08/23/2012US20120211784 Nitride semiconductor stacked structure and method for manufacturing same and nitride semiconductor device
08/23/2012US20120211783 Light-emitting-diode array with microstructures in gap between light-emitting-diodes
08/23/2012US20120211781 Light emitting device
08/23/2012US20120211780 Led package module
08/23/2012US20120211778 Led package for uniform color emission
08/23/2012US20120211774 Semiconductor light-emitting device and manufacturing method
08/23/2012US20120211773 Light-emitting devices comprising non-linear electrically protective material
08/23/2012US20120211772 Array substrate, display apparatus having the same and method of manufacturing the same
08/23/2012US20120211771 Led epitaxial structure and manufacturing method
08/23/2012US20120211766 Image display device and light emission device
08/23/2012US20120211753 Display substrate and method of manufacturing the display substrate
08/23/2012US20120211751 Display Apparatus and Method of Manufacturing the Same
08/23/2012US20120211750 Semiconductor device and light-emitting device using the same
08/23/2012US20120211746 Array substrate for display device and method of fabricating the same
08/23/2012US20120211727 Method of Producing Precision Vertical and Horizontal Layers in a Vertical Semiconductor Structure
08/23/2012US20120211725 Nitride semiconductor element and manufacturing method therefor
08/23/2012US20120211724 Semiconductor light emitting device and method for manufacturing same
08/23/2012DE112008004171T5 Verfahren zum Herstellen von Substraten für eine Baugruppe mit lichtemittierendem Element sowie Baugruppe mit lichtemittierendem Element unter Verwendung eines derartigen Substrats A method for manufacturing of substrates for an assembly with a light-emitting element assembly and with a light-emitting element using such a substrate
08/23/2012DE102011011862A1 Verfahren zur Herstellung einer Vielzahl optoelektronischer Halbleiterchips A process for the production of a variety of optoelectronic semiconductor chips
08/23/2012DE102011011861A1 Halbleiterchipgehäuseanordnung und Herstellungsverfahren A semiconductor chip package assembly and manufacturing processes
08/23/2012DE102011004508A1 Method for contacting LED chip for LED lamp, involves mechanically pressing electrically conductive contact surface of chip carrier to appropriate electrically conductive contact surface of LED chip
08/23/2012CA2827469A1 Light-emitting diode source of white light with a remote phosphor converter
08/23/2012CA2825418A1 Light source and light-source band
08/22/2012EP2490271A1 Light reflecting conductive particles, anisotropic conductive adhesive, and light emitting device
08/22/2012EP2490270A2 Light-Emitting Device Package and Method of Manufacturing the Same
08/22/2012EP2490269A1 Light-emitting device and method for manufacturing same
08/22/2012EP2490263A2 Optocoupler circuit
08/22/2012EP2490259A2 Light-Emitting Device Package and Method of Manufacturing the Same
08/22/2012EP2490258A2 Light emitting device
08/22/2012EP2489717A1 Illumination device
08/22/2012EP2489046A1 Transparent conductive porous nanocomposites and methods of fabrication thereof
08/22/2012EP1017113B1 Nitride semiconductor device
08/22/2012CN202396088U Metal core printed circuit board (MCPCB) with high heat conductivity
08/22/2012CN202395043U LED support
08/22/2012CN202395042U LED (light-emitting diode) chip with heat-dissipating device
08/22/2012CN202395041U Radiator
08/22/2012CN202395040U Light-emitting diode (LED) rubber matrix
08/22/2012CN202395039U LED packaging piece
08/22/2012CN202395038U Full-uniform light ray white light LED (light-emitting diode) device
08/22/2012CN202395037U LED packaging substrate and light source module employing same
08/22/2012CN202395036U LED (light-emitting diode) with cooling substrate device
08/22/2012CN202395035U Light emitting diode (LED) lamp with uniform aperture
08/22/2012CN202395034U LED lamp uniformly emitting light
08/22/2012CN202395033U Packaging structure of light-emitting diode
08/22/2012CN202395032U Wide-angle light-emitting diode
08/22/2012CN202395031U High-power LED support structure
08/22/2012CN202395030U Thermoelectric separated surface mount device (SMD) light-emitting diode (LED) lamp support
08/22/2012CN202395029U Light-emitting diode (LED)
08/22/2012CN202395028U Photo-cured LED packaging structure
08/22/2012CN202395027U LED (light-emitting diode)
08/22/2012CN202395026U LED substrate and LED
08/22/2012CN202395025U Substrate