Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
07/2012
07/19/2012US20120181555 Light-emitting device package and method of manufacturing the same
07/19/2012US20120181554 Multicolored mask process for making display circuitry
07/19/2012US20120181546 Light-emitting diode
07/19/2012US20120181542 Thin Film Transistor Array Substrate
07/19/2012US20120181540 Light Emitting Device
07/19/2012US20120181531 Semiconductor element and manufacturing method of the same
07/19/2012US20120181504 Semiconductor light emitting device and method for manufacturing same
07/19/2012US20120181503 Method of Fabricating Silicon Quantum Dot Layer and Device Manufactured Using the Same
07/19/2012US20120181438 Radiation detecting apparatus, radiation detecting system, and method of manufacturing radiation detecting apparatus
07/19/2012DE202012005454U1 Schnellmessgerät zur Kontrolle der thermischen Ankopplung von LED's und/oder LED Baugruppen an deren Kühlflächen Quick measuring device to control the thermal coupling of LEDs and / or LED assemblies to their cooling surfaces
07/19/2012DE102011008477A1 Halbleiter, Leuchtiode und Laseriode Semiconductor light emitting diode and Laseriode
07/18/2012EP2477245A2 Light emitting diode package
07/18/2012EP2477244A2 Wafer level light-emitting device package and method of manufacturing the same
07/18/2012EP2477243A1 Reflector for light-emitting device, and light-emitting device
07/18/2012EP2477242A2 Light-emitting device package and method of manufacturing the same
07/18/2012EP2477241A2 Method and Apparatus for Depositing Phosphor on Semiconductor Light-Emitting Device
07/18/2012EP2477240A1 Illumination device
07/18/2012EP2477239A2 Semiconductor light emitting device
07/18/2012EP2477238A1 Semiconductor light emitting element
07/18/2012EP2477237A1 Group-iii nitride crystal substrate, group-iii nitride crystal substrate with epitaxial layer, semiconductor device, and method for manufacturing same
07/18/2012EP2477236A1 Nitride semiconductor multilayer structure, method for producing same, and nitride semiconductor light-emitting element
07/18/2012EP2477229A2 Composite transparent conductors and method of forming the same
07/18/2012EP2476145A1 Phosphor-converted light emitting diode device
07/18/2012EP2476144A1 Iii-nitride light emitting device with curvature control layer
07/18/2012EP2476134A1 A method for reducing internal mechanical stresses in a semiconductor structure and a low mechanical stress semiconductor structure
07/18/2012CN202339917U 一种大功率高出光效率的集成封装led光源 One kind of higher power efficiency of the integrated package led light source
07/18/2012CN202339916U 一种新型top led支架及由其制造的led器件 A new top led led stents and devices fabricated therefrom
07/18/2012CN1988187B Light emitting diode
07/18/2012CN1962798B Epoxy resin adhesive composition and optical semiconductor adhesive adopting same
07/18/2012CN102598869A Lighting device, and headlight lighting device, headlight, and vehicle using same
07/18/2012CN102598852A Light emitting element, light source device, and projection display device
07/18/2012CN102598327A Optoelectronic component and method for producing an opto-electronic component
07/18/2012CN102598326A Unsaturated polyester resin composition for use in led reflector, and led reflector and led luminaire using said composition
07/18/2012CN102598325A Illumination Device And Image-reading Device Provided With Illumination Device
07/18/2012CN102598324A Substrate for mounting light-emitting element and method for producing same
07/18/2012CN102598323A Substrate for mounting light emitting element, method for producing same, and light emitting device
07/18/2012CN102598322A Light emitting device and method for manufacturing same
07/18/2012CN102598321A Light-emitting device
07/18/2012CN102598320A Nitride semiconductor element and manufacturing method therefor
07/18/2012CN102598319A Light emitting diode, light emitting diode lamp, and illuminating apparatus
07/18/2012CN102598318A Light emitting diode, light emitting diode lamp and lighting device
07/18/2012CN102598317A High-quality nonpolar or semipolar semiconductor device on porous nitride semiconductor and fabrication method thereof
07/18/2012CN102598316A Nitride semiconductor element and process for production thereof
07/18/2012CN102598315A Circuit and method for driving led string for backlight, and backlight and display device using the circuit
07/18/2012CN102598314A Superluminescent diodes by crystallographic etching
07/18/2012CN102598313A Lighting devices, an optical component for a lighting device, and methods
07/18/2012CN102598288A Method for producing a housing with a component in a hollow space, corresponding housing, method for producing a semi-finished product, and semi-finished product
07/18/2012CN102598236A Adhesive composition
07/18/2012CN102598207A Techniques for achieving low resistance contacts to nonpolar and semipolar p-type (al,ga,i)n
07/18/2012CN102597619A Large led lighting apparatus
07/18/2012CN102597602A Horticultural LED lighting assembly
07/18/2012CN102597042A Curable resin composition for optical semiconductor encapsulation, and cured product of same
07/18/2012CN102595788A Three-dimensional metal-based Printed Circuit Board (PCB) assembly structure, corresponding light-emitting lamp and manufacturing method
07/18/2012CN102595783A Novel LED circuit board and method
07/18/2012CN102593340A White light LED luminescence apparatus
07/18/2012CN102593339A Chip packaging
07/18/2012CN102593338A Thin high-thermal-conductivity metal substrate and production method thereof
07/18/2012CN102593337A High-reliability integrated packaging LED (light-emitting diode) chip
07/18/2012CN102593336A Light-emitting device package and method of manufacturing the same
07/18/2012CN102593335A Light emitting diode package
07/18/2012CN102593334A Light-emitting diode lamp with an improved leadframe
07/18/2012CN102593333A Light-emitting device package and method of manufacturing the same
07/18/2012CN102593332A LED (light-emitting diode) luminescent device and manufacturing method thereof
07/18/2012CN102593331A Light emitting diode (LED) light source
07/18/2012CN102593330A Light-emitting device package
07/18/2012CN102593329A High light efficiency LED (light-emitting diode) packaging silica gel formula
07/18/2012CN102593328A Encapsulant profile for light emitting diodes
07/18/2012CN102593327A Inverted packaging technology for wafer-level LED
07/18/2012CN102593326A Light-emitting diode (LED) packaging structure and process based on fluorescent powder dispersive excitation technology
07/18/2012CN102593325A LED light source module packaging structure
07/18/2012CN102593324A Light-emitting diode (LED) base capable of being integrated with other light sources
07/18/2012CN102593323A LED (light-emitting diode) surface light source packaging piece
07/18/2012CN102593322A Cofferdam for coating fluorescent powder layer of LED (Light-Emitting Diode) chip and manufacturing method and application thereof
07/18/2012CN102593321A LED (light emitting diode) packaging method, LED packaging structure and display screen
07/18/2012CN102593320A Light emitting diode (LED) light source and packaging method thereof
07/18/2012CN102593319A LED packaging method
07/18/2012CN102593318A Light-emitting diode (LED) luminescent device
07/18/2012CN102593317A High-power high-brightness light-emitting diode (LED) light source packaging structure and packaging method thereof
07/18/2012CN102593316A Wafer level light-emitting device package and method of manufacturing the same
07/18/2012CN102593315A Led package
07/18/2012CN102593314A Heat dissipation substrate
07/18/2012CN102593313A Packaging substrate and manufacturing method thereof
07/18/2012CN102593312A Packaging structure of light-emitting diode (LED)
07/18/2012CN102593311A Light source packaging structure and manufacturing method thereof as well as liquid crystal display
07/18/2012CN102593310A Wafer-type luminous device having wavelength conversion layer coated precisely
07/18/2012CN102593309A Chip type light-emitting device and packaging structure thereof
07/18/2012CN102593308A Light emitting diode package structure
07/18/2012CN102593307A Light emitting diode optical reflection structure
07/18/2012CN102593306A Light emitting diode crystal grain, manufacture method thereof and light emitting diode packaging structure
07/18/2012CN102593305A Metal periodic subwavelength structure on surface of light-emitting diode (LED) and preparation method for metal periodic subwavelength structure
07/18/2012CN102593304A High-power light-emitting diode (LED) light using ceramic for radiating
07/18/2012CN102593303A Light-emitting element with embolisms
07/18/2012CN102593302A Light-emitting diode crystal grain, manufacture method of the light-emitting diode crystal grain and light-emitting diode packaging structure
07/18/2012CN102593301A Light emitting diode with coarsened side surface and manufacturing method thereof
07/18/2012CN102593300A Light emitting diode and method for manufacture of the same
07/18/2012CN102593299A Solid-state light-emitting element with mesh channel and method for manufacturing the same
07/18/2012CN102593298A Luminescent device
07/18/2012CN102593297A A method for manufacturing semiconductor light emitting device
07/18/2012CN102593296A Semiconductor light emitting device
07/18/2012CN102593295A Light emitting element