Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
08/2012
08/16/2012DE102011011043A1 Halbleiterschicht oder Halbleiterschichtsystem mit einer semipolaren oder m-planaren Gruppe-III-Nitrid Schicht oder einem Schichtsystem und ein darauf basierendes Halbleiterbauelement Semi-conductor layer or semiconductor layer system with a semi-polar or m-planar group III-nitride layer or a layer system, and based thereon a semiconductor device
08/16/2012DE102011010895A1 Leuchtdiodenmodul Light emitting diode module
08/16/2012DE102011003989A1 Lighting device i.e. LED module, has encapsulation chamber encapsulating semiconductor light source, and film-shaped optic element applied on free-surface of encapsulation chamber that consists of casting material such as silicone
08/16/2012DE102011003988A1 Lighting device has transparent light guidance portion provided in respective emitter area of semiconductor light source such as LED
08/16/2012DE102011003969A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component
08/16/2012CA2864212A1 High efficiency broadband semiconductor nanowire devices and methods of fabricating without foreign metal catalysis
08/16/2012CA2864136A1 Flat led lamp assembly
08/15/2012EP2487730A2 Flip chip LED package and manufacturing method thereof
08/15/2012EP2487729A1 Led and manufacturing method thereof and luminescent device
08/15/2012EP2487404A1 Light source module and electronic apparatus provided with same
08/15/2012EP2487218A1 Polymeric matrix with organic phosphor and manufactory thereof
08/15/2012EP2486605A1 Lens for asymetrical light beam generation.
08/15/2012EP2486604A1 Contacting an optoelectronic semiconductor component through a conversion element and corresponding optoelectronic semiconductor component
08/15/2012EP2486393A2 Optical detection system having an active substrate and method for manufacturing such a system
08/15/2012EP2295846B1 Lighting device and liquid crystal display device
08/15/2012EP2290710B1 Compound semiconductor light emitting element, illuminating apparatus using compound semiconductor light emitting element, and method for manufacturing compound semiconductor light emitting element
08/15/2012EP1790017B1 Nitride semiconductor light emitting device and fabrication method thereof
08/15/2012EP1690301B1 Methods of processing semiconductor wafer backsides having light emitting diodes (leds) thereon
08/15/2012EP1490453B1 Tri-color white light led lamp
08/15/2012EP1421428B1 Solid-state light source
08/15/2012EP1377438B1 Preparation of nanocrystallites
08/15/2012EP1034571B1 Highly luminescent color-selective materials
08/15/2012CN202384402U Multi-chip integrated packaging LED
08/15/2012CN202384401U Positioning device for embedding LED heat dissipation module
08/15/2012CN202384400U Liquid cooling light-emitting device
08/15/2012CN202384399U Patch type LED (light emitting diode)support of metallic reflection cavity body
08/15/2012CN202384398U Semiconductor light-emitting device
08/15/2012CN202384397U Outdoor light emitting diode
08/15/2012CN202384396U Base plate for LED
08/15/2012CN202384395U Potting adhesive power type light-emitting diode (LED)
08/15/2012CN202384394U Heat-dissipation ceramic substrate capable of improving light-emitting diode (LED) luminous efficiency
08/15/2012CN202384393U Improved LED (light-emitting diode) transmitting support
08/15/2012CN202384392U LED bracket for surface mount and LED light source
08/15/2012CN202384391U Large power LED package silica gel
08/15/2012CN202384390U Light-emitting diode (LED) with high current extraction efficiency
08/15/2012CN202384389U Uniform light-emitting diode (LED)
08/15/2012CN202384388U LED support sheet collecting machine
08/15/2012CN202384387U All-in-one machine for blank-pressing and capping LED lamp
08/15/2012CN202384338U COB (chip on board) integrated package LED with high color rendering index and high reliability
08/15/2012CN202384337U LED (light-emitting diode) packaging structure for improving light efficiency softened illumination
08/15/2012CN202384336U Light-emitting diode (LED) light source module
08/15/2012CN202384335U White light LED (light-emitting diode) plane light source with oxynitride fluorescent powder luminescent layers
08/15/2012CN202384334U Paster type LED support and lamp bead
08/15/2012CN202384333U Paster type large-power LED lamp bead
08/15/2012CN202384332U High power light emitting diode apparatus having metal substrate
08/15/2012CN202384331U Light mixing LED packaging structure
08/15/2012CN102640313A Light-emitting diode and method for producing same
08/15/2012CN102640312A Led package manufacturing system
08/15/2012CN102640311A Substrate for LED mounting
08/15/2012CN102640310A Substrate for light-emitting elements and light-emitting device
08/15/2012CN102640309A Backlight device, and liquid crystal display device using backlight device, and light-emitting diode used in same
08/15/2012CN102640308A Backlight device, liquid crystal display device using backlight device, and light emitting diode used for backlight device and liquid crystal display device
08/15/2012CN102640307A Method for manufacturing a semiconductor substrate and method for manufacturing a light-emitting device
08/15/2012CN102640306A Led驱动电路 Led drive circuit
08/15/2012CN102640303A Method of bonding using a bonding layer based on zinc, silicon and oxygen and corresponding structures
08/15/2012CN102640284A Substrate for mounting element, and method for manufacturing the substrate
08/15/2012CN102640259A Forming a compound-nitride structure that includes a nucleation layer
08/15/2012CN102640258A Method of manufacturing nitride semiconductor device
08/15/2012CN102640048A Illumination device and projection display device using same
08/15/2012CN102639932A Light module system
08/15/2012CN102639928A Indirect lighting apparatus
08/15/2012CN102639926A Illumination device, and display device
08/15/2012CN102639672A Beta-sialon, method for producing same and light-emitting device using same
08/15/2012CN102639643A Sealant for optical semiconductors and optical semiconductor device
08/15/2012CN102639281A Method and device for a laser lift-off method having a beam splitter
08/15/2012CN102638926A High-voltage alternating-current LED (light-emitting diode) lamp based on full-bridge topological packaging structure
08/15/2012CN102637816A Light emitting diode (LED) semiconductor heat radiation support frame
08/15/2012CN102637815A High-heat-conduction LTCC (low temperature co-fired ceramic) substrate
08/15/2012CN102637814A Light-emitting diode assembly structure and manufacturing method thereof
08/15/2012CN102637813A LED (light-emitting diode) packaging structure and LED lamp using same
08/15/2012CN102637812A Light emitting device package and manufacturing method thereof
08/15/2012CN102637811A Flip chip led package and manufacturing method thereof
08/15/2012CN102637810A LED (light-emitting diode) packaging structure and packaging molding method
08/15/2012CN102637809A Light-emitting diode package device and method for making the same
08/15/2012CN102637808A White LED (light-emitting diode) encapsulation structure
08/15/2012CN102637807A Improved white light LED (Light Emitting Diode) device
08/15/2012CN102637806A Dispensing method applicable to flip chip
08/15/2012CN102637805A UV (ultraviolet) silica gel packaged LED (light-emitting diode) and packaging technology thereof
08/15/2012CN102637804A Inversion structure for bonding-free LED (Light Emitting Diode) chip
08/15/2012CN102637803A Production process of LED (Light-Emitting Diode) white light bead
08/15/2012CN102637802A Semiconductor light-emitting device and manufacturing method
08/15/2012CN102637801A Light-emitting diode
08/15/2012CN102637800A Light emitting diode with nanostructures and method of making the same
08/15/2012CN102637799A Light emitting diode (LED) chip structure
08/15/2012CN102637798A Light emitting diode (LED) structure and manufacture method of LED structure
08/15/2012CN102637797A Light-emitting diode structure and luminosity control method thereof
08/15/2012CN102637796A LED (light-emitting diode) chip with P-type AlGaN layer structure and preparation method thereof
08/15/2012CN102637795A Group iii nitride semiconductor light-emitting device and production method therefor
08/15/2012CN102637794A Semiconductor devices and methods of manufacturing the same
08/15/2012CN102637793A III-nitride semiconductor ultraviolet light emitting diode
08/15/2012CN102637792A Method for preparing fluorescent powder prefabricated thin film for white-light LED (Light-Emitting Diode)
08/15/2012CN102637791A GaN epitaxial wafer structure based on AlN ceramic substrate and preparation method thereof
08/15/2012CN102637790A LED (light emitting diode) chip and corresponding manufacturing method thereof
08/15/2012CN102637789A Wafer-level LED (light-emitting diode) tube core overall integrating and packaging device
08/15/2012CN102637788A Semiconductor wafer and semiconductor device
08/15/2012CN102637787A Method for uninterrupted growth of high-quality InGaN/GaN multi-quantum well (MQW)
08/15/2012CN102637786A Method for preparing LED (light-emitting diode) electrode taking ITO/ZnO based composite film as p electrode
08/15/2012CN102637785A Die-bonding method for increasing color-rendering index of light emitting diode
08/15/2012CN102637784A Light emitting diode packaging substrate and method of forming light emitting diode packaging substrate
08/15/2012CN102637783A White-light emitting diode with vertical structure and manufacturing method thereof
1 ... 267 268 269 270 271 272 273 274 275 276 277 278 279 280 281 282 283 284 285 286 287 ... 994