| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 07/11/2012 | CN202332960U 一种大功率led注胶托架 One kind of power led dispensing tray |
| 07/11/2012 | CN202332959U 一种led One kind of led |
| 07/11/2012 | CN202332958U Led照明灯封装结构 Led lighting package |
| 07/11/2012 | CN202332957U 一种具有散热功能的户外led光源的封装结构 Package having a cooling function of outdoor led light source |
| 07/11/2012 | CN202332956U 一种集成封装的大功率led装置 An integrated package of high power led unit |
| 07/11/2012 | CN202332955U 一种新型led贴片支架 A new SMD led bracket |
| 07/11/2012 | CN202332954U Antistatic LED (light emitting diode) packaging structure |
| 07/11/2012 | CN202332953U 改进的二次透镜式led封装结构 Improved secondary lens-type structure led package |
| 07/11/2012 | CN202332952U Led循环散热器 Led loop radiator |
| 07/11/2012 | CN202332951U 一种功率型led A power type led |
| 07/11/2012 | CN202332950U 一种出光效果均匀的大功率led封装结构 A light effect uniform package structure of power led |
| 07/11/2012 | CN202332949U 浇注式led封装板 Guss led packaging board |
| 07/11/2012 | CN202332948U 一种带热沉孔的led封装结构 Led a package with heat sink hole |
| 07/11/2012 | CN202332947U 具粗糙面的表面粘着型发光二极体 With the rough surface of surface mount light-emitting diode |
| 07/11/2012 | CN202332946U 一种新型led发光管发射架 A new kind of led light tube launchers |
| 07/11/2012 | CN202332945U 一种用于安置led晶片的散热支架 Cooling Stand for placement led wafer |
| 07/11/2012 | CN202332944U 一种大功率芯片 One kind of high-power chips |
| 07/11/2012 | CN202332943U 新操作流程的贴片式led的全自动固晶机 The new operational processes automatic SMD led Bonder |
| 07/11/2012 | CN202332853U 大功率倒装阵列led芯片 High power led chip array flip |
| 07/11/2012 | CN202332846U Led与散热装置的结合总成 Led combined with the heat sink assembly |
| 07/11/2012 | CN202332845U 高光效led平面光源 High efficiency led flat light source |
| 07/11/2012 | CN202332187U 一种图形化led集成封装结构 A graphical led integrated package structure |
| 07/11/2012 | CN202328090U 大功率led封装散热一体式光源器件 Integrated package thermal power led light source device |
| 07/11/2012 | CN202328033U 有反光装置的led封装板 Reflective devices led packaging board |
| 07/11/2012 | CN202327777U Led灯条 Led light bar |
| 07/11/2012 | CN202327737U LED lamp |
| 07/11/2012 | CN202327728U 一种高显色大功率白光led灯具 A high-power white color led lighting |
| 07/11/2012 | CN202318284U 一种led封装工作台的台面护栏 One kind of led package workbench tops fence |
| 07/11/2012 | CN1901241B Method of manufacturing light emitting device |
| 07/11/2012 | CN1851791B 显示设备及其驱动方法 Display device and driving method |
| 07/11/2012 | CN1835256B Semiconductor composite apparatus,led,led printing head and imaging device |
| 07/11/2012 | CN102577635A Light-source module and light-emitting device |
| 07/11/2012 | CN102576798A Light reflecting conductive particles, anisotropic conductive adhesive, and light emitting device |
| 07/11/2012 | CN102576797A Lens for asymmetrical light beam generation |
| 07/11/2012 | CN102576795A Light source device, electronic image acquisition apparatus, electronic image observation apparatus, endoscope apparatus, and capsule endoscope apparatus |
| 07/11/2012 | CN102576794A Wavelength conversion particle, wavelength conversion member using same, and light emitting device |
| 07/11/2012 | CN102576793A Phosphor-converted light emitting diode device |
| 07/11/2012 | CN102576792A Light emitting element and image display device using the light emitting element |
| 07/11/2012 | CN102576791A Light emitting element and image display device using the light emitting element |
| 07/11/2012 | CN102576790A Optoelectronic component |
| 07/11/2012 | CN102576789A Wafer level packaging of electronic devices |
| 07/11/2012 | CN102576788A Optoelectronic component |
| 07/11/2012 | CN102576787A Iii nitride semiconductor substrate, epitaxial substrate, and semiconductor device |
| 07/11/2012 | CN102576786A Gallium nitride compound semiconductor light-emitting device |
| 07/11/2012 | CN102576785A Electrically pumped optoelectronic semiconductor chip |
| 07/11/2012 | CN102576784A Light emitting element and projection display device provided with same |
| 07/11/2012 | CN102576783A Pixelated led |
| 07/11/2012 | CN102576782A Light-emitting diode having an interlayer with a high voltage density, and method for manufacturing same |
| 07/11/2012 | CN102576781A Metal substrate for light emitting diode, light emitting diode, and method for manufacturing light emitting diode |
| 07/11/2012 | CN102576780A High-quality non-polar/semi-polar semiconductor element on an unevenly patterned substrate and a production method therefor |
| 07/11/2012 | CN102576779A Substrate structure including functional region and method for transferring functional region |
| 07/11/2012 | CN102576707A Optoelectronic module |
| 07/11/2012 | CN102576684A Semiconductor device and method for manufacturing same |
| 07/11/2012 | CN102576663A A method of forming a Group III-nitride crystalline film on a patterned substrate by hydride vapor phase epitaxy (HVPE) |
| 07/11/2012 | CN102576656A Method for producing a light-emitting diode |
| 07/11/2012 | CN102575830A Optical system for a light emitting diode with collection, conduction, phosphor directing, and output means |
| 07/11/2012 | CN102575341A Thin film, method for forming same, and semiconductor light-emitting element comprising the thin film |
| 07/11/2012 | CN102575161A Fluorescent substance, process for producing same, and luminescent device including same |
| 07/11/2012 | CN102569627A Copper substrate used for LED light source, LED light source module and preparation method thereof, and LED street lamp |
| 07/11/2012 | CN102569626A Multichip integrated packaged light emitting diode (LED) |
| 07/11/2012 | CN102569625A Copper line-clad aluminum silicon carbide ceramic substrate applicable to radiation of high-power LED |
| 07/11/2012 | CN102569624A Heat-radiating substrate and manufacturing method thereof |
| 07/11/2012 | CN102569623A Semiconductor light-emitting chip and manufacturing method thereof |
| 07/11/2012 | CN102569622A Semiconductor luminescence chip and manufacturing method thereof |
| 07/11/2012 | CN102569621A LED light source capable of achieving miniaturization |
| 07/11/2012 | CN102569620A Semiconductor package and method of manufacturing the same |
| 07/11/2012 | CN102569619A Method for making chip-on-board (COB) light source |
| 07/11/2012 | CN102569618A Reflective film and method of manufacturing the same |
| 07/11/2012 | CN102569617A LED encapsulation structure |
| 07/11/2012 | CN102569616A Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips |
| 07/11/2012 | CN102569615A Free-form surface lens and method of realizing shape-preserving coating for same |
| 07/11/2012 | CN102569614A Encapsulation material and electronic device prepared using the same |
| 07/11/2012 | CN102569613A Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| 07/11/2012 | CN102569612A Light emitting diode package and method for manufacturing same |
| 07/11/2012 | CN102569611A Method for coating surface of horizontal-structure wafer of LED with fluorescent glue |
| 07/11/2012 | CN102569610A Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
| 07/11/2012 | CN102569609A Light-emitting Device |
| 07/11/2012 | CN102569608A Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device |
| 07/11/2012 | CN102569607A Phosphor plate and lighting device |
| 07/11/2012 | CN102569606A Method for packaging light emitting diode of wafer-level vertical structure |
| 07/11/2012 | CN102569605A Chip light-emitting diode (LED) ceramic packaging base |
| 07/11/2012 | CN102569604A Hidden pin high-power LED (light-emitting diode) bracket and packaging structure and packaging process thereof |
| 07/11/2012 | CN102569603A Light emitting diode (LED) ceramic substrate and production method thereof |
| 07/11/2012 | CN102569602A Graphite light-emitting diode (LED) device |
| 07/11/2012 | CN102569601A Power type white-light LED (Light Emitting Diode) light source device with full uniform light |
| 07/11/2012 | CN102569600A LED (light emitting diode) packaging structure and reflection cup thereof |
| 07/11/2012 | CN102569599A Wafer-level LED (light emitting diode) lens packaging structure and method |
| 07/11/2012 | CN102569598A Insulating substrate, method for manufacturing the substrate, optical module utilizing the substrate and liquid crystal display device utilizing the substrate |
| 07/11/2012 | CN102569597A LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base |
| 07/11/2012 | CN102569596A Light-emitting diode module |
| 07/11/2012 | CN102569595A Packaging structure of light-emitting diode |
| 07/11/2012 | CN102569594A Package carrier and light emitting diode package structure using same |
| 07/11/2012 | CN102569593A Led |
| 07/11/2012 | CN102569592A LED packaging method, LED and LED illuminator |
| 07/11/2012 | CN102569591A High-power LED (light emitting diode) packaging structure |
| 07/11/2012 | CN102569590A Light emitting device, light emitting device package and lighting system |
| 07/11/2012 | CN102569589A Semiconductor light emitting element |
| 07/11/2012 | CN102569588A Light-emitting diode capable of being increased in light extraction efficiency and manufacturing method thereof |
| 07/11/2012 | CN102569587A Light emitting semiconductor device possessing laminated transparent electrode |
| 07/11/2012 | CN102569586A Integral-face press-fit type inverted LED (Light Emitting Diode) and manufacturing method thereof |