Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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07/11/2012 | CN102569585A LED chip |
07/11/2012 | CN102569584A Method for manufacturing ohmic contact electrode with improved optical performance |
07/11/2012 | CN102569583A Light emitting device based on ceramic substrate and manufacturing method for light emitting device |
07/11/2012 | CN102569582A Light-emitting diode structure and method for manufacturing the same |
07/11/2012 | CN102569581A LED chip structure with overlapped electrodes |
07/11/2012 | CN102569580A Light emitting diode structure |
07/11/2012 | CN102569579A Light-emitting diode device |
07/11/2012 | CN102569578A Semiconductor light emitting element |
07/11/2012 | CN102569577A Light-emitting diode with improved light-emitting efficiency and preparation method thereof |
07/11/2012 | CN102569576A III-Nitride Light Emitting Devices Grown on Templates to Reduce Strain |
07/11/2012 | CN102569575A Light-emitting diode chip structure |
07/11/2012 | CN102569574A Light-emitting device and method of manufacturing the same |
07/11/2012 | CN102569573A LED chip for improving heat conduction |
07/11/2012 | CN102569572A Reflective coating for a high bright light emitting diode |
07/11/2012 | CN102569571A 半导体发光二极管及其制造方法 The method of manufacturing a semiconductor light emitting diode and |
07/11/2012 | CN102569570A Near-infrared inorganic quantum dot electroluminescent device and manufacturing method thereof |
07/11/2012 | CN102569569A Light emitting device |
07/11/2012 | CN102569568A LED epitaxial structure and processing procedure |
07/11/2012 | CN102569567A Method for growing nitride light-emitting diode (LED) epitaxial structure |
07/11/2012 | CN102569566A Method for vertical packaging of gallium nitride-based LED (Light Emitting Diode) chip |
07/11/2012 | CN102569565A Spot testing method for light emitting diode chip |
07/11/2012 | CN102569564A Deposition method of SiOx passive film and LED (light emitting diode) chip with passive film |
07/11/2012 | CN102569563A Wafer level packaging method of light emitting diode with adjustable lens focus |
07/11/2012 | CN102569562A LED (Light-Emitting Diode) packaging method |
07/11/2012 | CN102569561A Method for producing multi-group and multi-section LED (Light-Emitting Diode) |
07/11/2012 | CN102569560A Semiconductor light emitting device and fabrication method thereof |
07/11/2012 | CN102569559A Method for manufacturing light-emitting element array |
07/11/2012 | CN102569558A Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application |
07/11/2012 | CN102569557A Method for manufacturing electronic device, method for manufacturing epitaxial substrate, iii nitride semiconductor element and gallium nitride epitaxial substrate |
07/11/2012 | CN102569556A LED with high-conductivity n-type ohmic contact and manufacturing method thereof |
07/11/2012 | CN102569555A Material receiving machine of LED (light-emitting diode) bracket sheet |
07/11/2012 | CN102569554A Leveling device for light-emitting diode (LED) supports |
07/11/2012 | CN102569553A Packaging technology for LED (light-emitting diode) |
07/11/2012 | CN102569552A Production process of LED (light-emitting diode) packaging bracket and glue injection mould |
07/11/2012 | CN102569551A Epitaxial structure having etching-stop layer and method for fabricating an epitaxial structure |
07/11/2012 | CN102569550A Semiconductor laser device |
07/11/2012 | CN102569549A Semiconductor light-emitting device measurement apparatus |
07/11/2012 | CN102569548A Semiconductor surface roughening method |
07/11/2012 | CN102569547A Vertical light emitting diode (VLED) die and method of fabrication |
07/11/2012 | CN102569546A Die structure, manufacturing method and substrate thereof |
07/11/2012 | CN102569545A Light emitting diode wafer jointing method, chip manufacturing method and wafer jointing structure |
07/11/2012 | CN102569544A Method for manufacturing individual light-emitting diodes |
07/11/2012 | CN102569543A Manufacture method of light emitting diode chips |
07/11/2012 | CN102569542A Packaging process for light emitting diode (LED) light source |
07/11/2012 | CN102569541A Manufacturing method of semiconductor luminous chip |
07/11/2012 | CN102569540A Manufacturing method for light emitting diode package structure |
07/11/2012 | CN102569539A Design method of special LED (Light-Emitting Diode) radiating device |
07/11/2012 | CN102569538A Stripping method for use during manufacturing of light-emitting diode chip electrode |
07/11/2012 | CN102569537A Method for manufacturing light emitting diode chip with vertical structure |
07/11/2012 | CN102569536A Method for manufacturing encapsulation structure for light-emitting diode |
07/11/2012 | CN102569535A Method for manufacturing encapsulation structure for light-emitting diode |
07/11/2012 | CN102569516A Method for preparing p-CdS nano wire and p-CdS/n-Si nano p-n node through manganese trioxide (MoO3) surface doping |
07/11/2012 | CN102569365A Semiconductor structures and method for fabricating the same |
07/11/2012 | CN102569352A Nitride-based semiconductor device taking sapphire as substrate |
07/11/2012 | CN102569330A Light-emitting diode with electrostatic protection and preparation method thereof |
07/11/2012 | CN102569284A Novel light-emitting diode (LED) light-emitting chip and LED lamp formed by assembling LED light-emitting chips |
07/11/2012 | CN102569283A Light-emitting diode |
07/11/2012 | CN102569282A Light and color adjustable light-emitting diode (LED) structure |
07/11/2012 | CN102569281A Integratedly-packaged LED bracket |
07/11/2012 | CN102569280A Light emitting device and method for manufacturing the same |
07/11/2012 | CN102569279A LED (light-emitting diode) with improved color rendering index and light emitting efficiency and method for improving color rendering index and light emitting efficiency of LED |
07/11/2012 | CN102569278A Light emitting device and illumination device |
07/11/2012 | CN102569277A LED package and manufacturing method thereof |
07/11/2012 | CN102569273A Surface mountable devices and methods for manufacturing the same |
07/11/2012 | CN102569224A Circuit carrier with high heat dissipation performance and related circuit modules |
07/11/2012 | CN102569100A Method for producing heat dissipation mass of semiconductor device |
07/11/2012 | CN102569043A Method of manufacturing light emitting diode |
07/11/2012 | CN102569028A Epitaxial structure having a sacrificial layer and method for making the same |
07/11/2012 | CN102569025A Epitaxial substrate, semiconductor light emitting element using the same and manufacturing process |
07/11/2012 | CN102569018A Manufacturing method of semiconductor element |
07/11/2012 | CN102563557A Encapsulation method used for strip light |
07/11/2012 | CN102563542A LED light source comprising COC (cyclic olefin copolymer) optical filter |
07/11/2012 | CN102563405A A lighting device comprising photoluminescent plate |
07/11/2012 | CN102559187A Yellow fluorosulfide phosphors for light-emitting diode and preparation method thereof |
07/11/2012 | CN102559185A Yellow luminescent material with voelckerite structure and preparation method thereof as well as white light-emitting diode device |
07/11/2012 | CN102559180A Photoluminescent crystal material bismuth-europium tungstate and preparation method for same |
07/11/2012 | CN102559176A Fluorescent conversion body, a conversion body preparing method and LED (light-emitting diode) made of fluorescent conversion body |
07/11/2012 | CN102559173A Core-surface gradient nitrogen oxide fluorescent powder, preparation method thereof and luminescent device using fluorescent powder |
07/11/2012 | CN102558872A Curable organopolysiloxane composition and method for manufacturing the same |
07/11/2012 | CN102558506A Epoxy resin for encapsulating LED luminous body |
07/11/2012 | CN102558502A Epoxy resin with adjustable thermal degradation temperature and preparation method thereof |
07/11/2012 | CN102554488A High-heat-conductivity solder paste for LED (light-emitting diode) packaging |
07/11/2012 | CN102554482A Method for welding components in groove |
07/11/2012 | CN102231377B High color rendering light emitting diode and manufacture method thereof |
07/11/2012 | CN102097549B Chip scale integration packaging process and light emitting diode (LED) device |
07/11/2012 | CN102005447B LED (Light Emitting Diode) integrated structure with cooler |
07/11/2012 | CN101958383B Manufacturing method of inversed AlGaInP light emitting diode |
07/11/2012 | CN101933169B Semiconductor light emitting device comprising heterojunction |
07/11/2012 | CN101933144B A light emitting device |
07/11/2012 | CN101807632B Light emitting diode package |
07/11/2012 | CN101749553B Packaging module of low-power light emitting diode (LED) luminescent chip |
07/11/2012 | CN101660206B Preparation method of integral GaN-based film |
07/11/2012 | CN101617411B Lighting device and lighting method |
07/11/2012 | CN101555405B Adjustable photochromic phosphor powder, phosphor thin film, preparation method and application thereof |
07/11/2012 | CN101494036B 液晶显示装置 The liquid crystal display device |
07/11/2012 | CN101472370B Pulse signal delay circuit and led drive circuit |
07/11/2012 | CN101132950B Led headlamp system |
07/10/2012 | US8217568 Light emitting element and light emitting device using the light emitting element |
07/10/2012 | US8217558 Apparatus for regulating the temperature of a light emitting diode |
07/10/2012 | US8217498 Gallium nitride semiconductor device on SOI and process for making same |