| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 07/04/2012 | CN102544291A Semiconductor luminous chip and manufacturing method thereof |
| 07/04/2012 | CN102544290A Nitirde semiconductor light emitting diode |
| 07/04/2012 | CN102544289A Method for roughening surface of epitaxial structure of gallium nitride-based light emitting diode |
| 07/04/2012 | CN102544288A Light-emitting diode for GaN-base material with epitaxial structure and preparation method for light-emitting diode |
| 07/04/2012 | CN102544287A Photoelectric element and manufacturing method thereof |
| 07/04/2012 | CN102544286A III-nitride light emitting devices grown on templates to reduce strain |
| 07/04/2012 | CN102544285A Nitride light-emitting device for improving light-emitting efficiency by electron barrier layer |
| 07/04/2012 | CN102544284A LED structure and manufacturing method thereof |
| 07/04/2012 | CN102544283A Light emitting diode array chip structure and preparation method thereof |
| 07/04/2012 | CN102544282A Nitride semiconductor substrate and method for manufacturing same |
| 07/04/2012 | CN102544281A Gallium nitride-based LED with multi-layer potential barrier structure |
| 07/04/2012 | CN102544280A Inorganic-quantum-dot near infrared photoluminescence device and preparation method therefor |
| 07/04/2012 | CN102544279A LED (Light Emitting Diode) and manufacturing method thereof |
| 07/04/2012 | CN102544278A Multi quantum well structure and manufacture method thereof |
| 07/04/2012 | CN102544277A Light emitting device and lighting system having the same |
| 07/04/2012 | CN102544276A Non-polar GaN thin film grown on LiGaO2 substrate, as well as manufacturing method and application thereof |
| 07/04/2012 | CN102544275A Strained germanium device with suspended film structure and preparation method thereof |
| 07/04/2012 | CN102544274A Wafer substrate bonding structure, light emitting device and method for manufacturing the same |
| 07/04/2012 | CN102544273A Light-emitting diode chip structure and fabrication method thereof |
| 07/04/2012 | CN102544272A Light emitting diode chip and manufacturing method thereof |
| 07/04/2012 | CN102544271A Method for growing high-quality gallium nitride epitaxial structure by using two nucleating layers |
| 07/04/2012 | CN102544270A Method for preparing inverted trapezoidal gallium-nitride-based light emitting diode |
| 07/04/2012 | CN102544269A Manufacturing method for LED chip with micro-cylinder lens array patterns on side wall |
| 07/04/2012 | CN102544268A Surface treatment method for semiconductor LED |
| 07/04/2012 | CN102544267A Wafer level phosphor coating method and devices fabricated utilizing method |
| 07/04/2012 | CN102544266A Manufacture method of high-lighting-effect white-light light-emitting diode (LED) inversion chip |
| 07/04/2012 | CN102544265A LED outputting narrow-band notch filtering light and preparation method thereof |
| 07/04/2012 | CN102544264A Method for preparing nano patterns on sapphire substrate |
| 07/04/2012 | CN102544263A Method for packaging rare earth fluorescent powder 360-degree multi-group and multi-stage light-emitting diode (LED) |
| 07/04/2012 | CN102544262A LED (light-emitting diode) chip packaging process |
| 07/04/2012 | CN102544261A Manufacturing method of LED (light-emitting diode) chip |
| 07/04/2012 | CN102544260A Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
| 07/04/2012 | CN102544259A LED light spot improving method |
| 07/04/2012 | CN102544258A Light-emitting device and producing method thereof |
| 07/04/2012 | CN102544257A Resin dispensing apparatus method of manufacturing light emitting device package using same |
| 07/04/2012 | CN102544256A Vertical structure light emitting diode (LED) and method of manufacturing the same |
| 07/04/2012 | CN102544255A Apparatus for measuring optical properties of led package |
| 07/04/2012 | CN102544254A Equipment for automatically cutting and detecting appearance and electric property of light-emitting diode (LED) lamp semi-finished products |
| 07/04/2012 | CN102544253A Method for manufacturing light emitting device, light emitting device, light emitting element substrate, and quality management method |
| 07/04/2012 | CN102544252A Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
| 07/04/2012 | CN102544251A Manufacturing method of large-power vertical light-emitting diode |
| 07/04/2012 | CN102544250A Manufacturing method of GaN-based light-emitting diode |
| 07/04/2012 | CN102544249A Light emitting diode crystal grains and manufacturing method thereof |
| 07/04/2012 | CN102544248A Manufacturing method for light emitting diode grain |
| 07/04/2012 | CN102544247A Production method of semiconductor luminous chip |
| 07/04/2012 | CN102544246A Method for manufacturing light emitting diode (LED) grains |
| 07/04/2012 | CN102544245A LED packaging method and structure |
| 07/04/2012 | CN102544244A Preparation method of LED component |
| 07/04/2012 | CN102544048A High-power GaN-base light-emitting diode and manufacturing method thereof |
| 07/04/2012 | CN102544047A Self-luminous display and manufacture method for same |
| 07/04/2012 | CN102543989A LED(light-emitting diode)device |
| 07/04/2012 | CN102543988A Metal supporting vertical structure fluorescent powderless white light LED |
| 07/04/2012 | CN102543987A Solid-state light-emitting component |
| 07/04/2012 | CN102543986A Light-emitting diode device |
| 07/04/2012 | CN102543985A Semiconductor packaging device and semiconductor substrate structure thereof |
| 07/04/2012 | CN102543984A Light-emitting device package and method of manufacturing the same |
| 07/04/2012 | CN102543983A LED integrated light source |
| 07/04/2012 | CN102543982A Light-Emitting Device And Manufacturing Method |
| 07/04/2012 | CN102543981A Light emitting diode package and manufacturing method thereof |
| 07/04/2012 | CN102543980A Led package structure and fabrication method thereof |
| 07/04/2012 | CN102543979A Heat radiation type light-emitting diode module |
| 07/04/2012 | CN102543978A Refrigeration type light-emitting diode module |
| 07/04/2012 | CN102543977A Light-emitting diode module with enhanced heat radiation |
| 07/04/2012 | CN102543976A Light-emitting diode heat-radiating module |
| 07/04/2012 | CN102543975A Light-emitting diode module for forming white light and improving heat radiation efficiency |
| 07/04/2012 | CN102543974A High voltage light-emitting diode (LED) |
| 07/04/2012 | CN102543901A Sealing member, sealing method, and method for producing optical semiconductor device |
| 07/04/2012 | CN102543801A Die bonder |
| 07/04/2012 | CN102543708A Wafer splitting apparatus and wafer splitting process |
| 07/04/2012 | CN102540759A Photolithographic led fabrication using phase-shift mask |
| 07/04/2012 | CN102540721A Photoresist composition and method for preparing fluorescent layer on surface of light emitting diode (LED) |
| 07/04/2012 | CN102537852A LED light source using optical glass filter |
| 07/04/2012 | CN102537740A GCOB (GdCa4O(BO3)3) high-brightness integration plane light source |
| 07/04/2012 | CN102537727A Convenient and safe LED (light-emitting diode) lamp and manufacturing method thereof |
| 07/04/2012 | CN102537718A Lamp with light source integrated with radiator and manufacturing method of lamp |
| 07/04/2012 | CN102537717A Light emitting device |
| 07/04/2012 | CN102533264A Method for preparing nitride phosphors and light emitting device |
| 07/04/2012 | CN102533261A Preparing method and application of red light materials based on ZnO doped with Co |
| 07/04/2012 | CN102533158A Pressure-sensitive adhesive and pressure-sensitive adhesive tape, and preparation method thereof |
| 07/04/2012 | CN102532957A Heat-conductive insulation filling and preparation method thereof |
| 07/04/2012 | CN102532916A Method for curing a silicone resin composition, a cured object,and a semiconductor device |
| 07/04/2012 | CN102532915A Low gas permeable silicone resin composition and optoelectronic device |
| 07/04/2012 | CN102532900A Organosilicon lens material for power type light-emitting diode (LED) packaging |
| 07/04/2012 | CN102532552A Silicone resin, sealing material, and optical semiconductor device |
| 07/04/2012 | CN102532488A Transparent silicone epoxy composition |
| 07/04/2012 | CN102529420A Monolithic semiconductor component with semiconductor films |
| 07/04/2012 | CN102528290A Method for processing optical device unit |
| 07/04/2012 | CN102163658B LED (light-emitting diode) device with multiple chip suction nozzles |
| 07/04/2012 | CN102157632B Method for improving luminous efficiency of LED (light-emitting diode) by utilizing ZnO nano-cone array |
| 07/04/2012 | CN102130229B Method for improving electroluminescent performance of n-ZnO/AlN/p-GaN heterojunction light-emitting diode |
| 07/04/2012 | CN102097548B Method for preparing self-supported GaN-based light emitting diode |
| 07/04/2012 | CN102082159B Nanoscale point light source based on graphene and preparation method thereof |
| 07/04/2012 | CN102044621B Wafer-level glass ball cavity package method for light emitting diode flip chip |
| 07/04/2012 | CN101996984B Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof |
| 07/04/2012 | CN101984509B Method for forming blue LED flip chip |
| 07/04/2012 | CN101937967B Light-emitting diode, light-emitting device and manufacturing method thereof |
| 07/04/2012 | CN101924021B Semiconductor device, as well as manufacture method and luminescent device thereof |
| 07/04/2012 | CN101911321B Semiconductor light emitting device |
| 07/04/2012 | CN101878545B Led having current spreading layer |
| 07/04/2012 | CN101872817B Light-emitting diode packaging structure and manufacturing method thereof |