Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2012
09/27/2012US20120241966 Integrated circuit packaging system with plated leads and method of manufacture thereof
09/27/2012US20120241965 Solder in cavity interconnection structures
09/27/2012US20120241964 Integrated circuit packaging system with interconnects and method of manufacture thereof
09/27/2012US20120241963 Self-aligned silicide formation on source/drain through contact via
09/27/2012US20120241962 Integrated circuit packaging system with lead frame etching and method of manufacture thereof
09/27/2012US20120241961 Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
09/27/2012US20120241959 Magnetic integration double-ended converter
09/27/2012US20120241956 Techniques for packaging multiple device components
09/27/2012US20120241955 Chip scale package assembly in reconstitution panel process format
09/27/2012US20120241954 Unpackaged and packaged IC stacked in a system-in-package module
09/27/2012US20120241951 Wafer bumping using printed under bump metalization
09/27/2012US20120241950 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
09/27/2012US20120241949 Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
09/27/2012US20120241948 Integrated circuit packaging system with pads and method of manufacture thereof
09/27/2012US20120241947 Integrated circuit packaging system with locking interconnects and method of manufacture thereof
09/27/2012US20120241946 Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
09/27/2012US20120241945 Semiconductor Device and Method of Forming Flipchip Interconnect Structure
09/27/2012US20120241943 Diamond Particle Mololayer Heat Spreaders and Associated Methods
09/27/2012US20120241942 Semiconductor device and method of manufacturing the same
09/27/2012US20120241941 Semiconductor Device and Method of Forming a Thermally Reinforced Semiconductor Die
09/27/2012US20120241939 Apparatus for Thermally Enhanced Semiconductor Package
09/27/2012US20120241936 Integrated circuit packaging system with package-on-package and method of manufacture thereof
09/27/2012US20120241934 Semiconductor apparatus and method for manufacturing the same
09/27/2012US20120241931 Integrated circuit packaging system with interconnects and method of manufacture thereof
09/27/2012US20120241929 Leadframe-based mold array package heat spreader and fabrication method therefor
09/27/2012US20120241928 Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
09/27/2012US20120241927 Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
09/27/2012US20120241926 Integrated circuit packaging system with leveling standoff and method of manufacture thereof
09/27/2012US20120241925 Integrated circuit packaging system with an interposer substrate and method of manufacture thereof
09/27/2012US20120241923 Ic wafer having electromagnetic shielding effects and method for making the same
09/27/2012US20120241922 Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof
09/27/2012US20120241921 Integrated circuit packaging system with interposer shield and method of manufacture thereof
09/27/2012US20120241920 Edge bead removal for polybenzoxazole (pbo)
09/27/2012US20120241919 Method for manufacturing semiconductor device, and semiconductor device
09/27/2012US20120241918 Process for the realization of islands of at least partially relaxed strained material
09/27/2012US20120241916 Wafer edge conditioning for thinned wafers
09/27/2012US20120241915 Semiconductor Device and Method of Forming Leadframe With Notched Fingers for Stacking Semiconductor Die
09/27/2012US20120241914 Reduction of fluorine contamination of bond pads of semiconductor devices
09/27/2012US20120241912 Thermal treatment method of silicon wafer and silicon wafer
09/27/2012US20120241910 Semiconductor memory device and method for manufacturing same
09/27/2012US20120241909 Low-Leakage, High-Capacitance Capacitor Structures and Method of Making
09/27/2012US20120241907 Ferroelectric capacitor encapsulated with a hydrogen barrier
09/27/2012US20120241905 Substrate isolation structure
09/27/2012US20120241902 Self-aligned dual depth isolation and method of fabrication
09/27/2012US20120241901 Package interconnects
09/27/2012US20120241900 Self detection device for high voltage esd protection
09/27/2012US20120241897 Semiconductor system including a schottky diode
09/27/2012US20120241885 Magnetic devices and structures
09/27/2012US20120241882 Semiconductor memory device and method for fabricating the same
09/27/2012US20120241880 Magnetic memory and manufacturing method thereof
09/27/2012US20120241879 Magnetic random access memory and method of fabricating the same
09/27/2012US20120241878 Magnetic tunnel junction with iron dusting layer between free layer and tunnel barrier
09/27/2012US20120241876 System and method for improving frequency response
09/27/2012US20120241875 Field-effect transistor and method of manufacturing the same
09/27/2012US20120241874 Gate oxide film including a nitride layer deposited thereon and method of forming the gate oxide film
09/27/2012US20120241873 Semiconductor device
09/27/2012US20120241871 Integrating transistors with different poly-silicon heights on the same die
09/27/2012US20120241870 Bipolar junction transistor with surface protection and manufacturing method thereof
09/27/2012US20120241868 Metal-gate cmos device
09/27/2012US20120241867 Non-volatile semiconductor memory device and a manufacturing method thereof
09/27/2012US20120241866 Transistor structure and manufacturing method which has channel epitaxial equipped with lateral epitaxial structure
09/27/2012US20120241864 Shallow Source and Drain Architecture in an Active Region of a Semiconductor Device Having a Pronounced Surface Topography by Tilted Implantation
09/27/2012US20120241863 Fin field-effect transistor structure and manufacturing process thereof
09/27/2012US20120241862 Ldmos device and method for making the same
09/27/2012US20120241861 Ultra-High Voltage N-Type-Metal-Oxide-Semiconductor (UHV NMOS) Device and Methods of Manufacturing the same
09/27/2012US20120241857 Dual stress device and method
09/27/2012US20120241854 Semiconductor device and method for manufacturing same
09/27/2012US20120241852 Semiconductor device and method for manufacturing same
09/27/2012US20120241851 Semiconductor device and method for manufacturing same
09/27/2012US20120241849 Semiconductor device and method for manufacturing same
09/27/2012US20120241848 Semiconductor element and method of manufacturing semiconductor element
09/27/2012US20120241846 Nonvolatile semiconductor memory device and method of manufacturing the same
09/27/2012US20120241845 Semiconductor device and semiconductor device manufacturing method
09/27/2012US20120241844 Nonvolatile semiconductor memory device and method for manufacturing same
09/27/2012US20120241843 Nonvolatile semiconductor memory device and method for manufacturing same
09/27/2012US20120241842 Nonvolatile semiconductor memory device and method for manufacturing same
09/27/2012US20120241841 Nonvolatile semiconductor memory device and method of fabricating the same
09/27/2012US20120241840 Nonvolatile memory device and method for fabricating the same
09/27/2012US20120241838 Semiconductor storage device and method for manufacturing the same
09/27/2012US20120241836 Semiconductor device and method of manufacturing same
09/27/2012US20120241834 Semiconductor device and method of manufacturing the same
09/27/2012US20120241833 Nonvolatile semiconductor storage device and method for manufacturing the same
09/27/2012US20120241829 Low Leakage Capacitor for Analog Floating-Gate Integrated Circuits
09/27/2012US20120241828 Semiconductor memory device and manufacturing method thereof
09/27/2012US20120241822 Semiconductor device, distortion gauge, pressure sensor, and method of manufacturing semiconductor device
09/27/2012US20120241821 Heterostructure for electronic power components, optoelectronic or photovoltaic components
09/27/2012US20120241816 Stabilization of Metal Silicides in PFET Transistors by Incorporation of Stabilizing Species in a Si/Ge Semiconductor Material
09/27/2012US20120241815 Semiconductor devices and methods of fabricating the same
09/27/2012US20120241787 Light emitting device and fabrication method thereof
09/27/2012US20120241767 Sic semiconductor element and manufacturing method for same
09/27/2012US20120241763 Electronic field effect devices and methods for their manufacture
09/27/2012US20120241761 Semiconductor device and method for manufacturing same
09/27/2012US20120241758 Compound semiconductor device and manufacturing method thereof
09/27/2012US20120241755 method for reducing internal mechanical stresses in a semiconductor structure and a low mechanical stress semiconductor structure
09/27/2012US20120241753 Semiconductor device and method for manufacturing same
09/27/2012US20120241751 Nitride semiconductor device and method for manufacturing same
09/27/2012US20120241750 Semiconductor device and method for producing same
09/27/2012US20120241749 Semiconductor device including semiconductor circuit made from semiconductor element and manufacturing method thereof
09/27/2012US20120241742 Thinned semiconductor components having lasered features and method of fabrication
09/27/2012US20120241738 Semiconductor device and manufacturing method thereof