Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2012
09/27/2012US20120244722 Selective crystallization method and laser crystallization apparatus used in the selective crystallization method
09/27/2012US20120244721 Film forming method, film forming apparatus, and storage medium
09/27/2012US20120244720 Processing method and storage medium
09/27/2012US20120244719 Imprint method, imprinting equipment, and method for manufacturing semiconductor device
09/27/2012US20120244718 Substrate processing method and storage medium
09/27/2012US20120244717 Resin removal method, resin removal apparatus, and method of manufacturing semiconductor device
09/27/2012US20120244716 Substrate processing method and storage medium
09/27/2012US20120244715 High-selectivity etching system and method
09/27/2012US20120244714 Exposure mask and method for manufacturing same and method for manufacturing semiconductor device
09/27/2012US20120244713 Method for fabricating semiconductor device
09/27/2012US20120244712 Manufacturing method of semiconductor device
09/27/2012US20120244711 Sidewall image transfer process
09/27/2012US20120244710 Shrinkage of Critical Dimensions in a Semiconductor Device by Selective Growth of a Mask Material
09/27/2012US20120244709 Plasma etching method and storage medium
09/27/2012US20120244708 Methods Of Patterning Materials
09/27/2012US20120244707 Method of correcting mask pattern, computer program product, mask pattern correcting apparatus, and method of manufacturing semiconductor device
09/27/2012US20120244706 Chemical mechanical polishing method
09/27/2012US20120244705 Post-tungsten cmp cleaning solution and method of using the same
09/27/2012US20120244704 Method for removing oxides
09/27/2012US20120244703 Tray for cvd and method for forming film using same
09/27/2012US20120244702 Method for printing a substrate
09/27/2012US20120244701 Method for forming nisi film, method for forming silicide film, method for forming metal film for use in silicide-annealing, apparatus for vacuum processing and film-forming apparatus
09/27/2012US20120244700 Methods for fabricating semiconductor devices including metal silicide
09/27/2012US20120244699 Atomic layer deposition of tungsten materials
09/27/2012US20120244698 Methods for forming copper diffusion barriers for semiconductor interconnect structures
09/27/2012US20120244697 Method for fabricating a semiconductor device
09/27/2012US20120244696 Method of manufacturing semiconductor device
09/27/2012US20120244695 Method for fabricating flash memory device and floating gate therein
09/27/2012US20120244694 Manufacturing method of semiconductor integrated circuit device
09/27/2012US20120244693 Method for patterning a full metal gate structure
09/27/2012US20120244692 Integrated shadow mask/carrier for pattern ion implantation
09/27/2012US20120244691 Ion implantation method and ion implantation apparatus
09/27/2012US20120244690 Ion implanted resist strip with superacid
09/27/2012US20120244689 Schottky diode with control gate for optimization of the on state resistance, the reverse leakage, and the reverse breakdown
09/27/2012US20120244688 Selective epitaxial formation of semiconductive films
09/27/2012US20120244687 Method of manufacturing a base substrate for a semi-conductor on insulator type substrate
09/27/2012US20120244686 Method for fabricating semiconductor device
09/27/2012US20120244685 Manufacturing Apparatus and Method for Semiconductor Device
09/27/2012US20120244684 Film-forming apparatus and method
09/27/2012US20120244683 Manufacturing method of semiconductor element
09/27/2012US20120244682 Wafer dividing method
09/27/2012US20120244681 Semiconductor die singulation method
09/27/2012US20120244680 Method of manufacturing semiconductor device
09/27/2012US20120244679 Method for producing bonded wafer
09/27/2012US20120244678 Semiconductor device wafer bonding method
09/27/2012US20120244677 Method and apparatus for selectively removing anti-stiction coating
09/27/2012US20120244676 Semiconducture structure and method of forming the semiconductor structure that provides two individual resistors or a capacitor
09/27/2012US20120244675 Method for forming metal gate
09/27/2012US20120244674 Methods for fabricating semiconductor devices
09/27/2012US20120244673 Method for manufacturing semiconductor device
09/27/2012US20120244672 Method for manufacturing semiconductor device
09/27/2012US20120244671 Unitary Floating-Gate Electrode with Both N-Type and P-Type Gates
09/27/2012US20120244670 Methods of fabricating semiconductor devices
09/27/2012US20120244669 Method of Manufacturing Semiconductor Device Having Metal Gates
09/27/2012US20120244668 Semiconductor devices with layout controlled channel and associated processes of manufacturing
09/27/2012US20120244667 Precursor composition for oxide semiconductor and method of manufacturing thin film transistor array panel using the same
09/27/2012US20120244666 Printed substrate manufacturing equipment and manufacturing method
09/27/2012US20120244665 Method of manufacturing semiconductor device
09/27/2012US20120244664 Reducing warpage for fan-out wafer level packaging
09/27/2012US20120244663 Semiconductor device chip mounting method
09/27/2012US20120244662 Board on chip package substrate and manufacturing method thereof
09/27/2012US20120244661 Method of Fabricating Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die
09/27/2012US20120244660 Method for manufacturing semiconductor device
09/27/2012US20120244659 Method for forming oxide semiconductor film and method for manufacturing semiconductor device
09/27/2012US20120244658 Method for manufacturing semiconductor device
09/27/2012US20120244655 Backgrind process for integrated circuit wafers
09/27/2012US20120244649 Polishing method, polishing apparatus and polishing tool
09/27/2012US20120244648 Manufacturing method of semiconductor device
09/27/2012US20120244647 Pick-Up Method of Die Bonder and Die Bonder
09/27/2012US20120244646 Manufacturing method of semiconductor device and adjusting apparatus
09/27/2012US20120244645 Electrostatic post exposure bake apparatus and method
09/27/2012US20120244644 System and Method for Increasing Productivity of Organic Light Emitting Diode Material Screening
09/27/2012US20120244642 Semiconductor device and method of manufacturing the same
09/27/2012US20120244641 Method for manufacturing semiconductor device
09/27/2012US20120243772 Method for extracting contour of pattern on photo mask, contour extraction apparatus, method for guaranteeing photo mask, and method for manufacturing semiconductor device
09/27/2012US20120243573 Plasma processing apparatus and temperature measuring method
09/27/2012US20120243358 Semiconductor device and method of manufacturing the same
09/27/2012US20120243348 Method and Apparatus of Changing Device Identification Codes of a Memory Integrated Circuit Device
09/27/2012US20120243337 P-/metal floating gate non-volatile storage element
09/27/2012US20120243292 Memory device
09/27/2012US20120243155 Conductive metal nub for enhanced electrical interconnection, and information handling system utilizing same
09/27/2012US20120243095 Configurable micromechanical diffractive element with anti stiction bumps
09/27/2012US20120242627 Amorphous oxide semiconductor thin film transistor fabrication method
09/27/2012US20120242624 Thin film transistor and method for fabricating the same, semiconductor device and method for fabricating the same, as well as display
09/27/2012US20120242356 Specific contact resistivity measurement method, semiconductor device for specific contact resistivity measurement, and method for manufacturing the same
09/27/2012US20120241985 Semiconductor chip with supportive terminal pad
09/27/2012US20120241984 Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die
09/27/2012US20120241983 Integrated circuit packaging system with a flip chip and method of manufacture thereof
09/27/2012US20120241982 Packaged semiconductor assemblies and methods for manufacturing such assemblies
09/27/2012US20120241981 Semiconductor device and method for manufacturing same
09/27/2012US20120241980 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
09/27/2012US20120241979 Integrated circuit packaging system with step mold and method of manufacture thereof
09/27/2012US20120241978 Semiconductor device and method of manufacturing the same
09/27/2012US20120241977 Configurable interposer
09/27/2012US20120241975 Method for decomposing lines of an electronic circuit
09/27/2012US20120241973 Integrated circuit packaging system with filled vias and method of manufacture thereof
09/27/2012US20120241972 Layout scheme for an input output cell
09/27/2012US20120241970 Semiconductor device
09/27/2012US20120241968 Integrated circuit packaging system with interconnects and method of manufacture thereof
09/27/2012US20120241967 Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof
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