Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/03/2012CN202473880U Hydraulic buffer apparatus for pipe P dolly
10/03/2012CN202473879U Silicon wafer loading platform
10/03/2012CN202473878U Silicon chip bearing frame
10/03/2012CN202473877U Fixing device of substrate of two-sided attached device
10/03/2012CN202473876U Nozzle fixing base
10/03/2012CN202473875U Feeder anti-blocking device of adhesion equipment
10/03/2012CN202473874U A plastic packaging and strip cutting device with improved disassembling structure of a cover plate
10/03/2012CN202473873U Hot plate device used for heat treatment of wafer
10/03/2012CN202473872U Solar cell module electroluminescence (EL) tester
10/03/2012CN202473871U Measurement device for surface evenness of wafer
10/03/2012CN202473870U Technological parameter test wafer
10/03/2012CN202473869U Cylindrical bump packaging composition
10/03/2012CN202473868U Mechanism motion system and energy-absorbing buffer apparatus thereof
10/03/2012CN202473867U Linear motor loading machine
10/03/2012CN202473866U Packaging die for semiconductor
10/03/2012CN202473865U A material-holding device of a semiconductor plastic-packing sheet-arranging system
10/03/2012CN202473864U Material dragging device for semiconductor plastic package arranging system
10/03/2012CN202473863U Multi-chip mini-type packaging mould molding block of high-precision integrated circuit board
10/03/2012CN202473862U Mould forming block for high precision integrated circuit four-side pin in-line package
10/03/2012CN202473861U Dual in-line type high-power high-precision integrated circuit package module
10/03/2012CN202473860U High-precision integrated circuit packaging module of spherical contact array patch
10/03/2012CN202473859U Quad-flat leaded high-precision integrated circuit package module with cushion
10/03/2012CN202473858U High-frequency multi-chipset high-precision integrated circuit package module
10/03/2012CN202473857U Ultra-thin multichip high-precision integrated-circuit package module
10/03/2012CN202473856U A tube ejecting device
10/03/2012CN202473855U BGA (ball grid array) mini-solder-ball preparation device
10/03/2012CN202473854U Automatic buffer liquid charging device
10/03/2012CN202473853U Source bottle for diffusion
10/03/2012CN202473852U Uniform flow plate capable of changing atmosphere field
10/03/2012CN202473851U Hot plate device preventing wafer from overlapping
10/03/2012CN202473834U Connection bayonet for inductance coupling plasma processing device
10/03/2012CN202465866U Bearing device for double-side chemical vapor deposition of solar cell
10/03/2012CN202464770U Gripped-in-palm-type suction pen
10/03/2012CN202462494U Feeding device for semiconductor and IC plastic package trimming rib
10/03/2012CN202462224U Finishing plate, finisher of polishing pad, and polishing device
10/03/2012CN1937175B Method for depositing material atomic layer for semiconductor device by using atmosphere
10/03/2012CN1921072B Method for etching high dielectric constant materials
10/03/2012CN1918672B Thin-film transistor and thin-film transistor substrate, sputtering target, transparent conductive film and transparency electrode, and production methods thereof
10/03/2012CN1877799B 半导体器件以及其制作方法 Semiconductor device and manufacturing method thereof
10/03/2012CN1784487B Non-aqueous, non-corrosive microelectronic cleaning compositions
10/03/2012CN1674300B Transistor with shallow germanium implantation region in channel
10/03/2012CN1442752B Anticorrosion image improved material
10/03/2012CN102714921A Method for soldering surface-mount component and surface-mount component
10/03/2012CN102714920A Heating device and production method for mounted body
10/03/2012CN102714913A Plasma source design
10/03/2012CN102714496A 半导体装置 Semiconductor device
10/03/2012CN102714278A Device, thin film transistor, method for manufacturing the device and method for manufacturing the thin film transistor
10/03/2012CN102714256A Semiconductor light emitting device with layer compensating for the thermal expansion of the substrate
10/03/2012CN102714228A Manufacture of thin film solar cells with high conversion efficiency
10/03/2012CN102714226A Pin diode
10/03/2012CN102714225A Junction field effect transistor and method of manufacturing the same
10/03/2012CN102714223A Oxide-nitride-oxide stack having multiple oxynitride layers
10/03/2012CN102714222A A body-tied asymmetric n-type field effect transistor
10/03/2012CN102714221A Circuit board, display device, and process for production of circuit board
10/03/2012CN102714219A Reverse side engineered III-nitride devices
10/03/2012CN102714218A Punch-through semiconductor device and method for producing same
10/03/2012CN102714209A 半导体存储器件及其驱动方法 Semiconductor memory device and driving method
10/03/2012CN102714208A 半导体装置 Semiconductor device
10/03/2012CN102714206A ESD protection device and method
10/03/2012CN102714194A Method and system for exposing delicate structures of a device encapsulated in a mold compound
10/03/2012CN102714189A Integrated void fill for through silicon via
10/03/2012CN102714188A Semiconductor module manufacturing method
10/03/2012CN102714186A Film for forming semiconductor protection film, and semiconductor device
10/03/2012CN102714185A Cross-point diode arrays and methods of manufacturing cross-point diode arrays
10/03/2012CN102714184A 半导体器件 Semiconductor devices
10/03/2012CN102714183A Semiconductor device having strain material
10/03/2012CN102714182A Semiconductor device and method of manufacturing thereof
10/03/2012CN102714181A Semiconductor device
10/03/2012CN102714180A Nonvolatile latch circuit and logic circuit, and semiconductor device using the same
10/03/2012CN102714179A Multi-gate III-V quantum well structures
10/03/2012CN102714178A Systems and methods employing a physically asymmetric semiconductor device having symmetrical electrical behavior
10/03/2012CN102714177A Field-effect transistor device having a metal gate stack with an oxygen barrier layer
10/03/2012CN102714176A Electronic device and method for manufacturing electronic device
10/03/2012CN102714175A 半导体装置 Semiconductor device
10/03/2012CN102714174A Punch singulation system and method
10/03/2012CN102714173A Tunnel junction via
10/03/2012CN102714172A Mounting table structure, and processing device
10/03/2012CN102714171A Transfer robot with substrate cooling
10/03/2012CN102714170A Processing system
10/03/2012CN102714169A Substrate storing device
10/03/2012CN102714168A Load lock chamber, substrate processing system and method for venting
10/03/2012CN102714167A Passive capacitively-coupled electrostatic (CCE) probe arrangement for detecting in-situ arcing events in a plasma processing chamber
10/03/2012CN102714166A Processing method and processing device for semiconductor element
10/03/2012CN102714165A Method for applying liquid material, application device and programme
10/03/2012CN102714164A Semiconductor device and method for manufacturing same
10/03/2012CN102714163A Method for improving plating on non-concuctive substrates
10/03/2012CN102714162A Epitaxially laminated III-nitride substrate
10/03/2012CN102714161A A body-tied asymmetric P-type field effect transistor
10/03/2012CN102714160A Method for manufacturing thin-film transistor device, thin-film transistor, and display device
10/03/2012CN102714159A Nickel-silicide formation with differential Pt composition
10/03/2012CN102714158A Silicon oxide film forming method, and plasma oxidation apparatus
10/03/2012CN102714157A Spin-on formulation and method for stripping an ion implanted photoresist
10/03/2012CN102714156A In-situ ozone cure for radical-component CVD
10/03/2012CN102714155A Method and apparatus for pattern collapse free wet processing of semiconductor devices
10/03/2012CN102714154A Variable Pressure Brush/Pad
10/03/2012CN102714153A Device and process for liquid treatment of a wafer shaped article
10/03/2012CN102714152A Functional element and manufacturing method of same
10/03/2012CN102714151A Adhesive sheet for semiconductor wafer processing
10/03/2012CN102714150A Laser lift off systems and methods
10/03/2012CN102714149A Apparatus and method for formation of low-temperature polysilicon film
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