Patents for C25F 3 - Electrolytic etching or polishing (4,256)
08/2004
08/26/2004DE10235020B4 Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben Apparatus and method for etching large-surface semiconductor wafers
08/25/2004EP1448811A1 Method and device for regenerating ion exchanger, and electrolytic processing apparatus
08/25/2004CN1523647A Apparatus for electropolishing metal interconnections on semiconductor devices
08/24/2004US6780772 Method and system to provide electroplanarization of a workpiece with a conducting material layer
08/24/2004US6779924 Dynamic pressure bearing and method of manufacturing the same
08/19/2004WO2004070088A1 Electrolytic solution formulation for electropolishing process
08/19/2004US20040159557 Contains abrasive particles and electrolyte; oxidation of metal film surface; preventing defects; wear resistance
08/19/2004US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices
08/18/2004EP1446514A1 Electropolishing assembly and methods for electropolishing conductive layers
08/18/2004EP1446355A2 Family of discretely sized silicon nanoparticles and method for producing the same
08/18/2004CN1521809A Anodizing apparatus, anodizing system, substrate processing apparatus and method
08/18/2004CN1521288A Process for the production of niobium or tantalum parts by electrochemical etching
08/17/2004US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode
08/17/2004US6776884 Electropolishing process means for inner and outer surfaces of a metal
08/12/2004US20040155010 Method for producing optically transparent regions in a silicon substrate
08/12/2004US20040154931 Polishing liquid, polishing method and polishing apparatus
08/12/2004US20040154828 Method and electrode for defining and replicating structures in conducting materials
08/11/2004EP1444722A2 Method and system to provide electrical contacts for electrotreating processes
08/10/2004US6774985 Apparatus imprinting stent configuration image from mask onto tubular blank with photosensitive coating including journaling mechanism receiving and rotating blank, radiation source directing light at surface to expose coating, mask mover
08/10/2004US6773576 Anode assembly for plating and planarizing a conductive layer
08/05/2004US20040149592 Electropolishing apparatus and polishing method
08/04/2004EP1443129A1 Method for treating a metallic workpiece
08/04/2004EP1442155A2 Method for the treatment of electrically conductive substrates and printed circuit boards and the like
08/03/2004US6770188 Part fabricating method
07/2004
07/28/2004EP1441049A1 Process for the production of niobium or tantalum parts by electrochemical etching
07/28/2004EP1439935A2 Electrochemical mechanical processing with advancible sweeper
07/28/2004CN1516894A Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
07/28/2004CN1516749A Electrochemically roughened aluminium semiconductor processing apparatus surface
07/28/2004CN1159756C Lead wire frame and its producing method
07/22/2004WO2004061165A1 Electrochemical process and apparatus
07/22/2004US20040140227 Method for etching layers deposited on transparent substrates such as glass substrate
07/14/2004CN1157505C Electrode structure, electrolytic etching process and apparatus using same
07/01/2004US20040123949 Method and apparatus for on-demand stencil chemical etch direct parts marking automation and carrier for chemical etch stencil mesh
06/2004
06/30/2004EP1432852A2 Electrolytic processing apparatus and method
06/29/2004US6756307 Apparatus for electrically planarizing semiconductor wafers
06/24/2004WO2004053972A1 Lead frame and the same manufacturing method using electroforming
06/24/2004DE10256821A1 Verfahren und Einrichtung zum photoelektrochemischen Ätzen einer Halbleiterprobe, insbesondere aus Galliumnitrid Method and apparatus for photo-electrochemical etching of a semiconductor sample, in particular of gallium nitride
06/22/2004US6752916 Electrochemical planarization end point detection
06/17/2004US20040112761 Method and device for regenerating ion exchanger, and electrolytic processing apparatus
06/10/2004US20040110386 Method and device for photo-electrochemically etching a semiconductor sample, especially gallium nitride
06/10/2004US20040108216 Method and apparatus for making very low roughness copper foil
06/10/2004US20040108021 For electrograining to provide lithographic plate support
06/09/2004EP1425948A2 A method of etching copper on cards
06/09/2004EP1425430A1 Ai alloy for lithographic sheet
06/09/2004EP1425067A2 Radioactive implantable devices and methods and apparatuses for their production and use
06/03/2004US20040104128 Filling concave portions formed on wafer surface; determining electropolishing end point of metal film in accordance with change of current waveform
06/02/2004EP1423868A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
06/01/2004US6743406 Gradually advancing silicon anode into hydrofluoric acid and hydrogen peroxide etchant solution; creating electrical current density to; immersing anode in dilute hydrofluoric acid solution; separating nanoparticles
06/01/2004US6743349 Electrochemical machining method and apparatus
05/2004
05/27/2004WO2004044273A1 Electropolishing system and process
05/26/2004CN1500158A Method for etching layers deposited on transparent substrates such as glass substrate
05/21/2004WO2004041477A1 Surface treatment method for vacuum member
05/21/2004WO2004006419A3 Monitoring apparatus and method for improving the accuracy and repeatability of electrochemical capacitance voltage (ecv) measurements
05/20/2004US20040097755 Ionic liquids and their use as solvents
05/20/2004US20040097070 Method of producing metal film
05/20/2004US20040094403 Integrated plating and planarization apparatus having a variable-diameter counterelectrode
05/19/2004EP1419523A1 Dummy structures to reduce metal recess in electropolishing process
05/19/2004CN1498289A Method of plating and pretreating aluminium workpieces
05/18/2004US6737360 Controlled potential anodic etching process for the selective removal of conductive thin films
05/18/2004US6736699 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
05/06/2004WO2003024172A8 A method of etching copper on cards
05/06/2004US20040087251 Semiconductor processing methods of removing conductive material
05/06/2004US20040084317 Periodic vibration of spatial position of cathode electrode, lamp, and/or targe substrate holder
05/06/2004EP1415016A1 Electrochemically roughened aluminum semiconductor processing apparatus surfaces
05/05/2004CN1494736A Anodization apparatus and method
04/2004
04/29/2004US20040080053 Electropolishing metal layers on wafers having trenches or vias with dummy structures
04/28/2004EP1051544B1 Process chamber and method for depositing and/or removing material on a substrate
04/27/2004US6726823 Assembly for holding wafer comprising wafer chuck having bottom section and spring member configured to apply electric charge to wafer disposed between bottom section and wafer, and actuator assembly configured to move wafer chuck
04/27/2004US6726815 Electrochemical etching cell
04/22/2004WO2004033384A1 Method and system for removing thin metal film
04/22/2004WO2003060963A3 Electrochemical edge and bevel cleaning process and system
04/22/2004WO2003030223A3 Substrate processing apparatus and method
04/22/2004WO2003029531A3 Electrolytic processing apparatus and method
04/21/2004EP1411151A1 METAL FOIL CONSISTING OF ALLOY OF EARTH−ACID METAL, AND CAPACITOR PROVIDED WITH THE SAME
04/21/2004CN1146966C Methods and appts. for electropolishing metal intennections on semiconductor devices
04/15/2004US20040072445 Effective method to improve surface finish in electrochemically assisted CMP
04/14/2004CN1489161A Method for removing residual copper of aluminium corroding foil surface of negative electrode for aluminium electrolytic capacitor
04/13/2004US6719892 Selective removal of brazing compound from joined assemblies
04/08/2004WO2004028673A1 Nanodevice for controlled charged particle flow and method for producing same
04/07/2004EP1404899A1 Method and electrode for defining and replicating structures in conducting materials
03/2004
03/30/2004US6712668 System and method for electropolishing nonuniform pipes
03/25/2004US20040055875 Nanodevice for charged particle flow and method for producing same
03/24/2004EP1399957A2 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
03/24/2004EP1399956A2 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
03/24/2004CN1483580A Integrated fluid component and mfg method thereof
03/18/2004US20040054231 Ionic liquids and their use
03/18/2004US20040053499 Method and composition for polishing a substrate
03/18/2004US20040050715 Electrolyte mixture of alkylene glycol and chloride salt; etching using hydrogen fluoride; recovering, reuse
03/11/2004WO2004020148A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/10/2004CN1480566A Electrochemical grind (polishing) method for stainless steel
03/09/2004US6702855 Osteophilic implants
03/04/2004US20040043608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
03/04/2004US20040043582 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
03/04/2004US20040040863 Dissolving, etching, polishing; using electrolytic cells
03/04/2004US20040040853 Systems and methods for the electrolytic removal of metals from substrates
03/03/2004EP1392889A1 Anode assembly and process for supplying electrolyte to a planar substrate surface
02/2004
02/26/2004WO2004017384A1 Device for etching semiconductors with a large surface area
02/25/2004EP1391541A1 Process for providing recesses in the surface of a workpiece, in particular for making micromolds
02/25/2004EP1390988A2 Method for producing optically transparent regions in a silicon substrate
02/24/2004US6695962 Used to deposit, polish, or electro-polish metal films on a substrate, or to remove such metal films from such a substrate
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